JP2005529200A5 - - Google Patents
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- Publication number
- JP2005529200A5 JP2005529200A5 JP2004502060A JP2004502060A JP2005529200A5 JP 2005529200 A5 JP2005529200 A5 JP 2005529200A5 JP 2004502060 A JP2004502060 A JP 2004502060A JP 2004502060 A JP2004502060 A JP 2004502060A JP 2005529200 A5 JP2005529200 A5 JP 2005529200A5
- Authority
- JP
- Japan
- Prior art keywords
- ethyl
- oxetanylmethoxy
- curing
- bis
- oxetanylmethyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 3
- AHHWIHXENZJRFG-UHFFFAOYSA-N Oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 claims 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 claims 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 claims 1
- LNZCVOLEQJDCJG-UHFFFAOYSA-N 3-ethyl-3-[(2-methylphenoxy)methyl]oxetane Chemical compound C=1C=CC=C(C)C=1OCC1(CC)COC1 LNZCVOLEQJDCJG-UHFFFAOYSA-N 0.000 claims 1
- SLNCKLVYLZHRKK-UHFFFAOYSA-N 3-ethyl-3-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCC1(CC)COC1 SLNCKLVYLZHRKK-UHFFFAOYSA-N 0.000 claims 1
- UWFHYGTWXNRUDH-UHFFFAOYSA-N 3-ethyl-3-[4-[(3-ethyloxetan-3-yl)methoxy]butoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCOCC1(CC)COC1 UWFHYGTWXNRUDH-UHFFFAOYSA-N 0.000 claims 1
- UXEOSBGULDWPRJ-UHFFFAOYSA-N 3-ethyl-3-[5-[(3-ethyloxetan-3-yl)methoxy]pentoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCOCC1(CC)COC1 UXEOSBGULDWPRJ-UHFFFAOYSA-N 0.000 claims 1
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 claims 1
- -1 3-ethyl-3-oxetanylmethyl Chemical group 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- 150000002170 ethers Chemical class 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 239000003211 photoinitiator Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 239000003999 initiator Substances 0.000 description 2
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
Description
Claims (4)
- オキセタンが、式2により定義された成分からなる群から選択され、R1はC1〜C4のアルキル基、Z=酸素及びR2=H、C1〜C8のアルキル基、又はフェニル基である;3−エチル−3−ヒドロキシメチルオキセタン,(3−エチル−3−オキセタニルメトキシ)メチルベンゼン,(3−エチル−3−オキセタニルメトキシ)ベンゼン,2−エチルヘキシル(3−エチル−3−オキセタニルメチル)エーテル,1,4−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]ベンゼン,1,2−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]エタン,1,3−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]プロパン,エチレングリコールビス(3−エチル−3−オキセタニルメチル)エーテル及びビス(3−エチル−3−オキセタニルメチル)エーテルであるところの、請求項1〜6のいずれか1項に記載の照射硬化可能な組成物。
- 組成物が化学照射及び60分のUV後硬化による完全硬化の後に以下の性質、
(i) 1000〜10000MPaの範囲の曲げ弾性率、
(ii) 少なくとも4%の破断時平均伸び、及び
(iii) 少なくとも25MPaの引張強度
の少なくとも1を有するところの請求項1〜8のいずれか1項に記載の照射硬化可能な組成物。 - オキセタン、グリシジルエーテル、カチオン性光開始剤を含む照射硬化可能な組成物において、該組成物は化学照射及び60分間のUV後硬化で物体へと硬化され、そして該物体はFwet/Fdry>0.5の比を有し、ただしFdryは硬化後の曲げ棒の曲げ弾性率であり、Fwetは硬化、及び該物体が20℃の水に48時間浸される水処理後の曲げ棒の曲げ弾性率である。
- 暴露エネルギーが10〜150mJ/cm 2 の範囲であることころの、請求項21又は22のいずれか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37723902P | 2002-05-03 | 2002-05-03 | |
PCT/NL2003/000320 WO2003093901A1 (en) | 2002-05-03 | 2003-05-01 | Radiation curable resin composition and rapid prototyping process using the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010036379A Division JP5656419B2 (ja) | 2002-05-03 | 2010-02-22 | 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005529200A JP2005529200A (ja) | 2005-09-29 |
JP2005529200A5 true JP2005529200A5 (ja) | 2006-09-14 |
Family
ID=29401462
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004502060A Pending JP2005529200A (ja) | 2002-05-03 | 2003-05-01 | 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 |
JP2010036379A Expired - Lifetime JP5656419B2 (ja) | 2002-05-03 | 2010-02-22 | 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010036379A Expired - Lifetime JP5656419B2 (ja) | 2002-05-03 | 2010-02-22 | 照射硬化可能な樹脂組成物及びそれを用いるラピッドプロトタイピング法 |
Country Status (9)
Country | Link |
---|---|
US (3) | US7183040B2 (ja) |
EP (2) | EP2466378B1 (ja) |
JP (2) | JP2005529200A (ja) |
KR (3) | KR20050007372A (ja) |
CN (2) | CN101706639A (ja) |
AU (1) | AU2003224516A1 (ja) |
ES (1) | ES2405107T3 (ja) |
HK (1) | HK1080554A1 (ja) |
WO (1) | WO2003093901A1 (ja) |
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-
2003
- 2003-05-01 KR KR10-2004-7017652A patent/KR20050007372A/ko not_active Application Discontinuation
- 2003-05-01 CN CN200910224789A patent/CN101706639A/zh active Pending
- 2003-05-01 EP EP12154838.2A patent/EP2466378B1/en not_active Expired - Lifetime
- 2003-05-01 KR KR1020127016516A patent/KR20120086737A/ko not_active Application Discontinuation
- 2003-05-01 AU AU2003224516A patent/AU2003224516A1/en not_active Abandoned
- 2003-05-01 EP EP03721169A patent/EP1502155B1/en not_active Expired - Lifetime
- 2003-05-01 JP JP2004502060A patent/JP2005529200A/ja active Pending
- 2003-05-01 WO PCT/NL2003/000320 patent/WO2003093901A1/en active Application Filing
- 2003-05-01 KR KR1020117006984A patent/KR101176747B1/ko active IP Right Grant
- 2003-05-01 ES ES03721169T patent/ES2405107T3/es not_active Expired - Lifetime
- 2003-05-01 CN CN03810052A patent/CN100576069C/zh not_active Expired - Lifetime
- 2003-07-21 US US10/623,153 patent/US7183040B2/en not_active Expired - Lifetime
-
2006
- 2006-01-11 HK HK06100453.4A patent/HK1080554A1/xx not_active IP Right Cessation
-
2007
- 2007-01-08 US US11/650,453 patent/US20070154840A1/en not_active Abandoned
- 2007-11-09 US US11/979,878 patent/US20080064780A1/en not_active Abandoned
-
2010
- 2010-02-22 JP JP2010036379A patent/JP5656419B2/ja not_active Expired - Lifetime
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