CN100530627C - 封装、其制造方法及其应用 - Google Patents

封装、其制造方法及其应用 Download PDF

Info

Publication number
CN100530627C
CN100530627C CNB2006800245110A CN200680024511A CN100530627C CN 100530627 C CN100530627 C CN 100530627C CN B2006800245110 A CNB2006800245110 A CN B2006800245110A CN 200680024511 A CN200680024511 A CN 200680024511A CN 100530627 C CN100530627 C CN 100530627C
Authority
CN
China
Prior art keywords
encapsulation
chip
packaging body
carrier
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006800245110A
Other languages
English (en)
Other versions
CN101218674A (zh
Inventor
J·W·威克普
N·J·A·范费恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN101218674A publication Critical patent/CN101218674A/zh
Application granted granted Critical
Publication of CN100530627C publication Critical patent/CN100530627C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J1/00—Containers specially adapted for medical or pharmaceutical purposes
    • A61J1/14—Details; Accessories therefor
    • A61J1/20—Arrangements for transferring or mixing fluids, e.g. from vial to syringe
    • A61J1/2093—Containers having several compartments for products to be mixed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J1/00—Containers specially adapted for medical or pharmaceutical purposes
    • A61J1/05—Containers specially adapted for medical or pharmaceutical purposes for collecting, storing or administering blood, plasma or medical fluids ; Infusion or perfusion containers
    • A61J1/10—Bag-type containers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J1/00—Containers specially adapted for medical or pharmaceutical purposes
    • A61J1/14—Details; Accessories therefor
    • A61J1/20—Arrangements for transferring or mixing fluids, e.g. from vial to syringe
    • A61J1/2003—Accessories used in combination with means for transfer or mixing of fluids, e.g. for activating fluid flow, separating fluids, filtering fluid or venting
    • A61J1/202—Separating means
    • A61J1/2024—Separating means having peelable seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/32—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging two or more different materials which must be maintained separate prior to use in admixture
    • B65D81/3261—Flexible containers having several compartments
    • B65D81/3266—Flexible containers having several compartments separated by a common rupturable seal, a clip or other removable fastening device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/40—Closed containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/80—Medical packaging
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B2230/00—Aspects of the final package
    • B65B2230/02—Containers having separate compartments isolated from one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81909—Post-treatment of the bump connector or bonding area
    • H01L2224/8192—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • General Health & Medical Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Hematology (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Credit Cards Or The Like (AREA)
  • Packages (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

一种柔性封装(100)，包括用于电耦合到外部部件的耦合装置(20)、具有面向耦合装置(20)且电耦合到其的接触焊盘(32)的芯片(30)、以及密封芯片(30)且附着到耦合装置(20)的电绝缘封装体(40)，所述封装体(40)和所述耦合装置(20)构成用于芯片(30)的基板。封装(100)还包括用于处理封装(100)的装置(50)。该装置(50)仅通过封装体(40)机械连接到耦合装置(20)。封装(100)适合组装到箔上，其可以附着到诸如安全纸的物品上或结合在该物品中。

