JP2006005086A5 - - Google Patents

Claims (1)

An atmospheric transfer chamber, a vacuum-tight substrate processing module connected in parallel to one side of the atmospheric transfer chamber, a front chamber communicating with one side of the atmospheric transfer chamber, and a substrate processing chamber communicating with the front chamber A plurality of substrate processing modules configured, and one first substrate transfer device provided in the atmospheric transfer chamber and configured to transfer a substrate to the substrate processing module or the substrate storage unit via the atmospheric transfer chamber; A second substrate transfer device that is provided in each of a plurality of front chambers that constitute the plurality of substrate processing modules, and that transfers a substrate between the front chamber and the substrate processing chamber; the first substrate transfer device; In a semiconductor manufacturing apparatus comprising: the substrate transfer device of 2; and a control means for controlling the pressure of the front chamber.
The control means includes
Controlling the second substrate transport device to transport the processed substrate from the substrate processing chamber of the substrate processing module processed in the substrate processing chamber to the front chamber among the plurality of substrate processing modules;
When detecting that the said processed substrate is transported to the front chamber, when the processed substrate to control the pressure in the front chamber so as to restore the pre-chamber which is conveyed to the atmospheric pressure from the vacuum pressure together, the The semiconductor manufacturing method is characterized in that the first substrate transfer device is controlled so that the substrate processing module to which the processed substrate is transferred starts transfer of the next unprocessed substrate from the substrate storage unit. apparatus.