CN102514348B - 高导热金属基覆铜板制作方法 - Google Patents
高导热金属基覆铜板制作方法 Download PDFInfo
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- CN102514348B CN102514348B CN201210003238.0A CN201210003238A CN102514348B CN 102514348 B CN102514348 B CN 102514348B CN 201210003238 A CN201210003238 A CN 201210003238A CN 102514348 B CN102514348 B CN 102514348B
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- prepared
- preparation
- adhesive coated
- thermal conductivity
- high thermal
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 8
- 229910052582 BN Inorganic materials 0.000 claims abstract description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 7
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 238000009966 trimming Methods 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 239000011888 foil Substances 0.000 claims description 28
- 238000002360 preparation method Methods 0.000 claims description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 235000012254 magnesium hydroxide Nutrition 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 11
- 239000011229 interlayer Substances 0.000 abstract description 5
- 229910001862 magnesium hydroxide Inorganic materials 0.000 abstract description 4
- 239000000347 magnesium hydroxide Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000003892 spreading Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210003238.0A CN102514348B (zh) | 2012-01-09 | 2012-01-09 | 高导热金属基覆铜板制作方法 |
Applications Claiming Priority (1)
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CN201210003238.0A CN102514348B (zh) | 2012-01-09 | 2012-01-09 | 高导热金属基覆铜板制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN102514348A CN102514348A (zh) | 2012-06-27 |
CN102514348B true CN102514348B (zh) | 2014-07-23 |
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CN201210003238.0A Expired - Fee Related CN102514348B (zh) | 2012-01-09 | 2012-01-09 | 高导热金属基覆铜板制作方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103044709A (zh) * | 2012-12-28 | 2013-04-17 | 大连亚泰科技新材料股份有限公司 | 一种镁系复配阻燃剂的制备方法及在铝基覆铜板中的应用 |
CN103232683B (zh) * | 2013-05-16 | 2015-04-08 | 曾昭峰 | 适用于层压板的高填料环氧树脂胶液及制备方法 |
CN105172262B (zh) * | 2015-07-24 | 2017-06-16 | 山东金宝电子股份有限公司 | 一种高cti、高导热复合基cem‑3覆铜板的制备方法 |
CN105172259A (zh) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | 高散热金属铝基覆铜板制作方法 |
CN105838028A (zh) * | 2016-03-25 | 2016-08-10 | 金安国纪科技(杭州)有限公司 | 一种高导热树脂组合物及其制备方法 |
CN108940797A (zh) * | 2018-08-10 | 2018-12-07 | 焦作市高森建电子科技有限公司 | 一种铝基覆铜板铜箔涂胶工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101418937A (zh) * | 2007-10-23 | 2009-04-29 | 周广永 | 一种led照明用高散热铝基覆铜箔层压板及其制造工艺 |
CN201436206U (zh) * | 2009-03-09 | 2010-04-07 | 珠海全宝电子科技有限公司 | 高导热型金属基覆铜箔层压板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100688824B1 (ko) * | 2004-12-15 | 2007-03-02 | 삼성전기주식회사 | 접착강도가 개선된 동박적층판의 제조 장치 및 그 방법 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101418937A (zh) * | 2007-10-23 | 2009-04-29 | 周广永 | 一种led照明用高散热铝基覆铜箔层压板及其制造工艺 |
CN201436206U (zh) * | 2009-03-09 | 2010-04-07 | 珠海全宝电子科技有限公司 | 高导热型金属基覆铜箔层压板 |
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CN102514348A (zh) | 2012-06-27 |
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Owner name: SHAANXI CHANGSHI ELECTRONIC MATERIALS CO., LTD. Free format text: FORMER OWNER: GUO CHANGQI Effective date: 20150508 |
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Free format text: CORRECT: ADDRESS; FROM: 528234 FOSHAN, GUANGDONG PROVINCE TO: 715100 WEINAN, SHAANXI PROVINCE |
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Effective date of registration: 20150508 Address after: 715100 Weinan City, Shaanxi province Dali County Science and Technology Industrial Park (Guan Chi town) Patentee after: Shaanxi feldspar electronic Mstar Technology Ltd Address before: 528234, Foshan Guangdong Nanhai Lishui Town, Chi Chi Industrial Park Patentee before: Guo Changqi |
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Address after: 715100 Weinan City, Shaanxi province Dali County Science and Technology Industrial Park (Guan Chi town) Patentee after: SHAANXI CHANGSHI ELECTRONIC MATERIALS CO., LTD. Address before: 715100 Weinan City, Shaanxi province Dali County Science and Technology Industrial Park (Guan Chi town) Patentee before: Shaanxi feldspar electronic Mstar Technology Ltd |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20200109 |
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