JP2006013017A - 絶縁ゲート型半導体装置の製造方法 - Google Patents
絶縁ゲート型半導体装置の製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 claims abstract description 67
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 38
- 239000012212 insulator Substances 0.000 claims description 24
- 238000000151 deposition Methods 0.000 claims description 23
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 19
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
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Abstract
【解決手段】本発明の半導体装置の製造方法では,ゲートトレンチ21および終端トレンチ61を形成した後,各トレンチに対して不純物がドープされていない,いわゆるノンドープの絶縁膜の埋め込みを行う。その後,絶縁膜が形成された半導体基板に対し,酸化性雰囲気にてアニール処理を行う。これにより,ゲートトレンチ21の壁面沿いに熱酸化膜83が形成され,堆積絶縁層23中のボイドが消滅する。その後,堆積絶縁層23の一部をエッチバックし,エッチバックにて設けられたスペースにゲート材を充填する。
【選択図】 図1
Description
12 N- ドリフト領域
21 トレンチ(トレンチ部)
22 ゲート電極(電極層)
23 堆積絶縁層(堆積絶縁層)
24 ゲート絶縁膜(絶縁膜)
31 N+ ソース領域
41 P- ボディ領域
51 Pフローティング領域
81 くさび状の溝
82 ボイド
83 熱酸化膜
100 絶縁ゲート型半導体装置
Claims (3)
- トレンチ型電極構造を有する絶縁ゲート型半導体装置の製造方法において,
半導体基板の上面からトレンチ部を形成するトレンチ部形成工程と,
前記トレンチ部形成工程にてトレンチ部を形成した後に,そのトレンチ部内にノンドープの絶縁物の堆積による堆積絶縁層を形成する絶縁物堆積工程と,
前記絶縁物堆積工程にて堆積絶縁層を形成した後に,酸化性雰囲気にてアニール処理を行うアニール工程と,
前記アニール工程にてアニール処理を行った後に,堆積絶縁層の一部を除去するエッチバック工程と,
前記エッチバック工程にて堆積絶縁層の一部を除去した後に,トレンチ部の壁面に絶縁膜を形成する絶縁膜形成工程と,
前記絶縁膜形成工程にて絶縁膜を形成した後に,堆積絶縁層の上面上に電極層を形成する電極層形成工程と含むことを特徴とする絶縁ゲート型半導体装置の製造方法。 - 請求項1に記載する絶縁ゲート型半導体装置の製造方法において,
前記絶縁物堆積工程では,シランガスを主原料とし,CVD法によって堆積絶縁層を形成することを特徴とする絶縁ゲート型半導体装置の製造方法。 - 請求項1に記載する絶縁ゲート型半導体装置の製造方法において,
前記絶縁物堆積工程では,TEOS(テトラエチルオルソシリケート)を主原料とし,CVD法によって堆積絶縁層を形成することを特徴とする絶縁ゲート型半導体装置の製造方法。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091699A (ja) | 2006-10-03 | 2008-04-17 | Furukawa Electric Co Ltd:The | 半導体トランジスタの製造方法 |
JP2008270365A (ja) * | 2007-04-17 | 2008-11-06 | Toyota Motor Corp | 半導体装置とその製造方法 |
KR100914285B1 (ko) | 2006-12-29 | 2009-08-27 | 주식회사 하이닉스반도체 | 벌브 타입의 리세스 채널을 갖는 반도체 소자의 제조방법 |
WO2010044430A1 (ja) * | 2008-10-16 | 2010-04-22 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
US7723191B2 (en) | 2006-12-14 | 2010-05-25 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor device having buried gate |
JP2015126027A (ja) * | 2013-12-25 | 2015-07-06 | トヨタ自動車株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2019186458A (ja) * | 2018-04-13 | 2019-10-24 | トヨタ自動車株式会社 | スイッチング素子とその製造方法 |
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JPH05335582A (ja) * | 1992-05-27 | 1993-12-17 | Omron Corp | 縦型mosfet装置およびその製造方法 |
JP2003069010A (ja) * | 2001-08-24 | 2003-03-07 | Sharp Corp | 半導体装置およびその製造方法 |
JP2005510087A (ja) * | 2001-11-15 | 2005-04-14 | ゼネラル セミコンダクター,インク. | ゲート電荷が低いトレンチ金属酸化膜半導体電界効果トランジスタ |
-
2004
- 2004-06-24 JP JP2004185773A patent/JP4500598B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05335582A (ja) * | 1992-05-27 | 1993-12-17 | Omron Corp | 縦型mosfet装置およびその製造方法 |
JP2003069010A (ja) * | 2001-08-24 | 2003-03-07 | Sharp Corp | 半導体装置およびその製造方法 |
JP2005510087A (ja) * | 2001-11-15 | 2005-04-14 | ゼネラル セミコンダクター,インク. | ゲート電荷が低いトレンチ金属酸化膜半導体電界効果トランジスタ |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091699A (ja) | 2006-10-03 | 2008-04-17 | Furukawa Electric Co Ltd:The | 半導体トランジスタの製造方法 |
US7723191B2 (en) | 2006-12-14 | 2010-05-25 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor device having buried gate |
KR100914285B1 (ko) | 2006-12-29 | 2009-08-27 | 주식회사 하이닉스반도체 | 벌브 타입의 리세스 채널을 갖는 반도체 소자의 제조방법 |
JP2008270365A (ja) * | 2007-04-17 | 2008-11-06 | Toyota Motor Corp | 半導体装置とその製造方法 |
WO2010044430A1 (ja) * | 2008-10-16 | 2010-04-22 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
JP2010098141A (ja) * | 2008-10-16 | 2010-04-30 | Sumitomo Electric Device Innovations Inc | 半導体装置の製造方法 |
JP2015126027A (ja) * | 2013-12-25 | 2015-07-06 | トヨタ自動車株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2019186458A (ja) * | 2018-04-13 | 2019-10-24 | トヨタ自動車株式会社 | スイッチング素子とその製造方法 |
JP7073872B2 (ja) | 2018-04-13 | 2022-05-24 | 株式会社デンソー | スイッチング素子とその製造方法 |
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