DE69922656T2 - Zusammenbau von elektronischen komponenten mittels federpackungen - Google Patents

Zusammenbau von elektronischen komponenten mittels federpackungen Download PDF

Info

Publication number
DE69922656T2
DE69922656T2 DE69922656T DE69922656T DE69922656T2 DE 69922656 T2 DE69922656 T2 DE 69922656T2 DE 69922656 T DE69922656 T DE 69922656T DE 69922656 T DE69922656 T DE 69922656T DE 69922656 T2 DE69922656 T2 DE 69922656T2
Authority
DE
Germany
Prior art keywords
substrate
electronic component
contact
socket
contact points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69922656T
Other languages
German (de)
English (en)
Other versions
DE69922656D1 (de
Inventor
V. David PEDERSEN
N. Benjamin ELDRIDGE
Y. Igor KHANDROS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/108,163 external-priority patent/US6033935A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE69922656D1 publication Critical patent/DE69922656D1/de
Publication of DE69922656T2 publication Critical patent/DE69922656T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10878—Means for retention of a lead in a hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connecting Device With Holders (AREA)
DE69922656T 1998-06-30 1999-06-30 Zusammenbau von elektronischen komponenten mittels federpackungen Expired - Fee Related DE69922656T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/108,163 US6033935A (en) 1997-06-30 1998-06-30 Sockets for "springed" semiconductor devices
US108163 1998-06-30
US205502 1998-12-04
US09/205,502 US20020004320A1 (en) 1995-05-26 1998-12-04 Attaratus for socketably receiving interconnection elements of an electronic component
PCT/US1999/014924 WO2000001208A1 (en) 1998-06-30 1999-06-30 Assembly of an electronic component with spring packaging

Publications (2)

Publication Number Publication Date
DE69922656D1 DE69922656D1 (de) 2005-01-20
DE69922656T2 true DE69922656T2 (de) 2005-11-03

Family

ID=26805592

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69922656T Expired - Fee Related DE69922656T2 (de) 1998-06-30 1999-06-30 Zusammenbau von elektronischen komponenten mittels federpackungen
DE69937416T Expired - Fee Related DE69937416T2 (de) 1998-06-30 1999-06-30 Halbleiter-prüfvorrichtung, prüf-sockelvorrichtung und verfahren zur herstellung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69937416T Expired - Fee Related DE69937416T2 (de) 1998-06-30 1999-06-30 Halbleiter-prüfvorrichtung, prüf-sockelvorrichtung und verfahren zur herstellung

Country Status (7)

Country Link
US (3) US20020004320A1 (enExample)
EP (1) EP1092338B1 (enExample)
JP (2) JP3723079B2 (enExample)
CN (1) CN1197443C (enExample)
DE (2) DE69922656T2 (enExample)
TW (1) TW548756B (enExample)
WO (1) WO2000001208A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2256801A2 (de) 2009-05-26 2010-12-01 Semikron Elektronik GmbH & Co. KG Patentabteilung Kontakteinrichtung für ein Leistungshalbleitermodul mit einer Zentriervertiefung

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
AU8280398A (en) * 1997-06-30 1999-01-19 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US6887723B1 (en) 1998-12-04 2005-05-03 Formfactor, Inc. Method for processing an integrated circuit including placing dice into a carrier and testing
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US7396236B2 (en) * 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
DE10121969C1 (de) * 2001-05-05 2002-08-29 Semikron Elektronik Gmbh Schaltungsanordnung in Druckkontaktierung und Verfahren zu seiner Herstellung
JP4752157B2 (ja) * 2001-08-27 2011-08-17 株式会社村田製作所 コイル装置
US6764869B2 (en) 2001-09-12 2004-07-20 Formfactor, Inc. Method of assembling and testing an electronics module
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US6650456B2 (en) * 2002-04-11 2003-11-18 Triquint Technology Holding Co. Ultra-high frequency interconnection using micromachined substrates
US7694246B2 (en) * 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
JP3918708B2 (ja) * 2002-10-08 2007-05-23 セイコーエプソン株式会社 回路基板及びその製造方法、転写チップ、転写元基板、電気光学装置、電子機器
US7135704B2 (en) * 2003-08-14 2006-11-14 Lockhead Martin Corporation VCSEL settling fixture
US20050108875A1 (en) * 2003-11-26 2005-05-26 Mathieu Gaetan L. Methods for making vertical electric feed through structures usable to form removable substrate tiles in a wafer test system
US7024763B2 (en) 2003-11-26 2006-04-11 Formfactor, Inc. Methods for making plated through holes usable as interconnection wire or probe attachments
JP2005311205A (ja) * 2004-04-23 2005-11-04 Nec Corp 半導体装置
CN1304189C (zh) * 2004-08-24 2007-03-14 宇东电浆科技股份有限公司 热塑性固定装置和热塑性固定装置处理方法
JP2006339553A (ja) * 2005-06-06 2006-12-14 Fuji Electric Device Technology Co Ltd 薄膜磁気誘導素子およびその製造方法
JP4581864B2 (ja) * 2005-06-21 2010-11-17 パナソニック電工株式会社 半導体基板への貫通配線の形成方法
KR100731351B1 (ko) * 2006-02-01 2007-06-21 삼성전자주식회사 탄성 표면파 디바이스 웨이퍼 레벨 패키지 및 그 패키징방법
US20080073778A1 (en) * 2006-09-27 2008-03-27 Texas Instruments Incorporated Two-way heat extraction from packaged semiconductor chips
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
US7928582B2 (en) 2007-03-09 2011-04-19 Micron Technology, Inc. Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces
US7688077B2 (en) * 2007-08-23 2010-03-30 Advantest Corporation Test system and daughter unit
CN101316014B (zh) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 电连接装置及其组装方法
JP5351071B2 (ja) * 2009-02-24 2013-11-27 株式会社アドバンテスト テスト部ユニット、テストヘッドおよび電子部品試験装置
TWI405375B (zh) * 2009-11-13 2013-08-11 Unimicron Technology Corp 電連接器
JP5798435B2 (ja) * 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5777997B2 (ja) 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
KR101149759B1 (ko) * 2011-03-14 2012-06-01 리노공업주식회사 반도체 디바이스의 검사장치
JP5690678B2 (ja) * 2011-07-19 2015-03-25 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
CN102891116B (zh) * 2011-07-20 2015-06-10 讯芯电子科技（中山）有限公司 内埋元件封装结构及制造方法
CN103325773A (zh) * 2012-03-22 2013-09-25 民瑞科技股份有限公司 集成电路的封装结构
JP6341634B2 (ja) * 2013-05-28 2018-06-13 新光電気工業株式会社 プローブガイド板及びその製造方法、半導体検査装置
US9252138B2 (en) * 2014-05-27 2016-02-02 General Electric Company Interconnect devices for electronic packaging assemblies
EP2962799B8 (de) * 2014-07-04 2016-10-12 ABB Schweiz AG Halbleitermodul mit Ultraschall geschweißten Anschlüssen
CN104251923B (zh) * 2014-09-17 2017-06-30 大族激光科技产业集团股份有限公司 二线测试探针装置及其应用方法
US9530749B2 (en) * 2015-04-28 2016-12-27 Invensas Corporation Coupling of side surface contacts to a circuit platform
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
CN108738355B (zh) 2015-11-25 2020-11-06 佛姆法克特股份有限公司 用于测试插座的浮动嵌套
JP6706076B2 (ja) * 2016-01-14 2020-06-03 新光電気工業株式会社 プローブガイド板及びその製造方法とプローブ装置
CN106983966B (zh) * 2017-03-31 2022-05-20 四川华川工业有限公司 一种钢化玻璃自动破碎装置
RU2657460C1 (ru) * 2017-05-10 2018-06-14 Открытое акционерное общество "ОКБ-Планета" ОАО "ОКБ-Планета" Контактное устройство
US10446729B1 (en) * 2018-03-22 2019-10-15 Innolux Corporation Display device having an electronic device disposed on a first pad and a second pad
CN109300859B (zh) * 2018-09-18 2020-08-28 苏州施密科微电子设备有限公司 一种半导体芯片封装框架
KR102080832B1 (ko) * 2019-10-02 2020-02-24 황동원 스프링 콘택트 및 스프링 콘택트 내장형 테스트 소켓
WO2021100449A1 (ja) * 2019-11-21 2021-05-27 株式会社ヨコオ ソケットおよび工具
TWI799887B (zh) * 2021-06-08 2023-04-21 進聯工業股份有限公司 接合器及可組合該接合器之導線端子座結構
JP7182817B1 (ja) 2022-03-14 2022-12-05 ユニコン株式会社 プローブシート及びその製造方法
EP4261872A1 (en) * 2022-04-11 2023-10-18 Nexperia B.V. Molded electronic package with an electronic component encapsulated between two substrates with a spring member between the electronic component and one of the substrates and method for manufacturing the same
TWI811005B (zh) 2022-07-05 2023-08-01 中華精測科技股份有限公司 可拆式測試裝置
JP2024057787A (ja) * 2022-10-13 2024-04-25 オムロン株式会社 検査ソケットおよび検査装置

Family Cites Families (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US720677A (en) * 1902-12-18 1903-02-17 Seth A Crone Brake-beam.
NL292051A (enExample) * 1962-04-27
US3939831A (en) * 1974-03-04 1976-02-24 Intreprinderea Flacara Rosie Process for preparing medicinal dressings
US3939381A (en) * 1974-03-22 1976-02-17 Mcm Industries, Inc. Universal burn-in fixture
GB1530786A (en) * 1974-12-30 1978-11-01 Trw Inc Electrical connector
FR2322465A1 (fr) * 1975-08-29 1977-03-25 Doloise Metallurgique Dispositif de raccordement pour composants munis de fiches
DE2936615C2 (de) * 1979-09-11 1985-03-28 Brown, Boveri & Cie Ag, 6800 Mannheim Schutzvorrichtung
US4477134A (en) * 1981-08-14 1984-10-16 Hewlett-Packard Company Electrostatic discharge protected integrated circuit module
CA1186418A (en) * 1981-08-14 1985-04-30 Allen J. Wright Electrostatic discharge protected integrated circuit module
JPS6049656B2 (ja) 1981-10-05 1985-11-02 ダイセル化学工業株式会社 セルロ−ストリアセテ−トプラスチツク成形物の防曇処理方法
US4711024A (en) * 1981-10-30 1987-12-08 Honeywell Information Systems Inc. Method for making testable electronic assemblies
US4511201A (en) * 1982-11-05 1985-04-16 At&T Bell Laboratories Module mounting assembly
US4553192A (en) 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS62229896A (ja) * 1986-03-29 1987-10-08 株式会社東芝 印刷配線基板
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
JPH063820B2 (ja) 1988-07-25 1994-01-12 松下電器産業株式会社 半導体装置の実装方法
US5036431A (en) * 1988-03-03 1991-07-30 Ibiden Co., Ltd. Package for surface mounted components
DE3903060A1 (de) * 1989-02-02 1990-08-09 Minnesota Mining & Mfg Vorrichtung zum pruefen von integrierten schaltungsanordnungen
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
US4922376A (en) * 1989-04-10 1990-05-01 Unistructure, Inc. Spring grid array interconnection for active microelectronic elements
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US4966556A (en) * 1989-06-13 1990-10-30 General Datacomm, Inc. Electrical connector for direct connection to plated through holes in circuit board
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
JPH03142847A (ja) 1989-10-30 1991-06-18 Hitachi Ltd 半導体集積回路装置
JPH0711422Y2 (ja) * 1989-12-25 1995-03-15 山一電機工業株式会社 Ｉｃソケット
AU645283B2 (en) * 1990-01-23 1994-01-13 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5905382A (en) * 1990-08-29 1999-05-18 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5207585A (en) * 1990-10-31 1993-05-04 International Business Machines Corporation Thin interface pellicle for dense arrays of electrical interconnects
US5578934A (en) * 1991-06-04 1996-11-26 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5239260A (en) * 1991-06-28 1993-08-24 Digital Equipment Corporation Semiconductor probe and alignment system
US5175491A (en) * 1991-09-18 1992-12-29 Sgs-Thomson Microelectronics, Inc. Integrated circuit testing fixture
JPH0649656A (ja) 1992-08-04 1994-02-22 Vacuum Metallurgical Co Ltd ガス・デポジション法による超微粒子膜の形成法およびその形成装置
US5489854A (en) * 1993-04-01 1996-02-06 Analog Devices, Inc. IC chip test socket with double-ended spring biased contacts
US5329423A (en) * 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
US5811982A (en) * 1995-11-27 1998-09-22 International Business Machines Corporation High density cantilevered probe for electronic devices
JP3053507B2 (ja) 1993-06-11 2000-06-19 裕子 鈴木 ドーム型羽毛ふとん
US5500605A (en) * 1993-09-17 1996-03-19 At&T Corp. Electrical test apparatus and method
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5475317A (en) * 1993-12-23 1995-12-12 Epi Technologies, Inc. Singulated bare die tester and method of performing forced temperature electrical tests and burn-in
GB9400384D0 (en) 1994-01-11 1994-03-09 Inmos Ltd Circuit connection in an electrical assembly
US5455390A (en) * 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
WO1995034825A1 (en) * 1994-06-15 1995-12-21 Advantest Corporation Carrier of ic handler
US5476818A (en) * 1994-08-19 1995-12-19 Motorola, Inc. Semiconductor structure and method of manufacture
US5495667A (en) * 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
KR100355972B1 (ko) 1994-11-15 2002-10-12 폼팩터, 인크. 팁 구조물을 제조하는 방법
EP1198001A3 (en) 1994-11-15 2008-07-23 FormFactor, Inc. Method of testing and mounting devices using a resilient contact structure
US6229320B1 (en) * 1994-11-18 2001-05-08 Fujitsu Limited IC socket, a test method using the same and an IC socket mounting mechanism
JPH1069955A (ja) 1996-08-28 1998-03-10 Fujitsu Ltd Ｉｃソケット及びこれを用いた試験方法及びｉｃソケットの実装機構
JPH08263092A (ja) 1995-03-23 1996-10-11 N T T Data Tsushin Kk 応答音声生成方法および音声対話システム
ATE213873T1 (de) * 1995-04-24 2002-03-15 Infineon Technologies Ag Halbleiter-speichervorrichtung unter verwendung eines ferroelektrischen dielektrikums und verfahren zur herstellung
DE69634376D1 (de) * 1995-05-12 2005-03-31 St Microelectronics Inc IC-Packungsfassungssystem mit niedrigem Profil
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die
US20020004320A1 (en) 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
US5714803A (en) * 1995-07-28 1998-02-03 Sgs-Thomson Microelectronics, Inc. Low-profile removable ball-grid-array integrated circuit package
US5686842A (en) * 1995-08-31 1997-11-11 Nat Semiconductor Corp Known good die test apparatus and method
JP2891665B2 (ja) 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
CN1134667C (zh) 1996-05-17 2004-01-14 福姆法克特公司 微电子弹性接触元件
US5865639A (en) * 1996-06-25 1999-02-02 Texas Instruments Incorporated Burn-in test socket apparatus
EP0925509B1 (en) * 1996-09-13 2005-09-07 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips
US5764486A (en) * 1996-10-10 1998-06-09 Hewlett Packard Company Cost effective structure and method for interconnecting a flip chip with a substrate
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US6025730A (en) * 1997-03-17 2000-02-15 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
AU8280398A (en) * 1997-06-30 1999-01-19 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
JPH1172534A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp テスト端子付き半導体装置およびｉｃソケット
US6018249A (en) * 1997-12-11 2000-01-25 Micron Technolgoy, Inc. Test system with mechanical alignment for semiconductor chip scale packages and dice
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6031282A (en) * 1998-08-27 2000-02-29 Advantest Corp. High performance integrated circuit chip package
US6887723B1 (en) 1998-12-04 2005-05-03 Formfactor, Inc. Method for processing an integrated circuit including placing dice into a carrier and testing
US7694246B2 (en) 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
US6920689B2 (en) 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2256801A2 (de) 2009-05-26 2010-12-01 Semikron Elektronik GmbH & Co. KG Patentabteilung Kontakteinrichtung für ein Leistungshalbleitermodul mit einer Zentriervertiefung
EP2256801A3 (de) * 2009-05-26 2011-02-09 Semikron Elektronik GmbH & Co. KG Patentabteilung Kontakteinrichtung für ein Leistungshalbleitermodul mit einer Zentriervertiefung

