KR101335117B1 - 내열성 수지 - Google Patents

내열성 수지 Download PDF

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Publication number
KR101335117B1
KR101335117B1 KR1020077011350A KR20077011350A KR101335117B1 KR 101335117 B1 KR101335117 B1 KR 101335117B1 KR 1020077011350 A KR1020077011350 A KR 1020077011350A KR 20077011350 A KR20077011350 A KR 20077011350A KR 101335117 B1 KR101335117 B1 KR 101335117B1
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KR
South Korea
Prior art keywords
resin
precursor
diamine compound
degreec
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077011350A
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English (en)
Korean (ko)
Other versions
KR20070085399A (ko
Inventor
히로후미 후지이
요시오 데라다
가즈마사 이가라시
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20070085399A publication Critical patent/KR20070085399A/ko
Application granted granted Critical
Publication of KR101335117B1 publication Critical patent/KR101335117B1/ko
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2822—Wax containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020077011350A 2004-10-19 2005-10-19 내열성 수지 Expired - Fee Related KR101335117B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004304028 2004-10-19
JPJP-P-2004-00304028 2004-10-19
JPJP-P-2005-00297734 2005-10-12
JP2005297734A JP2006143996A (ja) 2004-10-19 2005-10-12 耐熱性樹脂
PCT/JP2005/019219 WO2006043599A1 (ja) 2004-10-19 2005-10-19 耐熱性樹脂

Publications (2)

Publication Number Publication Date
KR20070085399A KR20070085399A (ko) 2007-08-27
KR101335117B1 true KR101335117B1 (ko) 2013-12-03

Family

ID=36203014

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077011350A Expired - Fee Related KR101335117B1 (ko) 2004-10-19 2005-10-19 내열성 수지

Country Status (7)

Country Link
US (2) US20070293597A1 (https=)
EP (1) EP1803762A4 (https=)
JP (1) JP2006143996A (https=)
KR (1) KR101335117B1 (https=)
CN (1) CN101044189B (https=)
TW (1) TW200621851A (https=)
WO (1) WO2006043599A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623253B2 (en) * 2010-02-26 2014-01-07 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Low-melt poly(amic acids) and polyimides and their uses
JP2012063645A (ja) 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
JP5592740B2 (ja) * 2010-09-22 2014-09-17 日東電工株式会社 ハードディスクドライブのスライダ用回路付きサスペンション基板
JP2014133887A (ja) * 2012-12-14 2014-07-24 Mitsubishi Chemicals Corp ポリイミド樹脂組成物
TWI632013B (zh) 2013-03-15 2018-08-11 美商伊雷克托科學工業股份有限公司 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法
KR102280582B1 (ko) * 2016-05-25 2021-07-23 도레이 카부시키가이샤 수지 조성물
JP6857641B2 (ja) * 2018-12-19 2021-04-14 信越化学工業株式会社 成膜方法及び成膜装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230212A (ja) * 1992-02-21 1993-09-07 Tosoh Corp ブロック共重合体及びその製造方法
US6300037B1 (en) * 1998-11-30 2001-10-09 Nitto Denko Corporation Photosensitive resin composition and adhesive

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274947A (ja) * 1988-09-10 1990-03-14 Toyobo Co Ltd 感光性樹脂組成物
JP2550249B2 (ja) 1991-12-02 1996-11-06 住友ベークライト株式会社 感光性樹脂の製造方法
JPH0643648A (ja) * 1992-07-22 1994-02-18 Nitto Denko Corp ポジ型フオトレジスト組成物、感光性絶縁膜およびパタ―ン形成方法
JP2713051B2 (ja) 1992-08-26 1998-02-16 信越化学工業株式会社 ポリアミック酸及びポリイミド樹脂、これらの製造方法並びに半導体装置保護用材料
JP2504681B2 (ja) 1992-11-26 1996-06-05 チッソ株式会社 低弾性率ポリイミドシロキサン複合体及びその製造法
JP2974279B2 (ja) * 1995-07-06 1999-11-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ポリアミド酸を含有するホトレジスト層を有するインクジェットヘッド
SG52916A1 (en) * 1996-02-13 1998-09-28 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
JPH1187867A (ja) * 1997-09-01 1999-03-30 Nitto Denko Corp 回路基板、回路付きサスペンション基板及びそれらの製造方法
JP3346265B2 (ja) * 1998-02-27 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルムおよびその積層体
JP2000103848A (ja) 1998-09-28 2000-04-11 Dainippon Printing Co Ltd 溶剤可溶性低弾性率ポリイミド
JP4146037B2 (ja) * 1999-07-07 2008-09-03 日東電工株式会社 感光性樹脂組成物及び回路基板
KR100786437B1 (ko) * 2000-06-06 2007-12-17 닛토덴코 가부시키가이샤 클리닝 시트, 이를 사용하는 반송 부재, 및 이들을 사용한 기판 처리 장치의 클리닝 방법
JP4254028B2 (ja) 2000-08-01 2009-04-15 宇部興産株式会社 高密度フレキシブル基板の製法
JP4238100B2 (ja) * 2003-09-12 2009-03-11 三井化学株式会社 感光性樹脂組成物、ドライフィルムおよびそれを用いた加工品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230212A (ja) * 1992-02-21 1993-09-07 Tosoh Corp ブロック共重合体及びその製造方法
US6300037B1 (en) * 1998-11-30 2001-10-09 Nitto Denko Corporation Photosensitive resin composition and adhesive

Also Published As

Publication number Publication date
TW200621851A (en) 2006-07-01
KR20070085399A (ko) 2007-08-27
EP1803762A1 (en) 2007-07-04
JP2006143996A (ja) 2006-06-08
EP1803762A4 (en) 2012-12-05
TWI370827B (https=) 2012-08-21
WO2006043599A1 (ja) 2006-04-27
US8541099B2 (en) 2013-09-24
CN101044189B (zh) 2010-06-09
CN101044189A (zh) 2007-09-26
US20090130432A1 (en) 2009-05-21
US20070293597A1 (en) 2007-12-20

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