CN101044189B - 耐热性树脂 - Google Patents

耐热性树脂 Download PDF

Info

Publication number
CN101044189B
CN101044189B CN2005800358805A CN200580035880A CN101044189B CN 101044189 B CN101044189 B CN 101044189B CN 2005800358805 A CN2005800358805 A CN 2005800358805A CN 200580035880 A CN200580035880 A CN 200580035880A CN 101044189 B CN101044189 B CN 101044189B
Authority
CN
China
Prior art keywords
resin
precursor
heat
resins
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005800358805A
Other languages
English (en)
Chinese (zh)
Other versions
CN101044189A (zh
Inventor
藤井弘文
寺田好夫
五十岚一雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN101044189A publication Critical patent/CN101044189A/zh
Application granted granted Critical
Publication of CN101044189B publication Critical patent/CN101044189B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2822—Wax containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2005800358805A 2004-10-19 2005-10-19 耐热性树脂 Expired - Fee Related CN101044189B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004304028 2004-10-19
JP304028/2004 2004-10-19
JP297734/2005 2005-10-12
JP2005297734A JP2006143996A (ja) 2004-10-19 2005-10-12 耐熱性樹脂
PCT/JP2005/019219 WO2006043599A1 (ja) 2004-10-19 2005-10-19 耐熱性樹脂

Publications (2)

Publication Number Publication Date
CN101044189A CN101044189A (zh) 2007-09-26
CN101044189B true CN101044189B (zh) 2010-06-09

Family

ID=36203014

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800358805A Expired - Fee Related CN101044189B (zh) 2004-10-19 2005-10-19 耐热性树脂

Country Status (7)

Country Link
US (2) US20070293597A1 (https=)
EP (1) EP1803762A4 (https=)
JP (1) JP2006143996A (https=)
KR (1) KR101335117B1 (https=)
CN (1) CN101044189B (https=)
TW (1) TW200621851A (https=)
WO (1) WO2006043599A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623253B2 (en) * 2010-02-26 2014-01-07 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Low-melt poly(amic acids) and polyimides and their uses
JP2012063645A (ja) 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
JP5592740B2 (ja) * 2010-09-22 2014-09-17 日東電工株式会社 ハードディスクドライブのスライダ用回路付きサスペンション基板
JP2014133887A (ja) * 2012-12-14 2014-07-24 Mitsubishi Chemicals Corp ポリイミド樹脂組成物
TWI632013B (zh) 2013-03-15 2018-08-11 美商伊雷克托科學工業股份有限公司 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法
KR102280582B1 (ko) * 2016-05-25 2021-07-23 도레이 카부시키가이샤 수지 조성물
JP6857641B2 (ja) * 2018-12-19 2021-04-14 信越化学工業株式会社 成膜方法及び成膜装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1203511A (zh) * 1996-02-13 1998-12-30 日东电工株式会社 电路基片、形成电路的支承基片及其生产方法
US6364465B1 (en) * 1995-07-06 2002-04-02 E. I. Du Pont De Nemours And Company Ink jet heads having photoresist layer containing poly (amic acid)
CN1149538C (zh) * 1997-09-01 2004-05-12 日东电工株式会社 电路基片和有电路形成的悬式基片及其生产方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274947A (ja) * 1988-09-10 1990-03-14 Toyobo Co Ltd 感光性樹脂組成物
JP2550249B2 (ja) 1991-12-02 1996-11-06 住友ベークライト株式会社 感光性樹脂の製造方法
JP3198591B2 (ja) * 1992-02-21 2001-08-13 東ソー株式会社 ブロック共重合体及びその製造方法
JPH0643648A (ja) * 1992-07-22 1994-02-18 Nitto Denko Corp ポジ型フオトレジスト組成物、感光性絶縁膜およびパタ―ン形成方法
JP2713051B2 (ja) 1992-08-26 1998-02-16 信越化学工業株式会社 ポリアミック酸及びポリイミド樹脂、これらの製造方法並びに半導体装置保護用材料
JP2504681B2 (ja) 1992-11-26 1996-06-05 チッソ株式会社 低弾性率ポリイミドシロキサン複合体及びその製造法
JP3346265B2 (ja) * 1998-02-27 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルムおよびその積層体
JP2000103848A (ja) 1998-09-28 2000-04-11 Dainippon Printing Co Ltd 溶剤可溶性低弾性率ポリイミド
US6300037B1 (en) * 1998-11-30 2001-10-09 Nitto Denko Corporation Photosensitive resin composition and adhesive
JP4146037B2 (ja) * 1999-07-07 2008-09-03 日東電工株式会社 感光性樹脂組成物及び回路基板
KR100786437B1 (ko) * 2000-06-06 2007-12-17 닛토덴코 가부시키가이샤 클리닝 시트, 이를 사용하는 반송 부재, 및 이들을 사용한 기판 처리 장치의 클리닝 방법
JP4254028B2 (ja) 2000-08-01 2009-04-15 宇部興産株式会社 高密度フレキシブル基板の製法
JP4238100B2 (ja) * 2003-09-12 2009-03-11 三井化学株式会社 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6364465B1 (en) * 1995-07-06 2002-04-02 E. I. Du Pont De Nemours And Company Ink jet heads having photoresist layer containing poly (amic acid)
CN1203511A (zh) * 1996-02-13 1998-12-30 日东电工株式会社 电路基片、形成电路的支承基片及其生产方法
CN1149538C (zh) * 1997-09-01 2004-05-12 日东电工株式会社 电路基片和有电路形成的悬式基片及其生产方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP平2-74947（A） 1990.03.14
JP平5-230212（A） 1993.09.07

