JP2006186999A - エピタキシャル・シリコン膜によって製作した容量性マイクロマシン加工超音波トランスジューサ - Google Patents

エピタキシャル・シリコン膜によって製作した容量性マイクロマシン加工超音波トランスジューサ Download PDF

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Publication number
JP2006186999A
JP2006186999A JP2005367304A JP2005367304A JP2006186999A JP 2006186999 A JP2006186999 A JP 2006186999A JP 2005367304 A JP2005367304 A JP 2005367304A JP 2005367304 A JP2005367304 A JP 2005367304A JP 2006186999 A JP2006186999 A JP 2006186999A
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epitaxial layer
substrate
lower electrode
layer
capacitive micromachined
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JP2005367304A
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JP2006186999A5 (enExample
Inventor
Lowell Scott Smith
ローウェル・スコット・スミス
David Martin Mills
デイヴィッド・マーティン・ミルズ
Jeffrey Bernard Fortin
ジェフリー・バナード・フォーティン
Wei-Cheng Tian
ウェイ−チェン・ティアン
John Robert Logan
ジョン・ロバート・ローガン
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General Electric Co
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General Electric Co
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Publication of JP2006186999A5 publication Critical patent/JP2006186999A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Sensors (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
JP2005367304A 2004-12-27 2005-12-21 エピタキシャル・シリコン膜によって製作した容量性マイクロマシン加工超音波トランスジューサ Pending JP2006186999A (ja)

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Application Number Priority Date Filing Date Title
US11/023,252 US7037746B1 (en) 2004-12-27 2004-12-27 Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane

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JP2006186999A true JP2006186999A (ja) 2006-07-13
JP2006186999A5 JP2006186999A5 (enExample) 2011-08-11

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US (2) US7037746B1 (enExample)
JP (1) JP2006186999A (enExample)
FR (1) FR2880232B1 (enExample)

Cited By (7)

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JP2008110059A (ja) * 2006-10-30 2008-05-15 Olympus Medical Systems Corp 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡
WO2008136198A1 (ja) 2007-04-27 2008-11-13 Hitachi, Ltd. 超音波トランスデューサ及び超音波撮像装置
JP2009165931A (ja) * 2008-01-15 2009-07-30 Canon Inc 容量型超音波トランスデューサの製造方法
JP2012509631A (ja) * 2008-11-21 2012-04-19 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ ナノチューブまたはナノワイヤーまたはナノビームの薄膜よりなるｃｍｕｔセル
US8455964B2 (en) 2008-12-25 2013-06-04 Canon Kabushiki Kaisha Electromechanical transducer and production method therefor
KR101573518B1 (ko) * 2009-09-16 2015-12-01 삼성전자주식회사 초음파 트랜스듀서 및 그 제조 방법
RU2627282C2 (ru) * 2012-05-31 2017-08-04 Конинклейке Филипс Н.В. Полупроводниковая пластина и способ ее изготовления

