|
US8021976B2
(en)
|
2002-10-15 |
2011-09-20 |
Megica Corporation |
Method of wire bonding over active area of a semiconductor circuit
|
|
KR100448344B1
(ko)
*
|
2002-10-22 |
2004-09-13 |
삼성전자주식회사 |
웨이퍼 레벨 칩 스케일 패키지 제조 방법
|
|
US7372153B2
(en)
*
|
2003-10-07 |
2008-05-13 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Integrated circuit package bond pad having plurality of conductive members
|
|
US7214605B2
(en)
*
|
2003-10-09 |
2007-05-08 |
Intel Corporation |
Deposition of diffusion barrier
|
|
US7247564B2
(en)
*
|
2004-06-28 |
2007-07-24 |
Hewlett-Packard Development Company, L.P. |
Electronic device
|
|
US7213329B2
(en)
*
|
2004-08-14 |
2007-05-08 |
Samsung Electronics, Co., Ltd. |
Method of forming a solder ball on a board and the board
|
|
US7429795B2
(en)
*
|
2005-09-27 |
2008-09-30 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Bond pad structure
|
|
KR100699865B1
(ko)
*
|
2005-09-28 |
2007-03-28 |
삼성전자주식회사 |
화학기계적 연마를 이용한 자기 정렬 콘택 패드 형성 방법
|
|
KR100699892B1
(ko)
*
|
2006-01-20 |
2007-03-28 |
삼성전자주식회사 |
솔더접합신뢰도 개선을 위한 락킹 구조를 갖는 반도체 소자및 인쇄회로기판
|
|
US7598620B2
(en)
*
|
2006-05-31 |
2009-10-06 |
Hebert Francois |
Copper bonding compatible bond pad structure and method
|
|
US7955973B2
(en)
*
|
2006-08-01 |
2011-06-07 |
Freescale Semiconductor, Inc. |
Method and apparatus for improvements in chip manufacture and design
|
|
US7812448B2
(en)
*
|
2006-08-07 |
2010-10-12 |
Freescale Semiconductor, Inc. |
Electronic device including a conductive stud over a bonding pad region
|
|
US8569876B2
(en)
|
2006-11-22 |
2013-10-29 |
Tessera, Inc. |
Packaged semiconductor chips with array
|
|
US7791199B2
(en)
|
2006-11-22 |
2010-09-07 |
Tessera, Inc. |
Packaged semiconductor chips
|
|
US8405196B2
(en)
|
2007-03-05 |
2013-03-26 |
DigitalOptics Corporation Europe Limited |
Chips having rear contacts connected by through vias to front contacts
|
|
US8134235B2
(en)
|
2007-04-23 |
2012-03-13 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Three-dimensional semiconductor device
|
|
US8193615B2
(en)
|
2007-07-31 |
2012-06-05 |
DigitalOptics Corporation Europe Limited |
Semiconductor packaging process using through silicon vias
|
|
US7888257B2
(en)
*
|
2007-10-10 |
2011-02-15 |
Agere Systems Inc. |
Integrated circuit package including wire bonds
|
|
KR101360815B1
(ko)
*
|
2007-10-31 |
2014-02-11 |
에이저 시스템즈 엘엘시 |
반도체 디바이스를 위한 본드 패드 지지 구조체
|
|
KR100933685B1
(ko)
*
|
2007-12-18 |
2009-12-23 |
주식회사 하이닉스반도체 |
필링 방지를 위한 본딩패드 및 그 형성 방법
|
|
US8053900B2
(en)
*
|
2008-10-21 |
2011-11-08 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect
|
|
KR20100060309A
(ko)
*
|
2008-11-27 |
2010-06-07 |
주식회사 동부하이텍 |
반도체 소자
|
|
JP5353313B2
(ja)
*
|
2009-03-06 |
2013-11-27 |
富士通セミコンダクター株式会社 |
半導体装置
|
|
US8259415B2
(en)
*
|
2009-06-22 |
2012-09-04 |
Seagate Technology Llc |
Slider bond pad with a recessed channel
|
|
US9640437B2
(en)
|
2010-07-23 |
2017-05-02 |
Tessera, Inc. |
Methods of forming semiconductor elements using micro-abrasive particle stream
|
|
US8791575B2
(en)
|
2010-07-23 |
2014-07-29 |
Tessera, Inc. |
Microelectronic elements having metallic pads overlying vias
|
|
JP5610905B2
(ja)
*
|
2010-08-02 |
2014-10-22 |
パナソニック株式会社 |
半導体装置
|
|
US8847380B2
(en)
|
2010-09-17 |
2014-09-30 |
Tessera, Inc. |
Staged via formation from both sides of chip
|
|
US8610259B2
(en)
|
2010-09-17 |
2013-12-17 |
Tessera, Inc. |
Multi-function and shielded 3D interconnects
|
|
KR101059490B1
(ko)
*
|
2010-11-15 |
2011-08-25 |
테세라 리써치 엘엘씨 |
임베드된 트레이스에 의해 구성된 전도성 패드
|
|
US8587126B2
(en)
|
2010-12-02 |
2013-11-19 |
Tessera, Inc. |
Stacked microelectronic assembly with TSVs formed in stages with plural active chips
|
|
US8736066B2
(en)
|
2010-12-02 |
2014-05-27 |
Tessera, Inc. |
Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
|
|
US8637968B2
(en)
|
2010-12-02 |
2014-01-28 |
Tessera, Inc. |
Stacked microelectronic assembly having interposer connecting active chips
|
|
JP2012124452A
(ja)
*
|
2010-12-06 |
2012-06-28 |
Samsung Electro-Mechanics Co Ltd |
プリント基板およびその製造方法
|
|
US8610264B2
(en)
|
2010-12-08 |
2013-12-17 |
Tessera, Inc. |
Compliant interconnects in wafers
|
|
CN102612262A
(zh)
*
|
2011-01-18 |
2012-07-25 |
三星半导体(中国)研究开发有限公司 |
焊盘结构及其制造方法
|
|
US8314026B2
(en)
|
2011-02-17 |
2012-11-20 |
Freescale Semiconductor, Inc. |
Anchored conductive via and method for forming
|
|
US9177914B2
(en)
|
2012-11-15 |
2015-11-03 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Metal pad structure over TSV to reduce shorting of upper metal layer
|
|
US9978637B2
(en)
*
|
2013-10-11 |
2018-05-22 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)
|
|
US20160093583A1
(en)
|
2014-09-25 |
2016-03-31 |
Micron Technology, Inc. |
Bond pad with micro-protrusions for direct metallic bonding
|
|
CN105742226B
(zh)
*
|
2014-12-09 |
2019-05-21 |
中国科学院微电子研究所 |
半导体器件制造方法
|
|
US9960130B2
(en)
*
|
2015-02-06 |
2018-05-01 |
UTAC Headquarters Pte. Ltd. |
Reliable interconnect
|
|
US9953940B2
(en)
*
|
2015-06-26 |
2018-04-24 |
International Business Machines Corporation |
Corrosion resistant aluminum bond pad structure
|
|
CN108807320A
(zh)
*
|
2018-06-01 |
2018-11-13 |
武汉新芯集成电路制造有限公司 |
芯片及键合垫的形成方法
|
|
KR20220083938A
(ko)
|
2020-12-11 |
2022-06-21 |
삼성디스플레이 주식회사 |
표시 장치
|