JP2006143996A - 耐熱性樹脂 - Google Patents

耐熱性樹脂 Download PDF

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Publication number
JP2006143996A
JP2006143996A JP2005297734A JP2005297734A JP2006143996A JP 2006143996 A JP2006143996 A JP 2006143996A JP 2005297734 A JP2005297734 A JP 2005297734A JP 2005297734 A JP2005297734 A JP 2005297734A JP 2006143996 A JP2006143996 A JP 2006143996A
Authority
JP
Japan
Prior art keywords
resin
precursor
thermoplastic resin
elastic modulus
diamine compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005297734A
Other languages
English (en)
Japanese (ja)
Inventor
Hirofumi Fujii
弘文 藤井
Yoshio Terada
好夫 寺田
Kazumasa Igarashi
一雅 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2005297734A priority Critical patent/JP2006143996A/ja
Priority to PCT/JP2005/019219 priority patent/WO2006043599A1/ja
Priority to KR1020077011350A priority patent/KR101335117B1/ko
Priority to EP20050795381 priority patent/EP1803762A4/en
Priority to US11/665,772 priority patent/US20070293597A1/en
Priority to TW094136473A priority patent/TW200621851A/zh
Priority to CN2005800358805A priority patent/CN101044189B/zh
Publication of JP2006143996A publication Critical patent/JP2006143996A/ja
Priority to US12/350,764 priority patent/US8541099B2/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2822—Wax containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2005297734A 2004-10-19 2005-10-12 耐熱性樹脂 Pending JP2006143996A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2005297734A JP2006143996A (ja) 2004-10-19 2005-10-12 耐熱性樹脂
PCT/JP2005/019219 WO2006043599A1 (ja) 2004-10-19 2005-10-19 耐熱性樹脂
KR1020077011350A KR101335117B1 (ko) 2004-10-19 2005-10-19 내열성 수지
EP20050795381 EP1803762A4 (en) 2004-10-19 2005-10-19 HEAT-RESISTANT RESIN
US11/665,772 US20070293597A1 (en) 2004-10-19 2005-10-19 Heat-Resistant Resin
TW094136473A TW200621851A (en) 2004-10-19 2005-10-19 Heat-resistant resin
CN2005800358805A CN101044189B (zh) 2004-10-19 2005-10-19 耐热性树脂
US12/350,764 US8541099B2 (en) 2004-10-19 2009-01-08 Heat-resistant resin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004304028 2004-10-19
JP2005297734A JP2006143996A (ja) 2004-10-19 2005-10-12 耐熱性樹脂

Publications (1)

Publication Number Publication Date
JP2006143996A true JP2006143996A (ja) 2006-06-08

Family

ID=36203014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005297734A Pending JP2006143996A (ja) 2004-10-19 2005-10-12 耐熱性樹脂

Country Status (7)

Country Link
US (2) US20070293597A1 (https=)
EP (1) EP1803762A4 (https=)
JP (1) JP2006143996A (https=)
KR (1) KR101335117B1 (https=)
CN (1) CN101044189B (https=)
TW (1) TW200621851A (https=)
WO (1) WO2006043599A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012069195A (ja) * 2010-09-22 2012-04-05 Nitto Denko Corp ハードディスクドライブ用回路付きサスペンション基板
JP2014133887A (ja) * 2012-12-14 2014-07-24 Mitsubishi Chemicals Corp ポリイミド樹脂組成物
US8877427B2 (en) 2010-09-17 2014-11-04 Nitto Denko Corporation Photosensitive resin composition and circuit board with metal support using the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623253B2 (en) * 2010-02-26 2014-01-07 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Low-melt poly(amic acids) and polyimides and their uses
TWI632013B (zh) 2013-03-15 2018-08-11 美商伊雷克托科學工業股份有限公司 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法
KR102280582B1 (ko) * 2016-05-25 2021-07-23 도레이 카부시키가이샤 수지 조성물
JP6857641B2 (ja) * 2018-12-19 2021-04-14 信越化学工業株式会社 成膜方法及び成膜装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274947A (ja) * 1988-09-10 1990-03-14 Toyobo Co Ltd 感光性樹脂組成物
JP2550249B2 (ja) 1991-12-02 1996-11-06 住友ベークライト株式会社 感光性樹脂の製造方法
JP3198591B2 (ja) * 1992-02-21 2001-08-13 東ソー株式会社 ブロック共重合体及びその製造方法
JPH0643648A (ja) * 1992-07-22 1994-02-18 Nitto Denko Corp ポジ型フオトレジスト組成物、感光性絶縁膜およびパタ―ン形成方法
JP2713051B2 (ja) 1992-08-26 1998-02-16 信越化学工業株式会社 ポリアミック酸及びポリイミド樹脂、これらの製造方法並びに半導体装置保護用材料
JP2504681B2 (ja) 1992-11-26 1996-06-05 チッソ株式会社 低弾性率ポリイミドシロキサン複合体及びその製造法
JP2974279B2 (ja) * 1995-07-06 1999-11-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリアミド酸を含有するホトレジスト層を有するインクジェットヘッド
SG52916A1 (en) * 1996-02-13 1998-09-28 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
JPH1187867A (ja) * 1997-09-01 1999-03-30 Nitto Denko Corp 回路基板、回路付きサスペンション基板及びそれらの製造方法
JP3346265B2 (ja) * 1998-02-27 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルムおよびその積層体
JP2000103848A (ja) 1998-09-28 2000-04-11 Dainippon Printing Co Ltd 溶剤可溶性低弾性率ポリイミド
US6300037B1 (en) * 1998-11-30 2001-10-09 Nitto Denko Corporation Photosensitive resin composition and adhesive
JP4146037B2 (ja) * 1999-07-07 2008-09-03 日東電工株式会社 感光性樹脂組成物及び回路基板
KR100786437B1 (ko) * 2000-06-06 2007-12-17 닛토덴코 가부시키가이샤 클리닝 시트, 이를 사용하는 반송 부재, 및 이들을 사용한 기판 처리 장치의 클리닝 방법
JP4254028B2 (ja) 2000-08-01 2009-04-15 宇部興産株式会社 高密度フレキシブル基板の製法
JP4238100B2 (ja) * 2003-09-12 2009-03-11 三井化学株式会社 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8877427B2 (en) 2010-09-17 2014-11-04 Nitto Denko Corporation Photosensitive resin composition and circuit board with metal support using the same
JP2012069195A (ja) * 2010-09-22 2012-04-05 Nitto Denko Corp ハードディスクドライブ用回路付きサスペンション基板
JP2014133887A (ja) * 2012-12-14 2014-07-24 Mitsubishi Chemicals Corp ポリイミド樹脂組成物

Also Published As

Publication number Publication date
TW200621851A (en) 2006-07-01
KR101335117B1 (ko) 2013-12-03
KR20070085399A (ko) 2007-08-27
EP1803762A1 (en) 2007-07-04
EP1803762A4 (en) 2012-12-05
TWI370827B (https=) 2012-08-21
WO2006043599A1 (ja) 2006-04-27
US8541099B2 (en) 2013-09-24
CN101044189B (zh) 2010-06-09
CN101044189A (zh) 2007-09-26
US20090130432A1 (en) 2009-05-21
US20070293597A1 (en) 2007-12-20

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