CN102514348A - 高导热金属基覆铜板制作方法 - Google Patents
高导热金属基覆铜板制作方法 Download PDFInfo
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103044709A (zh) * | 2012-12-28 | 2013-04-17 | 大连亚泰科技新材料股份有限公司 | 一种镁系复配阻燃剂的制备方法及在铝基覆铜板中的应用 |
CN103232683A (zh) * | 2013-05-16 | 2013-08-07 | 曾昭峰 | 适用于层压板的高填料环氧树脂胶液及制备方法 |
CN105172259A (zh) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | 高散热金属铝基覆铜板制作方法 |
CN105172262A (zh) * | 2015-07-24 | 2015-12-23 | 山东金宝电子股份有限公司 | 一种高cti、高导热复合基cem-3覆铜板的制备方法 |
CN105838028A (zh) * | 2016-03-25 | 2016-08-10 | 金安国纪科技(杭州)有限公司 | 一种高导热树脂组合物及其制备方法 |
CN108940797A (zh) * | 2018-08-10 | 2018-12-07 | 焦作市高森建电子科技有限公司 | 一种铝基覆铜板铜箔涂胶工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20060124228A1 (en) * | 2004-12-15 | 2006-06-15 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and method for manufacturing copper clad laminate with improved peel strength |
CN101418937A (zh) * | 2007-10-23 | 2009-04-29 | 周广永 | 一种led照明用高散热铝基覆铜箔层压板及其制造工艺 |
CN201436206U (zh) * | 2009-03-09 | 2010-04-07 | 珠海全宝电子科技有限公司 | 高导热型金属基覆铜箔层压板 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060124228A1 (en) * | 2004-12-15 | 2006-06-15 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and method for manufacturing copper clad laminate with improved peel strength |
CN101418937A (zh) * | 2007-10-23 | 2009-04-29 | 周广永 | 一种led照明用高散热铝基覆铜箔层压板及其制造工艺 |
CN201436206U (zh) * | 2009-03-09 | 2010-04-07 | 珠海全宝电子科技有限公司 | 高导热型金属基覆铜箔层压板 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103044709A (zh) * | 2012-12-28 | 2013-04-17 | 大连亚泰科技新材料股份有限公司 | 一种镁系复配阻燃剂的制备方法及在铝基覆铜板中的应用 |
CN103232683A (zh) * | 2013-05-16 | 2013-08-07 | 曾昭峰 | 适用于层压板的高填料环氧树脂胶液及制备方法 |
CN103232683B (zh) * | 2013-05-16 | 2015-04-08 | 曾昭峰 | 适用于层压板的高填料环氧树脂胶液及制备方法 |
CN105172262A (zh) * | 2015-07-24 | 2015-12-23 | 山东金宝电子股份有限公司 | 一种高cti、高导热复合基cem-3覆铜板的制备方法 |
CN105172262B (zh) * | 2015-07-24 | 2017-06-16 | 山东金宝电子股份有限公司 | 一种高cti、高导热复合基cem‑3覆铜板的制备方法 |
CN105172259A (zh) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | 高散热金属铝基覆铜板制作方法 |
CN105838028A (zh) * | 2016-03-25 | 2016-08-10 | 金安国纪科技(杭州)有限公司 | 一种高导热树脂组合物及其制备方法 |
CN108940797A (zh) * | 2018-08-10 | 2018-12-07 | 焦作市高森建电子科技有限公司 | 一种铝基覆铜板铜箔涂胶工艺 |
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