JP2006173605A - パッケージングされた電子デバイス及びその製作方法 - Google Patents

パッケージングされた電子デバイス及びその製作方法 Download PDF

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Publication number
JP2006173605A
JP2006173605A JP2005353136A JP2005353136A JP2006173605A JP 2006173605 A JP2006173605 A JP 2006173605A JP 2005353136 A JP2005353136 A JP 2005353136A JP 2005353136 A JP2005353136 A JP 2005353136A JP 2006173605 A JP2006173605 A JP 2006173605A
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JP
Japan
Prior art keywords
electronic device
substrate
electrical connection
package
fixing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005353136A
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English (en)
Japanese (ja)
Other versions
JP2006173605A5 (enExample
Inventor
Kee Yean Ng
イーン ウン キー
Hui Peng Koay
ペン コェイ フイ
Yew Cheong Kuan
チョン クァン ユー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2006173605A publication Critical patent/JP2006173605A/ja
Publication of JP2006173605A5 publication Critical patent/JP2006173605A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)
JP2005353136A 2004-12-16 2005-12-07 パッケージングされた電子デバイス及びその製作方法 Pending JP2006173605A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/014,646 US20060131708A1 (en) 2004-12-16 2004-12-16 Packaged electronic devices, and method for making same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012180460A Division JP2013016819A (ja) 2004-12-16 2012-08-16 パッケージングされた電子デバイス及びその製作方法

Publications (2)

Publication Number Publication Date
JP2006173605A true JP2006173605A (ja) 2006-06-29
JP2006173605A5 JP2006173605A5 (enExample) 2008-11-27

Family

ID=36594625

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005353136A Pending JP2006173605A (ja) 2004-12-16 2005-12-07 パッケージングされた電子デバイス及びその製作方法
JP2012180460A Pending JP2013016819A (ja) 2004-12-16 2012-08-16 パッケージングされた電子デバイス及びその製作方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012180460A Pending JP2013016819A (ja) 2004-12-16 2012-08-16 パッケージングされた電子デバイス及びその製作方法

Country Status (2)

