EP1860062A3 - Micro-fludidic structure and method of making the same - Google Patents

Micro-fludidic structure and method of making the same Download PDF

Info

Publication number
EP1860062A3
EP1860062A3 EP07252093A EP07252093A EP1860062A3 EP 1860062 A3 EP1860062 A3 EP 1860062A3 EP 07252093 A EP07252093 A EP 07252093A EP 07252093 A EP07252093 A EP 07252093A EP 1860062 A3 EP1860062 A3 EP 1860062A3
Authority
EP
European Patent Office
Prior art keywords
layer
making
forming
fludidic
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07252093A
Other languages
German (de)
French (fr)
Other versions
EP1860062A2 (en
Inventor
Frank Bryant
Murray Robinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
STMicroelectronics lnc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics lnc USA filed Critical STMicroelectronics lnc USA
Publication of EP1860062A2 publication Critical patent/EP1860062A2/en
Publication of EP1860062A3 publication Critical patent/EP1860062A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A microfabricated structure and method of making that includes forming a first layer of material on a substrate, forming patterned sacrificial material having a predetermined shape on the first layer of material, and forming a second layer of material over the first layer and the patterned sacrificial material, which is then removed to form an encapsulated cavity. Ideally, the first and second layers are formed of the same type material. A structural support layer can be added to the second layer. Openings can be formed in the cavity, and the cavities can be layered side by side, vertically stacked with interconnections via the openings, and a combination of both can be used to construct stacked arrays with interconnections throughout.
EP07252093A 2006-05-24 2007-05-22 Micro-fludidic structure and method of making the same Withdrawn EP1860062A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/440,643 US7666798B2 (en) 2006-05-24 2006-05-24 Method of making a micro-fluidic structure

Publications (2)

Publication Number Publication Date
EP1860062A2 EP1860062A2 (en) 2007-11-28
EP1860062A3 true EP1860062A3 (en) 2012-02-22

Family

ID=38279096

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07252093A Withdrawn EP1860062A3 (en) 2006-05-24 2007-05-22 Micro-fludidic structure and method of making the same

Country Status (2)

Country Link
US (2) US7666798B2 (en)
EP (1) EP1860062A3 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8349635B1 (en) * 2008-05-20 2013-01-08 Silicon Laboratories Inc. Encapsulated MEMS device and method to form the same
DE102010036082B4 (en) 2010-08-26 2015-07-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microfluidic measurement setup and optical analysis method for optical analysis of cells
CN102616727B (en) * 2011-01-31 2015-04-29 中芯国际集成电路制造(上海)有限公司 Micro electro mechanical system (MEMS) device and manufacture method of MEMS device
US9018715B2 (en) 2012-11-30 2015-04-28 Silicon Laboratories Inc. Gas-diffusion barriers for MEMS encapsulation
CN104280160B (en) 2013-07-03 2016-10-05 中芯国际集成电路制造(上海)有限公司 Pressure sensor and forming method thereof
ITUB20159497A1 (en) 2015-12-24 2017-06-24 St Microelectronics Srl PIEZOELECTRIC MEMS DEVICE AND ITS MANUFACTURING PROCEDURE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001043876A1 (en) * 1999-12-17 2001-06-21 Motorola, Inc. Devices and methods for making bioarrays
US20020072243A1 (en) * 1999-01-13 2002-06-13 Craighead Harold G. Monolithic nanofluid sieving structures for DNA manipulation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050048688A1 (en) * 2000-12-07 2005-03-03 Patel Satyadev R. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
WO2004037711A2 (en) * 2002-10-23 2004-05-06 Rutgers, The State University Of New Jersey Processes for hermetically packaging wafer level microscopic structures
US7417315B2 (en) * 2002-12-05 2008-08-26 International Business Machines Corporation Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
US7145213B1 (en) * 2004-05-24 2006-12-05 The United States Of America As Represented By The Secretary Of The Air Force MEMS RF switch integrated process
WO2007037926A2 (en) * 2005-09-23 2007-04-05 Sharp Laboratories Of America, Inc. Mems pixel sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020072243A1 (en) * 1999-01-13 2002-06-13 Craighead Harold G. Monolithic nanofluid sieving structures for DNA manipulation
WO2001043876A1 (en) * 1999-12-17 2001-06-21 Motorola, Inc. Devices and methods for making bioarrays

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DHARMATILLEKE S ET AL: "THREE-DIMENSIONAL SILICONE MICROFLUIDIC INTERCONNECTION SCHEME USING SACRIFICAL WAX FILAMENTS", PROCEEDINGS OF SPIE, SPIE, US, vol. 4177, 18 September 2000 (2000-09-18), pages 90 - 97, XP009015309, ISSN: 0277-786X, DOI: 10.1117/12.395676 *

Also Published As

Publication number Publication date
US20070273728A1 (en) 2007-11-29
US7666798B2 (en) 2010-02-23
US7928520B2 (en) 2011-04-19
EP1860062A2 (en) 2007-11-28
US20100109100A1 (en) 2010-05-06

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