Also Published As

Publication number Publication date
TW548756B (en) 2003-08-21
JP3723079B2 (ja) 2005-12-07
US7534654B2 (en) 2009-05-19
US20040152348A1 (en) 2004-08-05
EP1092338A1 (en) 2001-04-18
US7202677B2 (en) 2007-04-10
WO2000001208A1 (en) 2000-01-06
DE69922656D1 (de) 2005-01-20
US20070285114A1 (en) 2007-12-13
DE69937416D1 (de) 2007-12-06
US20020004320A1 (en) 2002-01-10
CN1307793A (zh) 2001-08-08
DE69937416T2 (de) 2008-07-24
CN1197443C (zh) 2005-04-13
JP2006013526A (ja) 2006-01-12
EP1092338B1 (en) 2004-12-15
JP2002519872A (ja) 2002-07-02

Similar Documents

Publication Publication Date Title
DE69937416T2 (de) Halbleiter-prüfvorrichtung, prüf-sockelvorrichtung und verfahren zur herstellung
DE69635227T2 (de) Kontakträger zum bestücken von substraten mit federkontakten
DE69533336T2 (de) Testkarte und ihre anwendung
DE69635083T2 (de) Herstellung von verbindungen und ansatzstücken unter verwendung eines opfersubstrats
DE60115437T2 (de) Testsystem von integrierten schaltungen
DE69926241T2 (de) Leiterplatten-verbindungsvorrichtung und herstellungsverfahren
DE69908638T2 (de) Lithographische kontaktstrukturen
DE69533063T2 (de) Mikroelektronische kontakte und zusammenbauten
DE60208579T2 (de) Mehrchip-verbindungssystem
EP1523229B1 (en) Semiconductor exercising apparatus, test socket apparatus and method of making thereof
DE60303066T2 (de) Prüfspitze für integrierte Schaltungen
DE69533041T2 (de) Montage von federelementen auf halbleiterbauteilen
DE69829986T2 (de) Testkarte zur wafer-prüfung
DE69936470T2 (de) Testkarte
DE69431565T2 (de) Verfahren zum herstellung einer kontaktstruktur für verbindungen, zwischenstück, halbleiteranordnung
DE202005021386U1 (de) Prüfkopf mit einem Messfühler mit Membranaufhängung
DE10037216A1 (de) Anschlußstruktur sowie Verfahren zur Herstellung von Anschlußelementen und Verfahren zur Erzeugung einer Anschlußstruktur
DE10151125A1 (de) Anschlussstruktur und zugehöriges Herstellungsverfahren sowie die Anschlussstruktur verwendende Prüfanschlussanordnung
EP0769209A1 (de) Verfahren zur herstellung einer dreidimensionalen schaltungsanordnung
EP0351581A1 (de) Hochintegrierte Schaltung sowie Verfahren zu deren Herstellung
DE10392306T5 (de) Kontaktstruktur mit Siliziumtastkontaktgeber
DE10125905C1 (de) Lösbare Verbindung zwischen einem ungehäusten Chip und einem Träger
DE10017746B4 (de) Verfahren zur Herstellung eines elektronischen Bauteils mit mikroskopisch kleinen Kontaktflächen
WO1996020500A1 (de) Chipkontaktierungsverfahren
DE19962702A1 (de) Prüfsockel einer BGA-Vorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee