JP2006168365A - 接着強度が改善した銅張積層板の製造装置およびその方法 - Google Patents
接着強度が改善した銅張積層板の製造装置およびその方法 Download PDFInfo
- Publication number
- JP2006168365A JP2006168365A JP2005360712A JP2005360712A JP2006168365A JP 2006168365 A JP2006168365 A JP 2006168365A JP 2005360712 A JP2005360712 A JP 2005360712A JP 2005360712 A JP2005360712 A JP 2005360712A JP 2006168365 A JP2006168365 A JP 2006168365A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- liquid crystal
- crystal polymer
- copper foil
- thermoplastic liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
- B32B2038/168—Removing solvent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/31—Heat sealable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/582—Tearability
- B32B2307/5825—Tear resistant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1007—Running or continuous length work
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
【解決手段】銅箔表面に熱可塑性液晶高分子溶液を薄くコーティングするコーティング手段と、前記コーティングされた液晶高分子溶液を乾燥させて溶媒を除去する溶媒除去手段と、熱可塑性液晶高分子フィルムと前記銅箔を加熱ロールで積層しながら熱圧着することで銅張積層板を完成する熱圧着手段とを備える。
【選択図】図3
Description
302 熱可塑性液晶高分子フィルム供給ロール
303 銅張積層板保管ロール
310 銅箔
312 熱可塑性液晶高分子フィルム
324 加熱部
320、322 加熱ロール
326a、326b、326c 移送ロール
328 コーティング部
Claims (11)
- 銅箔表面に熱可塑性液晶高分子溶液を薄くコーティングするコーティング手段と;
前記コーティングされた液晶高分子溶液を乾燥させて溶媒を除去する溶媒除去手段と;
熱可塑性液晶高分子フィルムと前記銅箔を加熱ロールで積層しながら熱圧着することで銅張積層板を完成する熱圧着手段と;
を備えてなることを特徴とする、銅張積層板の製造装置。 - 前記コーティング手段は、
粗さの形成された銅箔に熱可塑性液晶高分子溶液をキャスティングしてコーティングするコーティング部と;
銅箔供給ロールから供給される銅箔をコーティング部に移送するための銅箔移送ロールと;
を含むことを特徴とする、請求項1に記載の銅張積層板の製造装置。 - 前記溶媒除去手段は、第1温度で第1所定時間予備乾燥させた後、第2温度で第2所定時間完全乾燥させることにより、溶媒を除去することを特徴とする、請求項1に記載の銅張積層板の製造装置。
- 前記第1温度は50〜100℃であり、前記第1所定時間は30分〜2時間であり、前記第2温度は250〜300℃であり、第2所定時間は1〜4時間であることを特徴とする、請求項3に記載の銅張積層板の製造装置。
- 前記熱圧着手段は、熱変形温度以上で1〜5m/分の速度および1〜10MPaの圧力で熱圧着を行うことにより、銅張積層板を完成することを特徴とする、請求項1に記載の銅張積層板の製造装置。
- 前記コーティング手段が使用する熱可塑性液晶高分子溶液は、熱膨張係数(CTE)を減少させるフィラーを含むことを特徴とする、請求項1に記載の銅張積層板の製造装置。
- 粗さの形成された銅箔表面に熱可塑性液晶高分子溶液を薄くコーティングする第1段階と;
前記コーティングされた液晶高分子溶液を乾燥させて溶媒を除去する第2段階と;
熱可塑性液晶高分子フィルムと前記銅箔を加熱ロールで積層しながら熱圧着することで銅張積層板を完成する第3段階と;
を含んでなることを特徴とする、銅張積層板の製造方法。 - 前記第1段階は、
銅箔供給ロールから供給される銅箔をコーティング部に移送する第1−1段階と;
前記粗さの形成された銅箔に熱可塑性液晶高分子溶液をキャスティングしてコーティングする第1−2段階と;
を含むことを特徴とする、請求項7に記載の銅張積層板の製造方法。 - 前記第2段階は、
溶媒除去手段が第1温度で第1所定時間予備乾燥させる第2−1段階と;
前記溶媒除去手段が第2温度で第2所定時間完全乾燥させることで溶媒を除去する第2−2段階と;
を含むことを特徴とする、請求項7に記載の銅張積層板の製造方法。 - 前記第3段階の熱圧着過程は、熱変形温度以上で1〜5m/分の速度および1〜10MPaの圧力で熱圧着することを特徴とする、請求項7に記載の銅張積層板の製造方法。
- 前記熱可塑性液晶高分子溶液は、熱膨張係数(CTE)を減少させるフィラーを含むことを特徴とする、請求項7に記載の銅張積層板の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040106433A KR100688824B1 (ko) | 2004-12-15 | 2004-12-15 | 접착강도가 개선된 동박적층판의 제조 장치 및 그 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006168365A true JP2006168365A (ja) | 2006-06-29 |
JP4159578B2 JP4159578B2 (ja) | 2008-10-01 |
Family
ID=36582412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005360712A Expired - Fee Related JP4159578B2 (ja) | 2004-12-15 | 2005-12-14 | 接着強度が改善した銅張積層板の製造装置およびその方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060124228A1 (ja) |
JP (1) | JP4159578B2 (ja) |
KR (1) | KR100688824B1 (ja) |
CN (1) | CN1820942B (ja) |
TW (1) | TWI268209B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010254793A (ja) * | 2009-04-24 | 2010-11-11 | Sulfur Chemical Institute Inc | 樹脂複合体の製造方法及び樹脂複合体 |
JP2014111699A (ja) * | 2012-12-05 | 2014-06-19 | Primatec Inc | 液晶ポリマーフィルムの製造方法および液晶ポリマーフィルム |
KR20170048754A (ko) * | 2015-10-27 | 2017-05-10 | 엘에스엠트론 주식회사 | 연성인쇄회로기판의 치수안정성을 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름 |
JP2021512214A (ja) * | 2018-02-01 | 2021-05-13 | エスケー ネクシリス カンパニー リミテッド | 高温寸法安全性及び集合組職安全性を有する電解銅箔及びその製造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7807001B2 (en) * | 2007-06-28 | 2010-10-05 | Eastman Kodak Company | Lamination device method for flexographic plate manufacturing |
KR100991756B1 (ko) | 2007-12-17 | 2010-11-03 | (주)인터플렉스 | 양면 연성인쇄회로기판의 제조방법 |
CN102514348B (zh) * | 2012-01-09 | 2014-07-23 | 郭长奇 | 高导热金属基覆铜板制作方法 |
CN103293096B (zh) * | 2012-03-02 | 2016-01-27 | 富葵精密组件(深圳)有限公司 | 固定装置及剥离强度测试装置 |
KR101586679B1 (ko) * | 2014-09-04 | 2016-01-22 | 정병직 | 치수 안정성이 우수한 동박적층판 제조 장치 및 그 제조 방법 |
KR101576252B1 (ko) * | 2014-09-04 | 2015-12-14 | 정병직 | 다단 예열 및 다단 에어 블로잉 방식을 이용한 동박적층판 제조 장치 및 그 제조 방법 |
CN113580690B (zh) * | 2016-03-08 | 2023-12-08 | 株式会社可乐丽 | 覆金属层叠板 |
TWI647261B (zh) | 2018-02-06 | 2019-01-11 | 佳勝科技股份有限公司 | 液晶聚合物薄膜及具有液晶聚合物薄膜之軟性銅箔基板的製造方法 |
JP7217423B2 (ja) * | 2018-09-26 | 2023-02-03 | パナソニックIpマネジメント株式会社 | 積層板の製造方法、プリント配線板の製造方法及び積層板製造装置 |
WO2020095988A1 (ja) | 2018-11-08 | 2020-05-14 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板 |
CN109661111A (zh) * | 2018-12-18 | 2019-04-19 | 深圳市信维通信股份有限公司 | 基于液晶聚合物薄膜的柔性覆铜板及其制作方法 |
CN111901977A (zh) * | 2020-06-22 | 2020-11-06 | 深圳市信维通信股份有限公司 | 液晶聚合物扰性覆铜板的制备方法 |
US11217551B1 (en) | 2021-03-23 | 2022-01-04 | Chung W. Ho | Chip package structure and manufacturing method thereof |
CN113858603A (zh) * | 2021-09-13 | 2021-12-31 | 深圳市信维通信股份有限公司 | 一种聚合物挠性覆铜板的制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL137052C (ja) * | 1962-07-30 | |||
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
JP3356560B2 (ja) * | 1994-08-26 | 2002-12-16 | 鐘淵化学工業株式会社 | フレキシブル銅張積層フィルムとその製造方法 |
JPH0992997A (ja) * | 1995-09-25 | 1997-04-04 | Toshiba Chem Corp | 多層フレキシブル配線板用シールド板の製造方法 |
US5976699A (en) * | 1995-11-09 | 1999-11-02 | Sumitomo Bakelite Company Limited | Insulating adhesive for multilayer printed circuit board |
JPH09187882A (ja) * | 1996-01-08 | 1997-07-22 | Toshiba Chem Corp | 接着剤付フレキシブル片面銅張積層板およびその製造方法 |
JPH11279508A (ja) | 1998-03-31 | 1999-10-12 | Hitachi Chem Co Ltd | 接着剤付銅はくの製造方法及び銅張積層板の製造方法 |
MY126870A (en) * | 1999-10-26 | 2006-10-31 | Furukawa Sky Aluminium Corp | Resin-coated metal sheet for parts of electronic machinery and tools and production method thereof |
-
2004
- 2004-12-15 KR KR1020040106433A patent/KR100688824B1/ko not_active IP Right Cessation
-
2005
- 2005-12-07 US US11/297,831 patent/US20060124228A1/en not_active Abandoned
- 2005-12-07 TW TW094143146A patent/TWI268209B/zh not_active IP Right Cessation
