JP2006013526A5 - - Google Patents

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Publication number
JP2006013526A5
JP2006013526A5 JP2005201965A JP2005201965A JP2006013526A5 JP 2006013526 A5 JP2006013526 A5 JP 2006013526A5 JP 2005201965 A JP2005201965 A JP 2005201965A JP 2005201965 A JP2005201965 A JP 2005201965A JP 2006013526 A5 JP2006013526 A5 JP 2006013526A5
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JP
Japan
Prior art keywords
socket
substrate
traces
substrates
support substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005201965A
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English (en)
Japanese (ja)
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JP2006013526A (ja
Filing date
Publication date
Priority claimed from US09/108,163 external-priority patent/US6033935A/en
Priority claimed from US09/205,502 external-priority patent/US20020004320A1/en
Application filed filed Critical
Publication of JP2006013526A publication Critical patent/JP2006013526A/ja
Publication of JP2006013526A5 publication Critical patent/JP2006013526A5/ja
Pending legal-status Critical Current

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JP2005201965A 1998-06-30 2005-07-11 バネ式パッケージングを備えた電子部品の組み立て体 Pending JP2006013526A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/108,163 US6033935A (en) 1997-06-30 1998-06-30 Sockets for "springed" semiconductor devices
US09/205,502 US20020004320A1 (en) 1995-05-26 1998-12-04 Attaratus for socketably receiving interconnection elements of an electronic component

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000557668A Division JP3723079B2 (ja) 1998-06-30 1999-06-30 バネ式パッケージングを備えた電子部品の組み立て体

Publications (2)

Publication Number Publication Date
JP2006013526A JP2006013526A (ja) 2006-01-12
JP2006013526A5 true JP2006013526A5 (enExample) 2006-11-30

Family

ID=26805592

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000557668A Expired - Fee Related JP3723079B2 (ja) 1998-06-30 1999-06-30 バネ式パッケージングを備えた電子部品の組み立て体
JP2005201965A Pending JP2006013526A (ja) 1998-06-30 2005-07-11 バネ式パッケージングを備えた電子部品の組み立て体

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2000557668A Expired - Fee Related JP3723079B2 (ja) 1998-06-30 1999-06-30 バネ式パッケージングを備えた電子部品の組み立て体

Country Status (7)

Country Link
US (3) US20020004320A1 (enExample)
EP (1) EP1092338B1 (enExample)
JP (2) JP3723079B2 (enExample)
CN (1) CN1197443C (enExample)
DE (2) DE69922656T2 (enExample)
TW (1) TW548756B (enExample)
WO (1) WO2000001208A1 (enExample)

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CN106983966B (zh) * 2017-03-31 2022-05-20 四川华川工业有限公司 一种钢化玻璃自动破碎装置
RU2657460C1 (ru) * 2017-05-10 2018-06-14 Открытое акционерное общество "ОКБ-Планета" ОАО "ОКБ-Планета" Контактное устройство
US10446729B1 (en) * 2018-03-22 2019-10-15 Innolux Corporation Display device having an electronic device disposed on a first pad and a second pad
CN109300859B (zh) * 2018-09-18 2020-08-28 苏州施密科微电子设备有限公司 一种半导体芯片封装框架
KR102080832B1 (ko) * 2019-10-02 2020-02-24 황동원 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓
CN114731019A (zh) * 2019-11-21 2022-07-08 株式会社友华 插座及工具
TWI799887B (zh) * 2021-06-08 2023-04-21 進聯工業股份有限公司 接合器及可組合該接合器之導線端子座結構
JP7182817B1 (ja) 2022-03-14 2022-12-05 ユニコン株式会社 プローブシート及びその製造方法
EP4261872A1 (en) * 2022-04-11 2023-10-18 Nexperia B.V. Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same
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JP2024057787A (ja) * 2022-10-13 2024-04-25 オムロン株式会社 検査ソケットおよび検査装置

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