JP2006190948A - 平面型磁性インダクタ及びその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000004020 conductor Substances 0.000 claims abstract description 109
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 45
- 229920002120 photoresistant polymer Polymers 0.000 claims description 26
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 238000009713 electroplating Methods 0.000 claims description 20
- 239000010409 thin film Substances 0.000 claims description 18
- 229910000859 α-Fe Inorganic materials 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 239000000696 magnetic material Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 229910018605 Ni—Zn Inorganic materials 0.000 claims description 8
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 238000007641 inkjet printing Methods 0.000 claims description 5
- 239000002861 polymer material Substances 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 2
- 230000002950 deficient Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 239000000463 material Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000003313 weakening effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910005435 FeTaN Inorganic materials 0.000 description 1
- 229910001035 Soft ferrite Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
- H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
【解決手段】本発明による平面型磁性インダクタは、基板上に形成された絶縁性酸化物磁性層と、上記絶縁性酸化物磁性層の底面から離隔し上記絶縁性酸化物磁性層内に完全に埋め込まれている導電体コイルと、上記絶縁性酸化物磁性層上に形成され上記絶縁性磁性層を保護するカバー層とを含む。
【選択図】図3
Description
54 絶縁性酸化物磁性層
56 メッキシード層パターン
58 導電体コイル
60 カバー層
30 フォトレジスト層パターン
Claims (17)
- 基板上に形成された絶縁性酸化物磁性層と、
上記絶縁性酸化物磁性層の底面から離隔し上記絶縁性酸化物磁性層内に完全に埋め込まれている導電体コイルと、
上記絶縁性酸化物磁性層上に形成され上記絶縁性酸化物の磁性層を保護するカバー層とを含む平面型磁性インダクタ。 - 上記絶縁性酸化物層は、上記基板上に形成された下部絶縁性酸化物磁性層と、上記下部絶縁性酸化物磁性層と接して上記下部絶縁性酸化物磁性層上に形成された上部絶縁性酸化物磁性層とを含み、
上記導電体コイルは上記下部絶縁性酸化物磁性層上に形成され上記上部絶縁性酸化物磁性層により完全に埋め込まれる請求項1に記載の平面型磁性インダクタ。 - 上記絶縁性酸化物磁性層は、Fe、Ni、Zn、Mn、Mg、Co、Ba及びSrで成る群から選択された2個以上の元素を含む酸化物磁性材料から成る請求項1に記載の平面型磁性インダクタ。
- 上記絶縁性酸化物磁性層はNi‐Znフェライトから成る請求項3に記載の平面型磁性インダクタ。
- 上記絶縁性酸化物磁性層はフェライトメッキ法により形成された請求項1に記載の平面型磁性インダクタ。
- 上記カバー層は高分子材料、セラミック材料、ガラス、シリコンまたはそれらの中から2以上を含む複合材料から成る請求項1に記載の平面型磁性インダクタ。
- 上記カバー層はポリイミドから成る請求項6に記載の平面型磁性インダクタ。
- 上記導電体コイルは銅から成る螺旋形コイルである請求項1に記載の平面型磁性インダクタ。
- 上記導電体コイルの下に形成され上記導電体コイルと同一なパターン形状を有するメッキシード層パターンをさらに含み、
上記導電体コイルは電気メッキにより形成された請求項1に記載の平面型磁性インダクタ。 - 基板上に下部絶縁性酸化物磁性層を形成する段階と、
上記下部絶縁性酸化物磁性層上に導電体コイルを形成する段階と、
上記導電体コイルを完全に埋め込むよう上記導電体コイル上に直接上部絶縁性酸化物磁性層を形成する段階と、
上記上部絶縁性酸化物磁性層上にカバー層を形成する段階とを含む平面型磁性インダクタの製造方法。 - 上記上部及び下部絶縁性酸化物磁性層はFe、Ni、Zn、Mn、Mg、Co、Ba及びSrで成る群から選択された2個以上の元素を含む酸化物磁性材料から成る請求項10に記載の平面型磁性インダクタの製造方法。
- 上記導電体コイルを形成する段階は、電気メッキを利用して実行される請求項10に記載の平面型磁性インダクタの製造方法。
- 上記導電体コイルを形成する段階は、
上記下部絶縁性酸化物磁性層上にコイル形状のパターンを有するフォトレジスト層パターンを形成する段階と、
上記フォトレジスト層パターンを利用してコイル形状のメッキシード層パターンを形成する段階と、
電気メッキを施し上記メッキシード層パターン上に導電体コイルを形成する段階とを含む請求項12に記載の面型磁性インダクタの製造方法。 - 上記導電体コイルを形成する段階は、
上記下部絶縁性酸化物磁性層上にメッキシード層を形成する段階と、
上記メッキシード層上にコイル形状のパターンを有するフォトレジスト層モールドを形成する段階と、
上記フォトレジスト層モールドをマスクに利用して電気メッキを施すことにより導電体コイルを形成する段階と、
上記フォトレジスト層モールド及びその下のメッキシード層の部分を除去する段階とを含む請求項12に記載の平面型磁性インダクタの製造方法。 - 上記導電体コイルを形成する段階は、
上記下部絶縁性酸化物磁性層上に金属薄膜を圧着して付着する段階と、
コイルパターンが形成されるよう上記金属薄膜を選択的にドライエッチングする段階とを含む請求項10に記載の平面型磁性インダクタの製造方法。 - 上記導電体コイルを形成する段階は、
上記下部絶縁性酸化物磁性層上にコイルパターン用スクリーンを形成する段階と、
上記スクリーンを印刷マスクとして上記下部絶縁性酸化物磁性層上に導電性ペーストを印刷する段階とを含む請求項10に記載の平面型磁性インダクタの製造方法。 - 上記導電体コイルを形成する段階は、インクジェットプリンティング法を使用して上記下部絶縁性酸化物磁性層上にスラリー状態の導電性ペーストを印刷する段階を含む請求項10に記載の平面型磁性インダクタの製造方法。