- 2005-12-14 CN CN2005101305718A patent/CN1820942B/zh not_active Expired - Fee Related
- 2005-12-14 JP JP2005360712A patent/JP4159578B2/ja not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010254793A (ja) * | 2009-04-24 | 2010-11-11 | Sulfur Chemical Institute Inc | 樹脂複合体の製造方法及び樹脂複合体 |
JP2014111699A (ja) * | 2012-12-05 | 2014-06-19 | Primatec Inc | 液晶ポリマーフィルムの製造方法および液晶ポリマーフィルム |
KR20170048754A (ko) * | 2015-10-27 | 2017-05-10 | 엘에스엠트론 주식회사 | 연성인쇄회로기판의 치수안정성을 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름 |
KR102323903B1 (ko) | 2015-10-27 | 2021-11-08 | 에스케이넥실리스 주식회사 | 연성인쇄회로기판의 치수안정성을 향상시킬 수 있는 동박, 그 제조방법, 및 그것을 포함하는 연성동박적층필름 |
JP2021512214A (ja) * | 2018-02-01 | 2021-05-13 | エスケー ネクシリス カンパニー リミテッド | 高温寸法安全性及び集合組職安全性を有する電解銅箔及びその製造方法 |
US11346015B2 (en) | 2018-02-01 | 2022-05-31 | Kcf Technologies Co., Ltd. | Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor |
JP7083029B2 (ja) | 2018-02-01 | 2022-06-09 | エスケー ネクシリス カンパニー リミテッド | 高温寸法安全性及び集合組職安全性を有する電解銅箔及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060124228A1 (en) | 2006-06-15 |
CN1820942B (zh) | 2010-04-14 |
KR100688824B1 (ko) | 2007-03-02 |
CN1820942A (zh) | 2006-08-23 |
TW200621468A (en) | 2006-07-01 |
TWI268209B (en) | 2006-12-11 |
JP4159578B2 (ja) | 2008-10-01 |
KR20060067612A (ko) | 2006-06-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4159578B2 (ja) | 接着強度が改善した銅張積層板の製造装置およびその方法 | |
KR100584962B1 (ko) | 액정 중합체로 커버레이 성형된 경연성 인쇄회로기판 및그 제조 방법 | |
JP2009260228A (ja) | 絶縁シート、銅張積層板、及び印刷回路基板の製造方法並びにこれを用いた印刷回路基板 | |
WO2009064121A2 (en) | Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same | |
JP4642479B2 (ja) | Cof用積層板及びcofフィルムキャリアテープ | |
JP2002171030A (ja) | 配線基板およびその製造方法 | |
JP2012178601A (ja) | 金属積層板及びこれを用いたコア基板の製造方法 | |
KR100850760B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
JP2008085111A (ja) | 配線基板とその製造方法 | |
JP2015037184A (ja) | コア基板及びコア基板の製造方法 | |
JP2006160899A (ja) | 電気絶縁性基材および配線基板の製造方法 | |
KR101975450B1 (ko) | 표면처리된 절연필름을 포함하는 다층 인쇄회로기판의 제조방법 | |
JP2003086941A (ja) | プリント配線板 | |
JP2008177243A (ja) | 多層プリント配線板の製造方法 | |
KR20140032674A (ko) | 리지드 플렉시블 기판 제조방법 | |
KR101366870B1 (ko) | 이종 두께의 양면 fccl의 제조방법 | |
KR20090105046A (ko) | 액정고분자를 이용한 경연성 인쇄회로기판의 제조방법 | |
JP5549853B2 (ja) | マルチワイヤ配線板及びその製造方法 | |
JP2011166098A (ja) | 基板製造装置及び製造方法 | |
KR20110060624A (ko) | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 | |
JP2009094330A (ja) | 配線基板用基材及び配線基板用基材の製造方法 | |
JPH11274720A (ja) | 多層積層板の製造方法 | |
JP2005268690A (ja) | 多層回路基板の製造方法 | |
JPH05121876A (ja) | 多層プリント配線板の製造方法 | |
JPH11266080A (ja) | 多層プリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080708 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080715 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110725 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110725 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120725 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130725 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |