CN106182989A - 板边流胶均匀的pcb层压板的加工方法、层压板及pcb板 - Google Patents
板边流胶均匀的pcb层压板的加工方法、层压板及pcb板 Download PDFInfo
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- 239000011889 copper foil Substances 0.000 claims description 24
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- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/022—Temperature vs pressure profiles
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- B32B2309/12—Pressure
- B32B2309/125—Pressure vs time profiles
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- B32—LAYERED PRODUCTS
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- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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Abstract
本发明公开了一种板边流胶均匀的PCB层压板的加工方法,包括以下步骤:(1)FR‑4外框制作;(2)取铜基芯板,将铜基芯板嵌入到步骤(1)制作出的FR‑4外框里面;(3)铆合与叠合;(4)压板,将铆合后的层压板进行压板,压板先热压后冷压。与现有的相比,本发明保护的板边流胶均匀的PCB层压板克服了现有技术中流胶不足及压合起泡的问题,保证了产品品质稳定性,降低了生产成本。
Description
技术领域
本发明属于PCB加工领域,特别涉及一种板边流胶均匀的PCB层压板的加工方法、层压板及PCB板。
背景技术
铜基芯板压合不同于常规四层板与多层板压合,如果用传统的压合结构方式进行压合,对PP含胶量,压合参数要求极高,且极易出现芯板边框绝缘区域流胶不足,压合气泡等不良现象,造成品质不良报废,增加生产成本。
目前行业内有引入树脂塞孔工艺方式进行改善,即用丝印的方式将树脂塞入芯板孔/槽内,高温固化后采取多次拉丝后将树脂与基铜拉平,再进行压合加工,但此工艺生产工序增多,生产效率低,生产成本增加。
树脂塞孔工艺在压合之前需对铜基芯板进行压干膜(或贴高温胶)、钻导气孔、丝印(塞树脂)、热固化、退干膜(或撕高温胶)和拉丝打磨,然后在进行铜基芯板、铜箔和绝缘板的叠加后压板,工艺非常复杂。
发明内容
本发明的目的之一就在于提供一种板边流胶均匀的PCB层压板的加工方法,该方法克服了现有技术中流胶不足及压合起泡的问题,保证了产品品质稳 定性,降低了生产成本。
本发明的技术方案是:板边流胶均匀的PCB层压板的加工方法,包括以下步骤:
(1)FR-4外框制作;
(2)取铜基芯板,将铜基芯板嵌入到步骤(1)制作出的FR-4外框里面;
(3)铆合与叠合;取2116高胶PP板和铜箔,从下到上依次叠放下铜箔、2116高胶PP板、套有FR-4外框的铜基芯板、2116高胶PP板、套有FR-4外框的铜基芯板、2116高胶PP板、套有FR-4外框的铜基芯板直到最后一片2116高胶PP板,最后再上面放上上铜箔,然后用铆钉进行铆合成层压板;
(4)压板,将铆合后的层压板进行压板,压板先热压后冷压。
作为优选,所述热压分8个阶段,第一阶段为在真空、温度140-160℃段、压板压力100PSI条件压10分钟,第二阶段为在真空、温度160-170℃、压板压力200PSI条件压10分钟,第三阶段为在真空、温度170-180℃、压板压力250PSI条件压10分钟,第四阶段为在真空、温度180-200℃、压板压力300PSI条件压10分钟,第五阶段为在真空、温度200-210℃、压板压力380PSI条件压10分钟,第六阶段为在真空、温度210-200℃、压板压力380PSI条件压5分钟,第七阶段为在真空、温度恒温200℃、压板压力380PSI条件压90分钟,第八阶段为在温度200-140℃、压板压力200PSI条件压10分钟。