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KR1020050001833A KR100665114B1 (ko) | 2005-01-07 | 2005-01-07 | 평면형 자성 인덕터의 제조 방법 |
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US (2) | US20060152321A1 (ja) |
JP (1) | JP2006190948A (ja) |
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CN (1) | CN1801412A (ja) |
Cited By (6)
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JP2011165808A (ja) * | 2010-02-08 | 2011-08-25 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
KR20140083579A (ko) * | 2012-12-26 | 2014-07-04 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
US9257216B2 (en) | 2011-10-14 | 2016-02-09 | Murata Manufacturing Co., Ltd. | Metal powder and electronic component |
JP2019129278A (ja) * | 2018-01-26 | 2019-08-01 | イビデン株式会社 | インダクタ部品の製造方法、インダクタ部品、部品内蔵配線基板 |
JP2021503718A (ja) * | 2017-11-16 | 2021-02-12 | ジョージア テック リサーチ コーポレイション | 磁性層を有する基板対応インダクタ |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1783789A1 (en) * | 2005-09-30 | 2007-05-09 | TDK Corporation | Thin film device and thin film inductor |
US7920043B2 (en) * | 2005-10-27 | 2011-04-05 | Kabushiki Kaisha Toshiba | Planar magnetic device and power supply IC package using same |
JP5390099B2 (ja) * | 2005-11-01 | 2014-01-15 | 株式会社東芝 | 平面磁気素子 |
US7723819B2 (en) * | 2006-09-28 | 2010-05-25 | Intel Corporation | Granular magnetic layer with planar insulating layer |
US20080157910A1 (en) * | 2006-12-29 | 2008-07-03 | Park Chang-Min | Amorphous soft magnetic layer for on-die inductively coupled wires |
US20080157911A1 (en) * | 2006-12-29 | 2008-07-03 | Fajardo Arnel M | Soft magnetic layer for on-die inductively coupled wires with high electrical resistance |
EP1981042A1 (en) * | 2007-03-28 | 2008-10-15 | Heraeus, Inc. | Inductive devices with granular magnetic materials |
WO2008152641A2 (en) * | 2007-06-12 | 2008-12-18 | Advanced Magnetic Solutions Ltd. | Magnetic induction devices and methods for producing them |
TW200905703A (en) * | 2007-07-27 | 2009-02-01 | Delta Electronics Inc | Magnetic device and manufacturing method thereof |
DE202009001959U1 (de) * | 2009-03-11 | 2010-07-29 | Kunststoffinstitut für die mittelständische Wirtschaft NRW GmbH | Formwerkzeug |
EP2661757A1 (en) | 2011-01-04 | 2013-11-13 | ÅAC Microtec AB | Coil assembly comprising planar coil |
US8314676B1 (en) * | 2011-05-02 | 2012-11-20 | National Semiconductor Corporation | Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductors |
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CN104936379A (zh) * | 2015-07-01 | 2015-09-23 | 电子科技大学 | 一种印制电路板埋嵌磁芯电感的制备方法 |
KR101751117B1 (ko) * | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
US10813744B2 (en) | 2015-09-03 | 2020-10-27 | Greatbatch Ltd. | Rechargeable intraocular implant |
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US11324120B2 (en) * | 2017-03-08 | 2022-05-03 | Sumitomo Electric Printed Circuits, Inc. | Flexible printed circuit board |
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US11495555B2 (en) * | 2018-03-14 | 2022-11-08 | Intel Corporation | Magnetic bilayer structure for a cored or coreless semiconductor package |
JP7229706B2 (ja) * | 2018-09-05 | 2023-02-28 | 新光電気工業株式会社 | インダクタ及びその製造方法 |
JP7325197B2 (ja) * | 2019-03-12 | 2023-08-14 | 日東電工株式会社 | インダクタ |
