CN104936379A - 一种印制电路板埋嵌磁芯电感的制备方法 - Google Patents
一种印制电路板埋嵌磁芯电感的制备方法 Download PDFInfo
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- 239000000243 solution Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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Abstract
本发明属于印制电路板制备领域,提供一种印制电路板埋嵌磁芯电感的制作方法,用于克服现有埋嵌电感磁芯制备工艺复杂、成本高的缺点;该方法通过在印制电路板埋嵌电感导电线圈上直接电镀或化学镀一层Ni-P、Co-P、Ni-B、Co-B、Ni-Co-P或Ni-Co-B磁芯材料,实现电感的磁芯的制作,从而得到印制电路板埋嵌磁芯电感。本发明方法大大地简化了传统埋嵌电感磁芯制作的工艺流程,降低了埋嵌电感的生产成本低,提高了电感的功能值;此外,本发明方法与印制电路板工序具有良好的兼容性,易于在生产中推广。
Description
技术领域
本发明属于印制电路板领域,特别涉及一种印制电路板埋嵌磁芯电感的制备方法。
背景技术
以移动通信基站、航空航天卫星为主的通信设备工作频率的不断提升,要求印制电路板在向集成化小型化发展同时对电感的功能值提出了更高的要求,于是诞生了印制电路板埋嵌磁芯电感。目前,印制电路板埋嵌磁芯电感主要有两种结构:
一是在电感线圈的上平面或下平面制备一层磁芯材料的结构(如文献:R.K.Ulrich,L.W.Schaper.Integrated passive component technology[M].Danver,MA:IEEE Press,2003,2–73),该结构的磁芯电感是通过在电感线圈上压合或沉积一层绝缘材料,然后在绝缘层上面再溅射或涂覆一层Fe、Co、Mn、Ni等化合物磁芯材料,从而得到埋嵌磁芯电感的;这种方法制备的磁芯对埋嵌电感的感值提高非常有限。为了进一步提高埋嵌电感的功能值,通常在电感线圈的上下平面都埋嵌磁芯材料,然后将两个磁芯层连接起来,形成磁路闭合;但是,这种方法制备的磁芯材料对埋嵌电感值影响依然不明显,其功能值相比裸磁芯结构也只增加20%左右(如文献:Bang D H,Park J Y.Ni-Zn ferrite screen printed power inductors for compact DC-DCpower converter applications[J].Magnetics,IEEE Transactions on,2009,45(6):2762-2765.)。
二是在电感线圈中心填充磁芯材料的结构,该结构是通过在线圈中心预制的凹坑或通孔中填充磁芯材料,形成线圈绕制中心磁芯材料,从而得到埋嵌磁芯电感(参考文献:陈健,黄良荣.一种在组装过程中的电感磁芯埋入PCB技术[J].印制电路信息,2010(S1):215-218.);这种结构制备的磁芯电感功能值大,但存在工艺复杂、成本高等不足。
发明内容
本发明的目的在于提供了一种印制电路板埋嵌磁芯电感的制备方法,该方法通过电镀或化学镀技术将磁芯材料沉积到埋嵌电感的导电线圈上表面,实现电感磁芯制备,从而得到埋嵌磁芯电感;该方法制备印制电路板磁芯电感具有工艺简单、生产成本低、电感值大、易于工业化生产等优点。
本发明采用的技术方案为:
一种印制电路板埋嵌磁芯电感的制备方法,其特征在于,通过电镀或化学镀将磁芯材料沉积于印制电路板埋嵌电感导电线圈上表面,实现电感的磁芯制作,从而得到埋嵌磁芯电感。
本发明中,所述化学镀的具体步骤为:
步骤1.将印制电路板埋嵌电感导电线圈浸泡于活化水溶液中,活化液中的活性离子被还原成活性原子并沉积于导电线圈金属表面上,形成化学镀磁芯材料的沉积物聚集中心;
步骤2.将经步骤1活化处理后的电感导电线圈浸泡于化学镀磁芯材料溶液中,磁芯材料沉积于电感导电线圈上表面,得到埋嵌磁芯电感。
本发明中,所述电镀的具体过程为:将印制电路板埋嵌电感导电线圈作为阴极置于电镀磁芯材料溶液中,施加电压后,磁芯材料沉积于电感导电线圈上表面,得到埋嵌磁芯电感。
进一步的,本发明中上述磁芯材料的化学组分为Ni-P、Co-P、Ni-B、Co-B、Ni-Co-P或Ni-Co-B合金。
本发明提供了一种印制电路板埋嵌磁芯电感的制备方法,大大地简化了传统埋嵌电感磁芯制作的工艺流程,降低了埋嵌磁芯电感的生产成本低,且有效提高了电感值;此外,该方法与印制电路板工序具有良好的兼容性,易于实现工业化生产。
附图说明
图1为本发明埋嵌磁芯电感的结构,其中:1为印制电路基板,2为电感线圈,3为磁芯材料层。
图2为本发明中磁芯材料的EDS图。
具体实施方式
下面结合具体实施例和附图对本发明作进一步详细说明。
实施例1
使用生益含0.4mm厚铜箔的单面覆铜板制备印制电路板埋嵌电感铜线圈,使用LCR分析仪测试其电感值为0.610μH2KHz。