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US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
WO2005120355A1 (ja) * 2004-06-07 2005-12-22 Olympus Corporation 静電容量型超音波トランスデューサ
US20060276008A1 (en) * 2005-06-02 2006-12-07 Vesa-Pekka Lempinen Thinning
JP4724501B2 (ja) 2005-09-06 2011-07-13 株式会社日立製作所 超音波トランスデューサおよびその製造方法
JP4699259B2 (ja) * 2006-03-31 2011-06-08 株式会社日立製作所 超音波トランスデューサ
JP5408935B2 (ja) * 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
JP5408937B2 (ja) * 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
JP2010004199A (ja) * 2008-06-19 2010-01-07 Hitachi Ltd 超音波トランスデューサおよびその製造方法
US8300855B2 (en) * 2008-12-30 2012-10-30 Beijing Funate Innovation Technology Co., Ltd. Thermoacoustic module, thermoacoustic device, and method for making the same
EP2424273B1 (en) * 2009-04-21 2020-11-25 Hitachi, Ltd. Ultrasonic probe and ultrasonic imaging apparatus
US8531919B2 (en) * 2009-09-21 2013-09-10 The Hong Kong Polytechnic University Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance
JP5733898B2 (ja) * 2010-02-14 2015-06-10 キヤノン株式会社 静電容量型電気機械変換装置
US8409102B2 (en) 2010-08-31 2013-04-02 General Electric Company Multi-focus ultrasound system and method
FI20106359L (fi) * 2010-12-21 2012-06-22 Teknologian Tutkimuskeskus Vtt Oy Menetelmä ultraäänianturin valmistamiseksi ja anturirakenne
JP5896665B2 (ja) * 2011-09-20 2016-03-30 キヤノン株式会社 電気機械変換装置の製造方法
RU2607720C2 (ru) 2011-12-20 2017-01-10 Конинклейке Филипс Н.В. Устройство ультразвукового преобразователя и способ его изготовления
WO2013111040A1 (en) * 2012-01-27 2013-08-01 Koninklijke Philips N.V. Capacitive micro-machined transducer and method of manufacturing the same
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US9035532B2 (en) * 2012-11-02 2015-05-19 University Of Windsor Ultrasonic sensor microarray and method of manufacturing same
US9364862B2 (en) 2012-11-02 2016-06-14 University Of Windsor Ultrasonic sensor microarray and method of manufacturing same
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
US9586233B2 (en) 2013-02-22 2017-03-07 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasound transducers with pressurized cavities
US9857457B2 (en) 2013-03-14 2018-01-02 University Of Windsor Ultrasonic sensor microarray and its method of manufacture
US9521991B2 (en) 2013-03-15 2016-12-20 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
EP3639937A1 (en) 2013-03-15 2020-04-22 Butterfly Network, Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
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TWI682817B (zh) 2013-07-23 2020-01-21 美商蝴蝶網路公司 可互連的超音波換能器探頭以及相關的方法和設備
US9505030B2 (en) 2014-04-18 2016-11-29 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
US9229097B2 (en) 2014-04-18 2016-01-05 Butterfly Network, Inc. Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods
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US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9997425B2 (en) 2015-07-14 2018-06-12 University Of Windsor Layered benzocyclobutene interconnected circuit and method of manufacturing same
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
CN107169416B (zh) * 2017-04-14 2023-07-25 杭州士兰微电子股份有限公司 超声波指纹传感器及其制造方法
AU2018289454A1 (en) 2017-06-21 2019-12-05 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
CN109068245A (zh) * 2018-08-01 2018-12-21 京东方科技集团股份有限公司 屏幕发声装置、发声显示屏及其制造方法和屏幕发声系统
CN112823532B (zh) 2018-10-05 2022-05-31 美商楼氏电子有限公司 具有入口防护部的麦克风设备
CN119255168A (zh) 2018-10-05 2025-01-03 美商楼氏电子有限公司 形成包括褶皱的mems振膜的方法
DE112019005007T5 (de) 2018-10-05 2021-07-15 Knowles Electronics, Llc Akustikwandler mit einer Niederdruckzone und Membranen, die eine erhöhte Nachgiebigkeit aufweisen
US11435461B2 (en) 2019-07-19 2022-09-06 GE Precision Healthcare LLC Method and system to prevent depoling of ultrasound transducer
US11464494B2 (en) 2019-07-19 2022-10-11 GE Precision Healthcare LLC Method and system to revert a depoling effect exhibited by an ultrasound transducer
US12240748B2 (en) 2021-03-21 2025-03-04 Knowles Electronics, Llc MEMS die and MEMS-based sensor
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint
CN116140123A (zh) * 2022-11-22 2023-05-23 上海声动微科技有限公司 雾化芯片及其制备方法

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WO2008136198A1 (ja) 2007-04-27 2008-11-13 Hitachi, Ltd. 超音波トランスデューサ及び超音波撮像装置
US9636707B2 (en) 2007-04-27 2017-05-02 Hitachi, Ltd. Capacitive micromachined ultrasonic transducer and ultrasonic imaging apparatus
JP2009165931A (ja) * 2008-01-15 2009-07-30 Canon Inc 容量型超音波トランスデューサの製造方法
JP2012509631A (ja) * 2008-11-21 2012-04-19 コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ ナノチューブまたはナノワイヤーまたはナノビームの薄膜よりなるｃｍｕｔセル
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RU2627282C2 (ru) * 2012-05-31 2017-08-04 Конинклейке Филипс Н.В. Полупроводниковая пластина и способ ее изготовления

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US7037746B1 (en) 2006-05-02
US20060170014A1 (en) 2006-08-03
US7545012B2 (en) 2009-06-09
FR2880232B1 (fr) 2009-10-09
FR2880232A1 (fr) 2006-06-30

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