JP2006005086A5 - - Google Patents

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Publication number
JP2006005086A5
JP2006005086A5 JP2004178471A JP2004178471A JP2006005086A5 JP 2006005086 A5 JP2006005086 A5 JP 2006005086A5 JP 2004178471 A JP2004178471 A JP 2004178471A JP 2004178471 A JP2004178471 A JP 2004178471A JP 2006005086 A5 JP2006005086 A5 JP 2006005086A5
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JP
Japan
Prior art keywords
substrate
chamber
substrate processing
transfer
processed
Prior art date
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Granted
Application number
JP2004178471A
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English (en)
Japanese (ja)
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JP4722416B2 (ja
JP2006005086A (ja
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Priority to JP2004178471A priority Critical patent/JP4722416B2/ja
Priority claimed from JP2004178471A external-priority patent/JP4722416B2/ja
Publication of JP2006005086A publication Critical patent/JP2006005086A/ja
Publication of JP2006005086A5 publication Critical patent/JP2006005086A5/ja
Application granted granted Critical
Publication of JP4722416B2 publication Critical patent/JP4722416B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004178471A 2004-06-16 2004-06-16 半導体製造装置及び基板搬送方法並びに半導体装置の製造方法 Expired - Fee Related JP4722416B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004178471A JP4722416B2 (ja) 2004-06-16 2004-06-16 半導体製造装置及び基板搬送方法並びに半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004178471A JP4722416B2 (ja) 2004-06-16 2004-06-16 半導体製造装置及び基板搬送方法並びに半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006005086A JP2006005086A (ja) 2006-01-05
JP2006005086A5 true JP2006005086A5 (enExample) 2007-07-26
JP4722416B2 JP4722416B2 (ja) 2011-07-13

Family

ID=35773211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004178471A Expired - Fee Related JP4722416B2 (ja) 2004-06-16 2004-06-16 半導体製造装置及び基板搬送方法並びに半導体装置の製造方法

Country Status (1)

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JP (1) JP4722416B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011114677A1 (ja) * 2010-03-19 2011-09-22 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
JP5550600B2 (ja) * 2011-04-13 2014-07-16 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
JP6017560B2 (ja) * 2011-08-16 2016-11-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ チャンバ内の基板を感知するための方法および装置
KR20150120436A (ko) 2013-02-20 2015-10-27 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 소형 제조 장치 및 이것을 사용한 제조 시스템
CN118116854B (zh) * 2024-04-25 2024-08-02 浙江求是创芯半导体设备有限公司 一种晶圆调度方法、装置、设备及存储介质

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2641922B2 (ja) * 1988-10-26 1997-08-20 東京エレクトロン株式会社 処理装置
JPH0427140A (ja) * 1990-05-22 1992-01-30 Tokyo Electron Ltd 被処理体の検知装置
JPH05294405A (ja) * 1992-04-20 1993-11-09 Tel Varian Ltd 基板検出装置
JPH1145929A (ja) * 1997-05-30 1999-02-16 Sharp Corp プラズマ処理装置
JP3468056B2 (ja) * 1997-09-23 2003-11-17 東京エレクトロン株式会社 基板検出装置
JPH11195695A (ja) * 1997-12-26 1999-07-21 Advanced Display Inc 電子デバイス製造装置
JP4256551B2 (ja) * 1998-12-25 2009-04-22 東京エレクトロン株式会社 真空処理システム
JP2002237507A (ja) * 2000-12-08 2002-08-23 Tokyo Electron Ltd 処理システム及び処理システムの被処理体の搬送方法

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