Description

封装、其制造方法及其应用
技术领域
本发明涉及一种封装，其包括用于外部耦合的装置、芯片、以及密封芯片和所述用于外部耦合的装置的封装体，所述芯片的接触焊盘电耦合到所述用于外部耦合的装置。
本发明还涉及其制造方法。
本发明进一步涉及具有这种封装的箔以及包括这种具有封装的箔的物品，特别是安全纸。
背景技术
例如，可以由DE19630648A1获知这种封装以及这种物品。公知的这种物品是钞票。在这里用于外部耦合的装置是天线。在这里箔是具有金属图案的箔或金属箔，通常为了安全目的将其结合在钞票中。优选组装这种箔，因为其能够在钞票制造期间适当地结合到纸体中。另外，优选使用金属箔，这是因为其比较硬并且保护芯片不致破裂。在这里封装体为坚韧且耐冲击的物质。注意到还提到天线的其它可能性；可以将天线设置在芯片上，或者金属箔本身可以用作天线。
已知封装的缺点是结合到钞票中相对比较困难。封装体通常为环氧树脂，其在固化之后是硬的且具有相当的惰性。于是适当地粘合到金属箔上并不容易。仅在将芯片组装到箔之后提供封装体的备选方案看起来也不是很有效，因为通常在转移模塑工艺中提供环氧树脂，该工艺不能与这种箔一起有效地执行；即与箔的尺寸相比，封装体的尺寸相对较小。此外，模塑工艺要求处在150-200℃或更高的数量级上的温度，并且不清楚箔能否经受住在这种温度下的处理。
发明内容
因此，本发明的第一个目的是提供一种封装，其能够以改进的、更为适当的方式组装到这种箔上。
本发明的第二个目的是提供一种制造这种封装的方法。
第一个目的是通过柔性封装来实现的，该封装包括用于电耦合到外部部件的耦合装置，并包括具有面向耦合装置且电耦合到其的接触焊盘的芯片，且包括密封芯片且附着到耦合装置的电绝缘封装体，所述封装体和所述耦合装置构成用于芯片的基板，并且所述柔性封装还包括用于处理的装置，其仅通过封装体机械连接到用于外部耦合的装置。
第二目的之所以能够实现，是因为该方法包括如下步骤：
提供具有载体层和限定耦合装置的导电迹线的图案的载体；
将芯片组装到载体，其中所述芯片的接触焊盘电耦合到所述载体的耦合装置；
提供密封芯片并在载体的至少一个表面上延伸的封装体，以及
部分除去载体层，使得耦合装置可以用于将封装电耦合到外部部件，并且使得保留用于处理封装的装置，该装置仅通过封装体机械附着到所述导电迹线。
根据本发明，封装是柔性的，并且该组装只所以能够实现，是因为封装设有处理装置。具体地，根据该方法，载体包括在封装期间被部分除去的载体层，而其部分用作处理装置。
柔性允许封装按照叠置柔性箔的工艺来进行组装，该工艺比在箔上提供坚硬部分更容易。本发明的封装可以被看作为连续的或半连续的箔。因为在形成封装体之后除去载体层，所以由封装体形成封装的主体。该封装体不坚硬且通常包括有机材料，且以此与箔类似等。相反地，现有技术的封装仅为微小的分立部件。在现有技术中需要小尺寸，因为大尺寸的坚硬的现有技术的封装在以其它方式而柔软的钞票中是不利的。
可以注意到，本发明的封装甚至可以是箔的原因在于单独的封装不彼此分离。在一个实施例中，甚至能够按照基于具有相同形式的两个连续箔的卷轴到卷轴工艺来执行封装与箔的组装。
明显的缺点是对于柔性封装，对准更加困难。然而，当将封装与箔组装时，通常不需要这种高分辨率。此外，处理装置允许对箔上的封装进行处理并且还允许进行定位。没有这种处理装置，集成电路或封装体用作处理装置。然而，如果封装体完全是一个主体且芯片在其内部，则其是柔性体。这里，施加力可能导致封装体与芯片或耦合装置分层，或可能导致芯片上的意外的力。如果以其它方式使得使用芯片作为处理装置更容易，则施加到芯片的力也会施加在耦合装置与芯片之间的连接上。这可以为粘合层，但通常包括焊球，由于它们的小尺寸，其固有地比较脆弱。
此外可以注意到，处理装置在引线框架领域是公知的，事实上作为引线框架的框架部分。然而，该框架不是任何单独封装的部件。
还可以注意到，制造其中载体层被全部或部分除去的封装的方法本身是公知的，例如从JP-A 59-208756中获知。然而，其中没有建议封装是柔性的或设有处理装置。为了清楚起见，可以注意到，在本申请的文本中，可以将术语‘柔性’理解为允许在不需要施加大应力的情况下使封装弯曲。