作为优选,所述冷压条件为压板压力50kg/cm2,冷压时间:90min,冷压温度为15-35℃。
作为优选,所述步骤(1)包括以下步骤:
①取FR-4环氧板材,板材厚度比铜基芯板厚度小0.05-0.1mm;
②钻定位孔与铆钉孔;
③锣边框,锣出的边框恰好套在铜基芯板外,紧密贴合。
本发明的目的之二在于提供一种板边流胶均匀的PCB层压板。
技术方案是:一种板边流胶均匀的PCB层压板,所述PCB层压板包括上铜箔、下铜箔和铜基单元,该铜基单元贴合在上铜箔与下铜箔之间,铜基单元为1个以上,每个铜基单元由铜基芯板、FR-4外框、上绝缘片和下绝缘片组成,铜基芯板放置在FR-4外框内,上绝缘片与下绝缘片将铜基芯板和FR-4外框夹持在中间。
作为优选,所述铜基芯板上设置有芯孔,所述芯孔为蚀刻孔。
作为优选,所述上绝缘片和下绝缘片均为2116高胶PP板,2116高胶PP板含胶量为58%。
本发明的目的之二在于提供一种PCB板。
技术方案是:一种PCB板,该PCB板是由上述的板边流胶均匀的PCB层压板加工而来的。
与现有技术相比,本发明的有益效果在于:
本发明采用外框压合加工工艺,即压合时加入跟铜基芯板外型相匹配的FR-4材料(不含铜)外框,将铜基芯板嵌入进行压合,克服了现有技术中流胶不足及压合起泡的问题,保证了产品品质稳定性,降低了生产成本。
本发明在使用芯板外框及铜基芯板没有树脂塞孔的情况下,采用含胶量58%的2116高胶PP压合的方式,简化了生产流程,克服了现有技术中生产工序繁多,生产效率低的问题,降低了生产成本。
本发明采用外框压合加工工艺,在压板前不需要进行树脂塞孔工艺额外添 加的压干膜(或贴高温胶)、钻导气孔、丝印(塞树脂)、热固化、退干膜(或撕高温胶)和拉丝打磨工序,简化了工艺流程。
术语解释
铜基芯板-指铜基板
FR-4外框-指采用FR-4环氧板的外框
附图说明
图1是本发明内有1层铜基芯板(四层板)层压板结构示意图;
图2是本发明内有3层铜基芯板层压板结构示意图;
图3是本发明内有5层铜基芯板层压板结构示意图;
图4是本发明铜基芯板俯视图示意图;
图5是本发明铜基芯板截面示意图;
图6是本发明铜基芯板外框结构示意图;
图7是本发明绝缘板结构示意图。
具体实施方式
下面将结合附图对本发明作进一步说明。
实施例1
如图1-7所示,一种板边流胶均匀的PCB层压板,包括铜基单元、上铜箔3和下铜箔4,铜基单元位于上铜箔3与下铜箔4之间,铜基单元上、下表面 分别与上铜箔3与下铜箔4紧密贴合。
铜基单元有多个,每个铜基单元由铜基芯板1、FR-4外框2、上绝缘片6和下绝缘片7组成,铜基芯板1放置在FR-4外框2内,上绝缘片6与下绝缘片7将铜基芯板1和FR-4外框2夹持在中间,并相互贴合。
铜基芯板1与FR-4外框2相互吻合,铜基芯板1的凹部11,FR-4外框2对应则设置有相吻合的凸部22。
FR-4外框2上设置有铆钉孔21和定位孔23,铆钉孔21和定位孔23设置在框的四边上,铆钉孔21和定位孔23可相互通用,用于铆钉5穿过。铜基芯板1上设置有芯孔12,芯孔12为蚀刻孔或机械孔,其中蚀刻孔是根据申请号为201610740841.5(申请日为2016年08月26日,名称为PCB铜基板芯板无披锋孔的加工方法)的方法蚀刻而来的。
上绝缘片6和下绝缘片7均为2116高胶PP板,2116高胶PP板含胶量为58%。
上绝缘片6和下绝缘片7上也分别设置有铆钉孔21和定位孔23。
实施例2
一种实施例1板边流胶均匀的PCB层压板的加工方法,包括以下步骤:
(1)FR-4外框制作。
①取FR-4环氧板材,板材厚度比铜基芯板厚度小0.05-0.1mm。
②钻定位孔与铆钉孔。
③锣边框,锣出的边框恰好套在铜基芯板外,紧密贴合。
(2)取铜基芯板,将铜基芯板嵌入到步骤(1)制作出的FR-4外框里面。
(3)铆合与预叠
取2116高胶PP板和铜箔,从下到上依次叠放下铜箔、2116高胶PP板、套有FR-4外框的铜基芯板、2116高胶PP板、上铜箔,然后用铆钉进行铆合成层压板。
(4)压板。将铆合后的层压板进行压板,压板先热压后冷压。
①热压
热压分8个阶段,第一阶段为在真空、温度140-160℃段、压板压力100PSI条件压10分钟,第二阶段为在真空、温度160-170℃、压板压力200PSI条件压10分钟,第三阶段为在真空、温度170-180℃、压板压力250PSI条件压10分钟,第四阶段为在真空、温度180-200℃、压板压力300PSI条件压10分钟,第五阶段为在真空、温度200-210℃、压板压力380PSI条件压10分钟,第六阶段为在真空、温度210-200℃、压板压力380PSI条件压5分钟,第七阶段为在真空、温度恒温200℃、压板压力380PSI条件压90分钟,第八阶段为在温度200-140℃、压板压力200PSI条件压10分钟
②冷压
冷压条件为压板压力50kg/cm2,冷压时间:90min,冷压温度为15-35℃冷压的目的是释放热压后产生的内应力。
冷压后的板经检测合格后进入PCB线路板的下道工序继续生产。
将实施例2压板后的PCB层压板(1层铜基芯板)与采用常规压合方式(无FR-4外框、无树脂塞孔工艺的同样的1层铜基芯板)压板后的PCB层压板及采用经树脂塞孔工艺的PCB层压板(1层铜基芯板)进行比较,比较结果如下:
从上表可知:本发明大大缩短了铜基板压合工序的工艺流程,缩短了生产周期,从而提高了生产效率。树脂塞孔每生产100块板要多耗时24小时,流程长要多增加4个人的人工成本,且要增加塞树脂的材料成本(一公斤树脂480元,只能塞3平米的板,现在这个成本完全节省了。而常规板压合方式板边流胶不均,起泡。
Claims (8)
1.一种板边流胶均匀的PCB层压板的加工方法,包括以下步骤:
(1)FR-4外框制作;
(2)取铜基芯板,将铜基芯板嵌入到步骤(1)制作出的FR-4外框里面;
(3)铆合与预叠;取2116高胶PP板和铜箔,从下到上依次叠放下铜箔、2116高胶PP板、套有FR-4外框的铜基芯板、2116高胶PP板、套有FR-4外框的铜基芯板、2116高胶PP板、套有FR-4外框的铜基芯板直到最后一片2116高胶PP板,最后再上面放上上铜箔,然后用铆钉进行铆合成层压板;
(4)压板,将铆合后的层压板进行压板,压板先热压后冷压。
2.根据权利要求1所述的板边流胶均匀的PCB层压板的加工方法,其特征在于:所述热压分8个阶段,第一阶段为在真空、温度140-160℃段、压板压力100PSI条件压10分钟,第二阶段为在真空、温度160-170℃、压板压力200PSI条件压10分钟,第三阶段为在真空、温度170-180℃、压板压力250PSI条件压10分钟,第四阶段为在真空、温度180-200℃、压板压力300PSI条件压10分钟,第五阶段为在真空、温度200-210℃、压板压力380PSI条件压10分钟,第六阶段为在真空、温度210-200℃、压板压力380PSI条件压5分钟,第七阶段为在真空、温度恒温200℃、压板压力380PSI条件压90分钟,第八阶段为在温度200-140℃、压板压力200PSI条件压10分钟。
3.根据权利要求1或2所述的板边流胶均匀的PCB层压板的加工方法,其特征在于:所述冷压条件为压板压力50kg/cm2,冷压时间:90min,冷压温度为15-35℃。
4.根据权利要求1-3任一所述的板边流胶均匀的PCB层压板的加工方法,其特征在于所述步骤(1)包括以下步骤:
①取FR-4环氧板材,板材厚度比铜基芯板厚度小0.05-0.1mm;
②钻定位孔与铆钉孔;
③锣边框,锣出的边框恰好套在铜基芯板外,紧密贴合。
5.一种板边流胶均匀的PCB层压板,该PCB层压板由权利要求1-4任一权利要求制备而来,其特征在于:所述PCB层压板包括上铜箔、下铜箔和铜基单元,该铜基单元贴合在上铜箔与下铜箔之间,铜基单元为1个以上,每个铜基单元由铜基芯板、FR-4外框、上绝缘片和下绝缘片组成,铜基芯板放置在FR-4外框内,上绝缘片与下绝缘片将铜基芯板和FR-4外框夹持在中间。
6.根据权利要求5所述的板边流胶均匀的PCB层压板,其特征在于:所述铜基芯板上设置有芯孔,所述芯孔为蚀刻孔。
7.根据权利要求5所述的板边流胶均匀的PCB层压板,其特征在于:所述上绝缘片和下绝缘片均为2116高胶PP板,2116高胶PP板含胶量为58%。
8.一种PCB板,其特征在于,该PCB板是由权利要求5-7任一权利要求的板边流胶均匀的PCB层压板加工而来的。
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