EP4093162A1 (en) * | 2021-05-18 | 2022-11-23 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | A component carrier with a magnetic element, and manufacturing method |
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Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63283004A (ja) | 1987-05-14 | 1988-11-18 | Matsushita Electric Ind Co Ltd | 平面インダクタならびにその製造方法 |
JPH07101652B2 (ja) | 1988-11-01 | 1995-11-01 | 株式会社村田製作所 | 高周波コイルの製造方法 |
JPH07213027A (ja) | 1994-01-17 | 1995-08-11 | Fuji Electric Co Ltd | 薄膜コイルの製造方法 |
JPH09232174A (ja) | 1996-02-23 | 1997-09-05 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
US6207234B1 (en) * | 1998-06-24 | 2001-03-27 | Vishay Vitramon Incorporated | Via formation for multilayer inductive devices and other devices |
JP2000182872A (ja) | 1998-12-17 | 2000-06-30 | Tdk Corp | チップインダクタの製造方法およびチップインダクタ |
JP2000252121A (ja) | 1999-02-26 | 2000-09-14 | Alps Electric Co Ltd | 高周波用Co基金属アモルファス磁性膜とそれを用いた磁気素子、インダクタ、トランス |
JP2001185419A (ja) | 1999-12-22 | 2001-07-06 | Sanyo Electric Co Ltd | 薄膜コイル素子及びその製造方法 |
JP2001244123A (ja) * | 2000-02-28 | 2001-09-07 | Kawatetsu Mining Co Ltd | 表面実装型平面磁気素子及びその製造方法 |
JP2001267155A (ja) | 2000-03-17 | 2001-09-28 | Fuji Electric Co Ltd | 平面型磁気素子 |
JP2002299122A (ja) | 2001-04-02 | 2002-10-11 | Kawasaki Steel Corp | 平面磁気素子 |
JP2002299138A (ja) | 2001-04-02 | 2002-10-11 | Kawasaki Steel Corp | 非接触充電器用平面磁気素子 |
KR100440810B1 (ko) | 2001-09-04 | 2004-07-21 | 한국전기연구원 | 저손실 박막 인덕터의 제조방법 |
JP2004111545A (ja) | 2002-09-17 | 2004-04-08 | Jfe Steel Kk | 平面磁気素子 |
KR100479625B1 (ko) * | 2002-11-30 | 2005-03-31 | 주식회사 쎄라텍 | 칩타입 파워인덕터 및 그 제조방법 |
US7061359B2 (en) * | 2003-06-30 | 2006-06-13 | International Business Machines Corporation | On-chip inductor with magnetic core |
JP3594031B1 (ja) * | 2003-07-04 | 2004-11-24 | 株式会社村田製作所 | 積層セラミック電子部品、積層コイル部品および積層セラミック電子部品の製造方法 |
-
2005
- 2005-01-07 KR KR1020050001833A patent/KR100665114B1/ko not_active IP Right Cessation
- 2005-06-17 JP JP2005177561A patent/JP2006190948A/ja active Pending
- 2005-06-21 US US11/156,485 patent/US20060152321A1/en not_active Abandoned
- 2005-06-24 CN CNA2005100800116A patent/CN1801412A/zh active Pending
-
2007
- 2007-03-15 US US11/724,211 patent/US7480980B2/en not_active Expired - Fee Related
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JP2008283635A (ja) * | 2007-05-14 | 2008-11-20 | Tdk Corp | 周波数変換回路 |
JP2011165808A (ja) * | 2010-02-08 | 2011-08-25 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
US9257216B2 (en) | 2011-10-14 | 2016-02-09 | Murata Manufacturing Co., Ltd. | Metal powder and electronic component |
KR20140083579A (ko) * | 2012-12-26 | 2014-07-04 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
KR101994707B1 (ko) * | 2012-12-26 | 2019-07-01 | 삼성전기주식회사 | 공통모드필터 및 이의 제조방법 |
JP2021503718A (ja) * | 2017-11-16 | 2021-02-12 | ジョージア テック リサーチ コーポレイション | 磁性層を有する基板対応インダクタ |
US11756985B2 (en) | 2017-11-16 | 2023-09-12 | Georgia Tech Research Corporation | Substrate-compatible inductors with magnetic layers |
JP2019129278A (ja) * | 2018-01-26 | 2019-08-01 | イビデン株式会社 | インダクタ部品の製造方法、インダクタ部品、部品内蔵配線基板 |
Also Published As
Publication number | Publication date |
---|---|
CN1801412A (zh) | 2006-07-12 |
KR20060081493A (ko) | 2006-07-13 |
US7480980B2 (en) | 2009-01-27 |
US20060152321A1 (en) | 2006-07-13 |
US20070159287A1 (en) | 2007-07-12 |
KR100665114B1 (ko) | 2007-01-09 |
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