允许柔性的封装体本身是公知的，适当的材料例如为聚酰亚胺。在一个实施例中，封装体仅仅是密封层。作为厚度减小的结果，这提供了良好的柔性。另外，可以在对封装进行组装之后切割密封层，以便除去处理装置。此外，这种密封层不会使封装增加额外的高度。
用于密封层的优选材料是派拉纶(parylene)。派拉纶是特定系列的热塑性聚合物的通用名，所述热塑性聚合物是通过使用对二甲苯的二聚物(二对二甲苯或DPXN)来沉积的。可以在室温下由气相在真空条件下沉积派拉纶。有三种类型的可在商业上获得的派拉纶，但是能够想到更多的类型。基本的一种是聚对二甲苯(还被称为派拉纶N)，线性且高度结晶的聚合物，该聚合物展现出低损耗和高电介质强度。第二种类型，派拉纶C，具有对二甲苯单体，该单体具有替换派拉纶N中的芳香氢原子中的一个的氯原子。派拉纶还具有对湿气和其它腐蚀性气体的低渗透性。派拉纶D，该系列的第三种类型，也具有对二甲苯单体，但其具有替换派拉纶N的单体中的两个芳香氢原子的两个氯原子。派拉纶D具有与派拉纶C相似的特性，具有承受更高温度的能力。
耦合装置优选包括用于无线传送能量和数据的天线。这种天线可以是偶极天线或电感器，如本身所公知的那样。外部部件则特别是读出装置。可选择地或附加地，耦合装置可以包括用于与外部部件电流接触的接触焊盘。这通常可以是任何类型的电路板或插座。
优选地，处理装置至少存在于封装的两个相对侧上，即在截面图中芯片的左侧和右侧。可以将处理装置实施为栅，但可选择地将其实施为立方块。在后一种情况下，看来适合应用多个块。例如可以在封装的每一个角中设置块。如果需要，当然可以使用不同形状的处理装置，例如星形、十字形、三角形、L-形、T-形等等。
处理装置的尺寸取决于使用中的处理设备。通常，块的最短尺寸例如为大约10微米，但横向方向上的最短尺寸还可以是100微米或甚至更大。特别在与本发明的方法的结合中，厚度取决于载体层的厚度。当使用金属箔时，该厚度适合处在30到100微米的数量级上。当使用聚合物箔时，其可以更大。然而，优选金属，这是因为金属具有相对较大的质量且其是硬的。因此，其非常适合用作载体层并且还适合用作处理装置。此外，处理装置的金属主要允许使用用于处理的先进工具，例如真空、电磁力等。
在本发明的另一实施例中，将处理装置限定为存在于箔的相对侧上，其中需要将封装附着到所述箔上。这里，处理装置为有效的定位装置。关于相对侧，这里特别是指侧表面。因此，处理装置在组装后位于箔的左侧和右侧。或者，箔可以设有处理装置安装在其中的空腔或通孔。
在与箔组装之后，可以除去处理装置。然而，这并非绝对必要，而且在处理装置位于空腔或通孔中的情况下甚至可能是难处理的。在将多个封装附着到一张箔上使得处理装置在左侧和右侧的情况下，可以在单个切割操作中将这些处理装置除去。
其中限定处理装置使其位于箔的左侧和右侧的实施例特别优选与耦合装置仅限定在载体层的顶部上的情况相结合。当使用金属载体层时，基本上有两个不同的利用可除去的载体层的封装制造的实施例。在一个实施例中，例如由JP-A59-208756获知，导电迹线的图案-且因此耦合装置-仅仅存在于载体层的顶部上。然后除处理装置以外将全部的载体层除去。在这种情况下，处理装置从封装体突出超过耦合装置。如果将处理装置设置成与箔相邻，则封装基本上平坦地位于箔上。
在可选实施例中，例如由US 6451627获知，仅部分除去载体层。对其进行有效的构图以构成耦合装置的部分。在该实施例中，处理装置不会突出超过耦合装置。然而，由于耦合装置与处理装置之间的足够的横向距离，可以弯折封装体以便平坦地位于箔上。然而该实施例不是优选的，因为封装的总厚度将增加。
在另一实施例中，封装体在耦合装置之间的孔中延伸使得其在耦合装置背对芯片的一侧上暴露出来。这种延伸具有的第一个优点是，实现了将耦合装置适当地附着到封装体。第二个优点是，这为箔与封装体之间的附着提供了附加位置。通常地，有机材料的彼此附着好于金属与有机材料箔之间的附着。因此，在附着不太强的较大区域之间的附加附着位置对于整个附着是有益的。
