JP2006186999A5 - - Google Patents
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- Publication number
- JP2006186999A5 JP2006186999A5 JP2005367304A JP2005367304A JP2006186999A5 JP 2006186999 A5 JP2006186999 A5 JP 2006186999A5 JP 2005367304 A JP2005367304 A JP 2005367304A JP 2005367304 A JP2005367304 A JP 2005367304A JP 2006186999 A5 JP2006186999 A5 JP 2006186999A5
- Authority
- JP
- Japan
- Prior art keywords
- epitaxial layer
- substrate
- polysilicon layer
- ultrasonic transducer
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/023,252 US7037746B1 (en) | 2004-12-27 | 2004-12-27 | Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006186999A JP2006186999A (ja) | 2006-07-13 |
| JP2006186999A5 true JP2006186999A5 (enExample) | 2011-08-11 |
Family
ID=36215997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005367304A Pending JP2006186999A (ja) | 2004-12-27 | 2005-12-21 | エピタキシャル・シリコン膜によって製作した容量性マイクロマシン加工超音波トランスジューサ |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US7037746B1 (enExample) |
| JP (1) | JP2006186999A (enExample) |
| FR (1) | FR2880232B1 (enExample) |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7030536B2 (en) * | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
| JP5275565B2 (ja) * | 2004-06-07 | 2013-08-28 | オリンパス株式会社 | 静電容量型超音波トランスデューサ |
| US20060276008A1 (en) * | 2005-06-02 | 2006-12-07 | Vesa-Pekka Lempinen | Thinning |
| JP4724501B2 (ja) | 2005-09-06 | 2011-07-13 | 株式会社日立製作所 | 超音波トランスデューサおよびその製造方法 |
| JP4699259B2 (ja) | 2006-03-31 | 2011-06-08 | 株式会社日立製作所 | 超音波トランスデューサ |
| JP5008946B2 (ja) * | 2006-10-30 | 2012-08-22 | オリンパスメディカルシステムズ株式会社 | 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡 |
| WO2008136198A1 (ja) | 2007-04-27 | 2008-11-13 | Hitachi, Ltd. | 超音波トランスデューサ及び超音波撮像装置 |
| JP5408937B2 (ja) * | 2007-09-25 | 2014-02-05 | キヤノン株式会社 | 電気機械変換素子及びその製造方法 |
| JP5408935B2 (ja) * | 2007-09-25 | 2014-02-05 | キヤノン株式会社 | 電気機械変換素子及びその製造方法 |
| JP5188188B2 (ja) * | 2008-01-15 | 2013-04-24 | キヤノン株式会社 | 容量型超音波トランスデューサの製造方法 |
| JP2010004199A (ja) * | 2008-06-19 | 2010-01-07 | Hitachi Ltd | 超音波トランスデューサおよびその製造方法 |
| FR2939003B1 (fr) | 2008-11-21 | 2011-02-25 | Commissariat Energie Atomique | Cellule cmut formee d'une membrane de nano-tubes ou de nano-fils ou de nano-poutres et dispositif d'imagerie acoustique ultra haute frequence comprenant une pluralite de telles cellules |
| JP5578836B2 (ja) | 2008-12-25 | 2014-08-27 | キヤノン株式会社 | 電気機械変換装置及びその作製方法 |
| US8300855B2 (en) * | 2008-12-30 | 2012-10-30 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic module, thermoacoustic device, and method for making the same |
| CN102405653B (zh) * | 2009-04-21 | 2015-06-03 | 株式会社日立医疗器械 | 超声波探头 |
| KR101573518B1 (ko) * | 2009-09-16 | 2015-12-01 | 삼성전자주식회사 | 초음파 트랜스듀서 및 그 제조 방법 |
| US8531919B2 (en) * | 2009-09-21 | 2013-09-10 | The Hong Kong Polytechnic University | Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance |
| JP5733898B2 (ja) * | 2010-02-14 | 2015-06-10 | キヤノン株式会社 | 静電容量型電気機械変換装置 |
| US8409102B2 (en) | 2010-08-31 | 2013-04-02 | General Electric Company | Multi-focus ultrasound system and method |
| FI20106359A7 (fi) * | 2010-12-21 | 2012-06-22 | Teknologian Tutkimuskeskus Vtt Oy | Menetelmä ultraäänianturin valmistamiseksi ja anturirakenne |
| JP5896665B2 (ja) * | 2011-09-20 | 2016-03-30 | キヤノン株式会社 | 電気機械変換装置の製造方法 |
| BR112014014911A2 (pt) * | 2011-12-20 | 2017-06-13 | Koninklijke Philips Nv | dispositivo transdutor de ultrassom; e método de fabricação de um dispositivo transdutor de ultrassom |
| CN104066521B (zh) * | 2012-01-27 | 2017-07-11 | 皇家飞利浦有限公司 | 电容式微机械换能器及制造所述电容式微机械换能器的方法 |
| CN102620878B (zh) * | 2012-03-15 | 2014-03-12 | 西安交通大学 | 一种电容式微加工超声传感器及其制备与应用方法 |
| CN104379268B (zh) * | 2012-05-31 | 2017-02-22 | 皇家飞利浦有限公司 | 晶片及其制造方法 |
| US9035532B2 (en) * | 2012-11-02 | 2015-05-19 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
| US9364862B2 (en) | 2012-11-02 | 2016-06-14 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
| US9499392B2 (en) | 2013-02-05 | 2016-11-22 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
| US9586233B2 (en) | 2013-02-22 | 2017-03-07 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasound transducers with pressurized cavities |
| US9857457B2 (en) | 2013-03-14 | 2018-01-02 | University Of Windsor | Ultrasonic sensor microarray and its method of manufacture |
| CA2903479C (en) | 2013-03-15 | 2023-10-10 | Butterfly Network, Inc. | Monolithic ultrasonic imaging devices, systems and methods |
| TWI623081B (zh) | 2013-03-15 | 2018-05-01 | 蝴蝶網路公司 | 互補式金屬氧化物半導體(cmos)超音波換能器以及用於形成其之方法 |
| US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
| US9187316B2 (en) | 2013-07-19 | 2015-11-17 | University Of Windsor | Ultrasonic sensor microarray and method of manufacturing same |
| EP3024594A2 (en) | 2013-07-23 | 2016-06-01 | Butterfly Network Inc. | Interconnectable ultrasound transducer probes and related methods and apparatus |
| CN106461767B (zh) | 2014-04-18 | 2019-05-28 | 蝴蝶网络有限公司 | 单衬底超声成像装置的架构、相关设备和方法 |
| CN106659464B (zh) | 2014-04-18 | 2020-03-20 | 蝴蝶网络有限公司 | 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法 |
| TWI671059B (zh) | 2014-04-18 | 2019-09-11 | 美商蝴蝶網路公司 | 超音波成像壓縮方法和設備 |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US9997425B2 (en) | 2015-07-14 | 2018-06-12 | University Of Windsor | Layered benzocyclobutene interconnected circuit and method of manufacturing same |
| US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
| US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| CN107169416B (zh) * | 2017-04-14 | 2023-07-25 | 杭州士兰微电子股份有限公司 | 超声波指纹传感器及其制造方法 |
| US10512936B2 (en) | 2017-06-21 | 2019-12-24 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
| CN109068245A (zh) * | 2018-08-01 | 2018-12-21 | 京东方科技集团股份有限公司 | 屏幕发声装置、发声显示屏及其制造方法和屏幕发声系统 |
| CN112789239A (zh) | 2018-10-05 | 2021-05-11 | 美商楼氏电子有限公司 | 形成包括褶皱的mems振膜的方法 |
| WO2020072920A1 (en) | 2018-10-05 | 2020-04-09 | Knowles Electronics, Llc | Microphone device with ingress protection |
| CN112840676B (zh) | 2018-10-05 | 2022-05-03 | 美商楼氏电子有限公司 | 响应于声学信号来生成电信号的声学换能器和麦克风组件 |
| US11435461B2 (en) | 2019-07-19 | 2022-09-06 | GE Precision Healthcare LLC | Method and system to prevent depoling of ultrasound transducer |
| US11464494B2 (en) | 2019-07-19 | 2022-10-11 | GE Precision Healthcare LLC | Method and system to revert a depoling effect exhibited by an ultrasound transducer |
| US12240748B2 (en) | 2021-03-21 | 2025-03-04 | Knowles Electronics, Llc | MEMS die and MEMS-based sensor |
| US11528546B2 (en) | 2021-04-05 | 2022-12-13 | Knowles Electronics, Llc | Sealed vacuum MEMS die |
| US11540048B2 (en) | 2021-04-16 | 2022-12-27 | Knowles Electronics, Llc | Reduced noise MEMS device with force feedback |
| US11649161B2 (en) | 2021-07-26 | 2023-05-16 | Knowles Electronics, Llc | Diaphragm assembly with non-uniform pillar distribution |
| US11772961B2 (en) | 2021-08-26 | 2023-10-03 | Knowles Electronics, Llc | MEMS device with perimeter barometric relief pierce |
| US11780726B2 (en) | 2021-11-03 | 2023-10-10 | Knowles Electronics, Llc | Dual-diaphragm assembly having center constraint |
| CN116140123A (zh) * | 2022-11-22 | 2023-05-23 | 上海声动微科技有限公司 | 雾化芯片及其制备方法 |
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| JPS58209299A (ja) * | 1982-05-29 | 1983-12-06 | Toshiba Corp | トランスジユ−サ |
| JPH0750789B2 (ja) * | 1986-07-18 | 1995-05-31 | 日産自動車株式会社 | 半導体圧力変換装置の製造方法 |
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| JP2004350701A (ja) * | 2003-05-26 | 2004-12-16 | Olympus Corp | 超音波内視鏡装置 |
| JP4370120B2 (ja) * | 2003-05-26 | 2009-11-25 | オリンパス株式会社 | 超音波内視鏡および超音波内視鏡装置 |
| JP2004356707A (ja) * | 2003-05-27 | 2004-12-16 | Hosiden Corp | 音響検出機構 |
| WO2005046443A2 (en) * | 2003-11-07 | 2005-05-26 | Georgia Tech Research Corporation | Combination catheter devices, methods, and systems |
| US7030536B2 (en) * | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
| US8008835B2 (en) * | 2004-02-27 | 2011-08-30 | Georgia Tech Research Corporation | Multiple element electrode cMUT devices and fabrication methods |
| US6945115B1 (en) * | 2004-03-04 | 2005-09-20 | General Mems Corporation | Micromachined capacitive RF pressure sensor |
| JP4347885B2 (ja) * | 2004-06-03 | 2009-10-21 | オリンパス株式会社 | 静電容量型超音波振動子の製造方法、当該製造方法によって製造された静電容量型超音波振動子を備えた超音波内視鏡装置、静電容量型超音波プローブおよび静電容量型超音波振動子 |
-
2004
- 2004-12-27 US US11/023,252 patent/US7037746B1/en not_active Expired - Fee Related
-
2005
- 2005-12-21 JP JP2005367304A patent/JP2006186999A/ja active Pending
- 2005-12-27 FR FR0513347A patent/FR2880232B1/fr not_active Expired - Fee Related
-
2006
- 2006-03-30 US US11/393,317 patent/US7545012B2/en not_active Expired - Fee Related
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