将印制电路板埋嵌电感铜线圈浸泡于氯化钯酸性水溶液中,使得电感线圈上形成化学镀磁芯材料的Pb活性中心;然后将电感线圈浸泡于化学镀磁芯材料溶液中,经过一定时间后,磁芯材料沉积在电感铜线圈的表面,得到埋嵌Ni-P磁芯电感。使用EDS分析P的含量为6.49wt%。LCR分析仪测试不同沉积时间下埋嵌磁芯电感的功能值分别为0.658μH2KHz(Ni-P磁芯层厚度为14.18μm)、0.682μH2KHz(Ni-P磁芯层厚度为23.12μm)。如图2所示为本方案制备的磁芯材料EDS图。
其中,化学镀磁芯材料溶液的组分为:NiSO40.15mol/L、NaHPO20.15mol/L、C6H5Na3O7·2H2O 0.2mol/L、NH4Cl 0.5mol/L,使用氨水调节pH值为8.0,施镀温度为80℃。
实施例2
使用生益含0.4mm厚铜箔的单面覆铜板制备印制电路板埋嵌电感铜线圈,使用LCR分析仪测试其电感值为0.623μH2KHz。
将印制电路板埋嵌电感铜线圈浸泡于氯化钯酸性水溶液中,使得电感线圈上形成化学镀磁芯材料的Pb活性中心;然后将电感线圈浸泡于化学镀磁芯材料溶液中,经过一段时间后,磁芯材料沉积在电感铜线圈的表面,得到埋嵌Ni-Co-P磁芯电感。使用EDS分析P的含量为5.8wt%、Ni的含量为76.2%。LCR分析仪测试不同沉积时间下埋嵌磁芯电感的功能值为0.689μH2KHz(Ni-Co-P磁芯层厚度为12.45μm)、0.788μH2KHz(Ni-P磁芯层厚度为26.7μm)。
其中,化学镀磁芯材料溶液的组分为:NiSO40.15mol/L、CoSO40.06mol/L NaHPO20.15mol/L、C6H5Na3O7·2H2O 0.2mol/L、NH4Cl 0.5mol/L,使用氨水调节pH值为8.0,施镀温度为80℃。
Claims (4)
1.一种印制电路板埋嵌磁芯电感的制备方法,其特征在于,通过电镀或化学镀将磁芯材料沉积于印制电路板埋嵌电感导电线圈上表面,实现电感的磁芯制作,从而得到埋嵌磁芯电感。
2.按权利要求1所述印制电路板埋嵌磁芯电感的制备方法,其特征在于,所述化学镀的具体步骤为:
步骤1.将印制电路板埋嵌电感导电线圈浸泡于活化水溶液中,活化液中的活性离子被还原成活性原子并沉积于导电线圈金属表面上,形成化学镀磁芯材料的沉积物聚集中心;
步骤2.将经步骤1活化处理后的电感导电线圈浸泡于化学镀磁芯材料溶液中,磁芯材料沉积于电感导电线圈上表面,得到埋嵌磁芯电感。
3.按权利要求1所述印制电路板埋嵌磁芯电感的制备方法,其特征在于,所述电镀的具体过程为:将印制电路板埋嵌电感导电线圈作为阴极置于电镀磁芯材料溶液中,施加电压后,磁芯材料沉积于电感导电线圈上表面,得到埋嵌磁芯电感。
4.按权利要求1、2或3所述印制电路板埋嵌磁芯电感的制备方法,其特征在于,所述磁芯材料的化学组分为Ni-P、Co-P、Ni-B、Co-B、Ni-Co-P或Ni-Co-B合金。
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CN106332447A (zh) * | 2016-08-31 | 2017-01-11 | 电子科技大学 | 一种用于印制电路板埋嵌技术的电感结构及其制作方法 |
CN106783754A (zh) * | 2016-12-26 | 2017-05-31 | 通富微电子股份有限公司 | 一种基板及其封装设备、制作方法、电子设备 |
CN106920673A (zh) * | 2017-04-13 | 2017-07-04 | 电子科技大学 | 一种制备集成电感多元复合磁芯层的方法 |
CN107633941A (zh) * | 2017-09-14 | 2018-01-26 | 电子科技大学 | 一种闭合型集成电感及其制备方法 |
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CN106920673A (zh) * | 2017-04-13 | 2017-07-04 | 电子科技大学 | 一种制备集成电感多元复合磁芯层的方法 |
CN106920673B (zh) * | 2017-04-13 | 2018-10-12 | 电子科技大学 | 一种制备集成电感多元复合磁芯层的方法 |
CN107633941A (zh) * | 2017-09-14 | 2018-01-26 | 电子科技大学 | 一种闭合型集成电感及其制备方法 |
CN113628875A (zh) * | 2021-08-13 | 2021-11-09 | 电子科技大学 | 一种基于超薄改性绝缘层沉积磁芯制备电感器的方法 |
CN113628875B (zh) * | 2021-08-13 | 2022-04-22 | 电子科技大学 | 一种基于超薄改性绝缘层沉积磁芯制备电感器的方法 |
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