可以注意到适当地向后减薄芯片以减小总的厚度并增加柔性。从WO-A2005/29578中获知一个非常薄的芯片的实例。在减薄和部分除去基板之后，该芯片可以在其正面和其背面上都设有树脂层。这种芯片可以有效地与本发明的密封层实施例结合使用。芯片已经设有保护层，且因此整个封装体是多余的并仅导致不希望有的厚度增加。虽然在半导体衬底(例如硅)的基础上适当地制造芯片，但是不排除在有机半导体材料的基础上对其进行限定。
本发明还涉及封装与箔的组装，涉及封装与箔的最终组件，并且涉及其中结合有这种具有封装的箔的物品。该物品的优点是最终的封装可以非常薄且适当地附着到处理箔上。因此，可以将箔卷起就好像没有封装附着到其上。
如果该物品是安全纸，例如钞票、护照、支票或票证，则箔适合为安全丝，如本身为安全纸领域的普通技术人员所公知的那样。或者，箔可以是用于光学有源元件的承载箔。优选对安全线进行构图以便耦合装置与该线的金属电绝缘。可选择地或附加地，可以施加电绝缘材料层以覆盖暴露出来的耦合装置。例如可以在除去载体层之后施加这种层。电绝缘材料层可以是箔。于是之后该箔将仅与安全线结合。
对于标签应用，更为优选的是使用柔性封装体而不仅仅是密封层。然后可以利用封装体将封装组装到箔上，使得耦合装置将背对箔。这会产生略微较厚的封装，但其中将芯片嵌入在封装体中。
附图说明
将参考附图进一步说明这些和其它方案，其中：
图1-6通过截面图示出在本发明的封装的制造中的几个阶段。
具体实施方式
附图完全是概略性的且未按比例绘制。不同附图中的相同参考标记表示相同或相应的部件。附图旨在示例性的目的，并且备选方案在说明书的基础上对于技术人员而言是清楚的。
图1示出具有载体层11和顶层12的载体10。载体层11在这种情况下包括铝且具有大约30微米的厚度。顶层12包括厚度大约为1-20微米的铜，并且在该例中厚度大约为2微米。
图2示出在对顶层12进行构图以产生耦合装置20之后的载体10。例如耦合装置构成天线。在该例中，这些耦合装置还将暴露出来且用作用于电流耦合的接触焊盘。对于顶层12的构图，可以使用由构成可焊接的界面的材料制成的掩模，所述材料例如为NiAu、NiPd、NiAuPd、Au等。
图3示出其中在载体层11中执行蚀刻处理的附加步骤之后的载体。这产生耦合装置20之下的一些钻蚀(underetch)，以及限定在顶层12中的任何其它图案。
虽然例子示出了以Al-Cu为基础的载体10，其中通过蚀刻限定顶层12中的图案，但众所周知的是存在几种可选方案。如果存在中间阻挡层，例如由Ni、Mb、Ti或甚至Al制成，则顶层12和载体层11可以由Cu限定。如果载体层10经受得住在键合和封装期间使用的温度和条件，则载体层10还可以由适当的非金属材料制成。这些条件不必很严格。可以在电镀工艺中而不是在蚀刻工艺中提供耦合装置20和顶层12中的任何其它导电图案。另外，载体10可以在其底侧上设有分离的掩模，例如由适当的金属构成，使得在芯片的组装之后不需要额外的光刻步骤的情况下可以对载体层11进行构图。实际上，已经对载体层10进行构图以限定环绕处理装置的沟槽。这允许在剥离工艺中而不是在蚀刻工艺中除去载体层10。
图4示出在将芯片30组装到载体10之后的阶段中的封装100。在该例中，利用在芯片30的接触焊盘32与限定为耦合装置20的一部分或连接到其的接触焊盘22之间延伸的焊球31沿倒装片的方向将芯片30组装到载体10。然而，可以使用各向异性导电胶。另一种选择是使用电介质胶。然后利用电容耦合确立耦合装置20与芯片30之间的电耦合。虽然在这里没有示出，但是可以使用底填材料来填充芯片30与载体10之间的间隙。尽管的确不是优选的，但是也并不排除将芯片30面朝上地组装到载体10，并且耦合设有键合引线或分离的箔。
图5示出提供封装体40之后的封装100。在该实施例中封装体为由派拉纶构成的密封层。通过化学汽相沉积且之后在增高的温度下进行固化来提供该密封层。这里，密封层40不仅在芯片的背面33上延伸，而且还在其正面34上和焊球31周围延伸。
图6示出选择性除去载体层11之后的封装100。这里，提供处理装置50，其仅通过封装体40连接到封装100的其余部分。现在封装体与耦合装置20构成用于芯片30的基板。由于仅在顶层中限定耦合装置20，所以处理装置50有效地形成突出。当组装到箔时，处理装置50优选存在于箔的两个相对侧表面上。然后可以除去处理装置50，并且可以将箔结合在任何物品中或附着到任何物品上，所述物品例如为安全纸。