Also Published As

Publication number Publication date
TW200621851A (en) 2006-07-01
KR101335117B1 (ko) 2013-12-03
KR20070085399A (ko) 2007-08-27
EP1803762A1 (en) 2007-07-04
JP2006143996A (ja) 2006-06-08
EP1803762A4 (en) 2012-12-05
TWI370827B (https=) 2012-08-21
WO2006043599A1 (ja) 2006-04-27
US8541099B2 (en) 2013-09-24
CN101044189A (zh) 2007-09-26
US20090130432A1 (en) 2009-05-21
US20070293597A1 (en) 2007-12-20

Similar Documents

Publication Publication Date Title
CN102165370B (zh) 感光性硅氧烷聚酰亚胺树脂组合物
JP3136942B2 (ja) ポリイミドシロキサンの組成物
CN105301902B (zh) 一种具有酯键相连芴单元及硅氧烷的正型感光性聚酰亚胺树脂组合物
CN105301906A (zh) 正型感光性聚酰亚胺树脂组合物
TWI398548B (zh) 溶液、鍍敷用材料、絕緣片材、積層體及印刷線路板
TW202112898A (zh) 樹脂組成物、樹脂組成物膜、硬化膜、使用該些的中空結構體、以及電子零件
JP6435862B2 (ja) 素子加工用積層体、素子加工用積層体の製造方法、およびこれを用いた薄型素子の製造方法
JPWO2009136557A1 (ja) ポリイミド前駆体、感光性ポリイミド前駆体組成物、感光性ドライフィルム及びそれらを用いたフレキシブルプリント配線基板
US8541099B2 (en) Heat-resistant resin
JP3243963B2 (ja) ポリイミドシロキサン組成物
CN109942815A (zh) 一种低介电常数的聚酰亚胺复合树脂及制备方法与应用
TWI897883B (zh) 聚醯亞胺膜、覆金屬積層板及電路基板
JP2003113338A (ja) スクリーン印刷用の耐熱性ブロック共重合ポリイミド組成物及びそのポリイミドを用いるインキの組成と塗膜の形成方法
CN105295374B (zh) 聚酰亚胺前体组合物、制备聚酰亚胺前体的方法、聚酰亚胺成形体及其制备方法
JP6007809B2 (ja) ポリイミド成形体の製造方法、ポリイミド成形体、液晶配向膜、パッシベーション膜、電線被覆材、及び接着膜
JP2624724B2 (ja) ポリイミドシロキサン組成物
JP2540669B2 (ja) ポリイミドの厚い多層の製造方法
JP5167712B2 (ja) ポリイミド積層体の製造方法、ポリイミド積層体
TW202237703A (zh) 聚醯胺酸組成物、聚醯亞胺組成物、接著劑及積層體
JP2597215B2 (ja) ポリイミドシロキサン組成物および固化膜
JP2019131704A (ja) 仮保護膜用樹脂組成物、およびこれを用いた半導体電子部品の製造方法
CN117120511A (zh) 聚酰胺酸组合物、聚酰亚胺组合物、粘接剂和层叠体
JPH0288677A (ja) ポリイミドシロキサン組成物および膜
JP4940499B2 (ja) 低誘電率重合体
JP3646410B2 (ja) 積層基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100609

Termination date: 20121019