Country Link
US (1) US20060131708A1 (enExample)
JP (2) JP2006173605A (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096970A (ja) * 2009-11-02 2011-05-12 Dainippon Printing Co Ltd Ｌｅｄ素子載置部材、ｌｅｄ素子載置基板およびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
JP2011129876A (ja) * 2009-11-17 2011-06-30 Stanley Electric Co Ltd 発光装置およびその製造方法
JP2011134961A (ja) * 2009-12-25 2011-07-07 Hitachi Chem Co Ltd 半導体装置、半導体素子搭載接続用配線基材、半導体装置搭載配線板及びそれらの製造法
JP2011151323A (ja) * 2010-01-25 2011-08-04 Dainippon Printing Co Ltd 樹脂付リードフレームおよびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
JP2011228687A (ja) * 2010-03-30 2011-11-10 Dainippon Printing Co Ltd Ｌｅｄ用リードフレームまたは基板、半導体装置、およびｌｅｄ用リードフレームまたは基板の製造方法
JP2012028630A (ja) * 2010-07-26 2012-02-09 Dainippon Printing Co Ltd Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
JP2012529172A (ja) * 2009-06-03 2012-11-15 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 半導体発光デバイス上に誘電体層を形成する方法
DE112011100376T5 (de) 2010-01-29 2012-11-29 Citizen Electronics Co., Ltd. Verfahren zur herstellung einer licht aussendenden vorrichtung und licht aussendende vorrichtung
JP2015065470A (ja) * 2014-12-08 2015-04-09 日亜化学工業株式会社 発光装置の製造方法
JP2015133524A (ja) * 2015-04-23 2015-07-23 日亜化学工業株式会社 光半導体装置及びその製造方法
JP2015185619A (ja) * 2014-03-20 2015-10-22 日立マクセル株式会社 半導体装置用基板、当該基板の製造方法、半導体装置、及び半導体装置の製造方法
US9263315B2 (en) 2010-03-30 2016-02-16 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
JP2016029747A (ja) * 2015-12-01 2016-03-03 大日本印刷株式会社 Ｌｅｄ素子載置部材、ｌｅｄ素子載置基板およびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
US9773960B2 (en) 2010-11-02 2017-09-26 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969914B2 (en) * 2002-08-29 2005-11-29 Micron Technology, Inc. Electronic device package
US7919787B2 (en) * 2003-06-27 2011-04-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Semiconductor device with a light emitting semiconductor die
KR101320514B1 (ko) * 2007-08-21 2013-10-22 삼성전자주식회사 칩-온-보드 방식에 의한 ｌｅｄ 패키지
WO2009057241A1 (ja) * 2007-11-01 2009-05-07 Panasonic Corporation 半導体発光素子およびそれを用いた半導体発光装置
TW200937667A (en) * 2008-02-20 2009-09-01 Advanced Optoelectronic Tech Package structure of chemical compound semiconductor device and fabricating method thereof
US20100184241A1 (en) * 2009-01-16 2010-07-22 Edison Opto Corporation Method for manufacturing thin type light emitting diode assembly
JP2011165833A (ja) * 2010-02-08 2011-08-25 Toshiba Corp Ｌｅｄモジュール
CN102163602B (zh) * 2010-02-16 2015-01-14 东芝照明技术株式会社 发光装置以及具备此发光装置的照明装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07147430A (ja) * 1993-11-26 1995-06-06 Hitachi Cable Ltd Ｌｅｄアレイヘッド基板
JPH09174923A (ja) * 1995-12-22 1997-07-08 Nippon Seiki Co Ltd 発光素子アセンブリ
JP2000012758A (ja) * 1998-06-26 2000-01-14 Matsushita Electron Corp リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法
JP2001185763A (ja) * 1999-12-27 2001-07-06 Toshiba Electronic Engineering Corp 光半導体パッケージ
JP2003174200A (ja) * 2001-12-07 2003-06-20 Hitachi Cable Ltd 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144650U (enExample) * 1985-02-28 1986-09-06
JPH0621315A (ja) * 1992-07-02 1994-01-28 Seiko Epson Corp 半導体装置用リードフレーム及び、それを用いた半導体装置
JPH0621304A (ja) * 1992-07-06 1994-01-28 Seiko Epson Corp リードフレーム及び半導体装置の製造方法
JP2915892B2 (ja) * 1997-06-27 1999-07-05 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP3562311B2 (ja) * 1998-05-27 2004-09-08 松下電器産業株式会社 リードフレームおよび樹脂封止型半導体装置の製造方法
JP3905289B2 (ja) * 2000-08-28 2007-04-18 株式会社吉野工業所 接着層を有する積層体
US6661083B2 (en) * 2001-02-27 2003-12-09 Chippac, Inc Plastic semiconductor package
JP3942457B2 (ja) * 2002-02-27 2007-07-11 Ｎｅｃエレクトロニクス株式会社 電子部品の製造方法
JP4254266B2 (ja) * 2003-02-20 2009-04-15 豊田合成株式会社 発光装置及び発光装置の製造方法
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07147430A (ja) * 1993-11-26 1995-06-06 Hitachi Cable Ltd Ｌｅｄアレイヘッド基板
JPH09174923A (ja) * 1995-12-22 1997-07-08 Nippon Seiki Co Ltd 発光素子アセンブリ
JP2000012758A (ja) * 1998-06-26 2000-01-14 Matsushita Electron Corp リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法
JP2001185763A (ja) * 1999-12-27 2001-07-06 Toshiba Electronic Engineering Corp 光半導体パッケージ
JP2003174200A (ja) * 2001-12-07 2003-06-20 Hitachi Cable Ltd 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012529172A (ja) * 2009-06-03 2012-11-15 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 半導体発光デバイス上に誘電体層を形成する方法
JP2011096970A (ja) * 2009-11-02 2011-05-12 Dainippon Printing Co Ltd Ｌｅｄ素子載置部材、ｌｅｄ素子載置基板およびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
JP2011129876A (ja) * 2009-11-17 2011-06-30 Stanley Electric Co Ltd 発光装置およびその製造方法
JP2011134961A (ja) * 2009-12-25 2011-07-07 Hitachi Chem Co Ltd 半導体装置、半導体素子搭載接続用配線基材、半導体装置搭載配線板及びそれらの製造法
JP2011151323A (ja) * 2010-01-25 2011-08-04 Dainippon Printing Co Ltd 樹脂付リードフレームおよびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法
US8556672B2 (en) 2010-01-29 2013-10-15 Citizen Electronics Co., Ltd. Method of producing light-emitting device and light-emitting device
DE112011100376B4 (de) 2010-01-29 2024-06-27 Citizen Electronics Co., Ltd. Verfahren zur herstellung einer licht aussendenden vorrichtung
DE112011100376T5 (de) 2010-01-29 2012-11-29 Citizen Electronics Co., Ltd. Verfahren zur herstellung einer licht aussendenden vorrichtung und licht aussendende vorrichtung
JP2011228687A (ja) * 2010-03-30 2011-11-10 Dainippon Printing Co Ltd Ｌｅｄ用リードフレームまたは基板、半導体装置、およびｌｅｄ用リードフレームまたは基板の製造方法
US9263315B2 (en) 2010-03-30 2016-02-16 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9887331B2 (en) 2010-03-30 2018-02-06 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9966517B2 (en) 2010-03-30 2018-05-08 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
JP2012028630A (ja) * 2010-07-26 2012-02-09 Dainippon Printing Co Ltd Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
US9773960B2 (en) 2010-11-02 2017-09-26 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
JP2015185619A (ja) * 2014-03-20 2015-10-22 日立マクセル株式会社 半導体装置用基板、当該基板の製造方法、半導体装置、及び半導体装置の製造方法
JP2015065470A (ja) * 2014-12-08 2015-04-09 日亜化学工業株式会社 発光装置の製造方法
JP2015133524A (ja) * 2015-04-23 2015-07-23 日亜化学工業株式会社 光半導体装置及びその製造方法
JP2016029747A (ja) * 2015-12-01 2016-03-03 大日本印刷株式会社 Ｌｅｄ素子載置部材、ｌｅｄ素子載置基板およびその製造方法、ならびにｌｅｄ素子パッケージおよびその製造方法

Also Published As

Publication number Publication date
US20060131708A1 (en) 2006-06-22
JP2013016819A (ja) 2013-01-24

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