Claims (16)

1、一种柔性封装，包括：用于电耦合到外部部件的耦合装置；具有面向所述耦合装置且电耦合到其的接触焊盘的芯片；以及密封所述芯片且附着到所述耦合装置的电绝缘封装体，所述封装体和所述耦合装置构成用于所述芯片的基板，其中存在用于处理所述封装的装置，其仅通过所述封装体机械连接到所述耦合装置。
2、如权利要求1所述的封装，其中所述封装体为密封层。
3、如权利要求1所述的封装，其中所述用于外部耦合的装置包括用于无线传输的天线。
4、如权利要求1所述的封装，其中所述用于处理的装置至少存在于所述封装的两个相对侧上。
5、如权利要求4所述的封装，其中将所述处理装置限定为存在于箔的相邻侧上，需要将所述封装附着到所述箔上。
6、如权利要求1或2所述的封装，其中所述封装体在所述耦合装置之间的孔中延伸，使得其在所述耦合装置背对所述芯片的一侧上暴露出来。
7、一种制造用于芯片的柔性封装的方法，包括以下步骤：
提供具有载体层和限定耦合装置的导电迹线的图案的载体；
将所述芯片组装到所述载体，其中所述芯片的接触焊盘电耦合到所述载体的所述耦合装置；
提供密封所述芯片并在所述载体的至少一个表面上延伸的封装体，以及
部分除去所述载体层，使得所述耦合装置可以用于将所述封装电耦合到外部部件，并且使得保留用于处理所述封装的装置，该装置仅通过所述封装体机械附着到所述导电迹线。
8、如权利要求7所述的方法，其中所述封装体为密封层。
9、如权利要求7所述的方法，其中附着所述芯片，使该芯片的接触焊盘面向所述载体的接触焊盘。
10、如权利要求8所述的方法，其中所述密封层包括派拉纶。
11、一种将封装组装到柔性箔的方法，包括：
提供如权利要求1-6中任意一项所述的封装，以及
将所述封装附着到所述箔上。
12、如权利要求11所述的方法，其中在附着步骤之后除去所述用于处理所述封装的装置。
13、一种如权利要求1-6中任意一项所述的封装和箔的组件。
14、一种封装和箔的组件，所述封装包括：具有用于外部耦合的装置的载体；附着到所述载体的芯片，该芯片的接触焊盘面向所述载体并电耦合到所述载体；以及密封所述芯片且附着到所述载体的封装体，所述封装体在所述载体中的孔中延伸，所述箔附着到所述载体和在其孔中延伸的所述封装体。
15、一种包括如权利要求14和15中任意一项所述的组件的物品。
16、如权利要求15所述的物品，其中所述物品为安全纸。
CNB2006800245110A 2005-07-07 2006-07-04 封装、其制造方法及其应用 Expired - Fee Related CN100530627C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05106169 2005-07-07
EP05106169.5 2005-07-07

Publications (2)

Publication Number Publication Date
CN101218674A CN101218674A (zh) 2008-07-09
CN100530627C true CN100530627C (zh) 2009-08-19

Family

ID=37461404

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006800245110A Expired - Fee Related CN100530627C (zh) 2005-07-07 2006-07-04 封装、其制造方法及其应用

Country Status (7)

Country Link
US (1) US20100140778A1 (zh)
EP (1) EP1905079A2 (zh)
JP (1) JP2008545265A (zh)
KR (1) KR20080023721A (zh)
CN (1) CN100530627C (zh)
TW (1) TW200709361A (zh)
WO (1) WO2007007233A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2696312A4 (en) * 2011-04-07 2015-04-22 Nethom WIRELESS IDENTIFICATION LABEL, ELECTRONIC PRODUCT PCB INCLUDING THE LABEL, AND ELECTRONIC PRODUCT MANAGEMENT SYSTEM
US20150001700A1 (en) * 2013-06-28 2015-01-01 Infineon Technologies Ag Power Modules with Parylene Coating
DE102016106137B4 (de) * 2016-04-04 2023-12-28 Infineon Technologies Ag Elektronikvorrichtungsgehäuse umfassend eine dielektrische Schicht und ein Kapselungsmaterial
US10177057B2 (en) 2016-12-15 2019-01-08 Infineon Technologies Ag Power semiconductor modules with protective coating
US10083911B2 (en) * 2017-02-08 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208756A (ja) * 1983-05-12 1984-11-27 Sony Corp 半導体装置のパツケ−ジの製造方法
US4604519A (en) * 1983-05-13 1986-08-05 Rca Corporation Intensified charge coupled image sensor having an improved CCD support
JPH0483366A (ja) * 1990-07-25 1992-03-17 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP2967697B2 (ja) * 1994-11-22 1999-10-25 ソニー株式会社 リードフレームの製造方法と半導体装置の製造方法
DE19630648A1 (de) * 1996-07-30 1998-02-05 Diehl Gmbh & Co Geldschein
JPH11163022A (ja) * 1997-11-28 1999-06-18 Sony Corp 半導体装置、その製造方法及び電子機器
JP2000183223A (ja) * 1998-12-16 2000-06-30 Dainippon Printing Co Ltd 配線部材の製造方法と配線部材
US6451627B1 (en) * 1999-09-07 2002-09-17 Motorola, Inc. Semiconductor device and process for manufacturing and packaging a semiconductor device
JP3537400B2 (ja) * 2000-03-17 2004-06-14 松下電器産業株式会社 半導体内蔵モジュール及びその製造方法
US6709886B2 (en) * 2000-04-25 2004-03-23 Umachines, Inc. Method of fabricating micromachined devices
US7176055B2 (en) * 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
US6873039B2 (en) * 2002-06-27 2005-03-29 Tessera, Inc. Methods of making microelectronic packages including electrically and/or thermally conductive element
JP2004311788A (ja) * 2003-04-08 2004-11-04 Matsushita Electric Ind Co Ltd シート状モジュールとその製造方法
DE10334578A1 (de) * 2003-07-28 2005-03-10 Infineon Technologies Ag Chipkarte, Chipkartenmodul sowie Verfahren zur Herstellung eines Chipkartenmoduls
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben

Also Published As

Publication number Publication date
EP1905079A2 (en) 2008-04-02
CN101218674A (zh) 2008-07-09
US20100140778A1 (en) 2010-06-10
TW200709361A (en) 2007-03-01
WO2007007233A2 (en) 2007-01-18
JP2008545265A (ja) 2008-12-11
WO2007007233A3 (en) 2007-07-05
KR20080023721A (ko) 2008-03-14

Similar Documents

Publication Publication Date Title
US11270965B2 (en) Semiconductor device with thin redistribution layers
CN106997870B (zh) 嵌入式封装
US10734249B2 (en) Package structure and method thereof
US8916421B2 (en) Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US9437459B2 (en) Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure
US9142502B2 (en) Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US9478484B2 (en) Semiconductor packages and methods of formation thereof
US8435837B2 (en) Panel based lead frame packaging method and device
TW200814288A (en) Semiconductor device and manufacturing method thereof
US9929072B2 (en) Packaged semiconductor devices
US11233028B2 (en) Chip packaging method and chip structure
US9589906B2 (en) Semiconductor device package and method of manufacturing the same
CN100530627C (zh) 封装、其制造方法及其应用
US10490470B2 (en) Semiconductor package and method for fabricating a semiconductor package
TW200835047A (en) Integrated circuit device having antenna conductors and the mothod for the same
US10818805B2 (en) Semiconductor sensor device and method for fabricating the same
US10699991B2 (en) Packaged light emitting devices including electrode isolation structures and methods of forming packaged light emitting devices including the same
US8785253B2 (en) Leadframe for IC package and method of manufacture
US8951841B2 (en) Clip frame semiconductor packages and methods of formation thereof
US20080073762A1 (en) Semiconductor device package
US20180218992A1 (en) Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a Semiconductor Device
US20120074561A1 (en) Backmetal replacement for use in the packaging of integrated circuits
KR20090113740A (ko) 반도체 패키지 및 그 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090819

Termination date: 20110704