JP2005521764A5 - - Google Patents
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- Publication number
- JP2005521764A5 JP2005521764A5 JP2003580397A JP2003580397A JP2005521764A5 JP 2005521764 A5 JP2005521764 A5 JP 2005521764A5 JP 2003580397 A JP2003580397 A JP 2003580397A JP 2003580397 A JP2003580397 A JP 2003580397A JP 2005521764 A5 JP2005521764 A5 JP 2005521764A5
- Authority
- JP
- Japan
- Prior art keywords
- range
- substituted
- adhesive composition
- thermoplastic elastomer
- heteroatom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 3
- 125000005842 heteroatom Chemical group 0.000 claims 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 125000000743 hydrocarbylene group Chemical group 0.000 claims 4
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- -1 Polysiloxane Polymers 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 229920001400 block copolymer Polymers 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 150000001993 dienes Chemical class 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 150000003254 radicals Chemical class 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 125000000547 substituted alkyl group Chemical group 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/113,909 US6831132B2 (en) | 2002-03-28 | 2002-03-28 | Film adhesives containing maleimide compounds and methods for use thereof |
| PCT/US2003/009753 WO2003082940A1 (en) | 2002-03-28 | 2003-03-28 | Film adhesives containing maleimide and related compounds and methods for use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005521764A JP2005521764A (ja) | 2005-07-21 |
| JP2005521764A5 true JP2005521764A5 (https=) | 2012-03-29 |
Family
ID=28673669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003580397A Pending JP2005521764A (ja) | 2002-03-28 | 2003-03-28 | マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6831132B2 (https=) |
| JP (1) | JP2005521764A (https=) |
| KR (1) | KR101020375B1 (https=) |
| CN (1) | CN1649920A (https=) |
| AU (1) | AU2003233460A1 (https=) |
| WO (1) | WO2003082940A1 (https=) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003107427A1 (en) * | 2002-06-17 | 2003-12-24 | Henkel Loctite Corporation | Interlayer dielectric and pre-applied die attach adhesive materials |
| US7208566B2 (en) * | 2003-05-05 | 2007-04-24 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US8513375B2 (en) | 2003-05-05 | 2013-08-20 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US7884174B2 (en) | 2003-05-05 | 2011-02-08 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| WO2010019832A2 (en) | 2008-08-13 | 2010-02-18 | Designer Molecules, Inc. | Amide-extended crosslinking compounds and methods for use thereof |
| US7875688B2 (en) | 2004-06-04 | 2011-01-25 | Designer Molecules, Inc. | Free-radical curable polyesters and methods for use thereof |
| MXPA06014053A (es) * | 2004-06-04 | 2007-07-11 | Designer Molecules Inc | Poliesteres de radicales libres curables y metodos para uso de los mismos. |
| US7795362B2 (en) * | 2004-07-16 | 2010-09-14 | Designer Molecules, Inc. | Olefin oligomers containing pendant maleimide groups |
| US8043534B2 (en) | 2005-10-21 | 2011-10-25 | Designer Molecules, Inc. | Maleimide compositions and methods for use thereof |
| US8378017B2 (en) | 2005-12-29 | 2013-02-19 | Designer Molecules, Inc. | Thermosetting adhesive compositions |
| US8530573B2 (en) | 2006-05-10 | 2013-09-10 | Designer Molecules, Inc. | Modified calcium carbonate-filled adhesive compositions and methods for use thereof |
| US7691475B2 (en) * | 2006-07-21 | 2010-04-06 | 3M Innovative Properties Company | Anisotropic conductive adhesives |
| US8287686B2 (en) | 2006-07-24 | 2012-10-16 | Designer Molecules, Inc. | Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof |
| WO2008077140A2 (en) | 2006-12-19 | 2008-06-26 | Designer Molecules, Inc. | Hydrolytically resistant thermoset monomers |
| US7825188B2 (en) | 2006-12-19 | 2010-11-02 | Designer Molecules, Inc. | Thermoplastic elastomer with acyloxyphenyl hard block segment |
| KR100885794B1 (ko) * | 2006-12-27 | 2009-02-26 | 제일모직주식회사 | 라디칼 경화형 반도체 조립용 접착 필름 조성물 |
| WO2008092168A2 (en) * | 2007-01-26 | 2008-07-31 | Designer Molecules, Inc. | Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds |
| US20100113643A1 (en) * | 2007-04-09 | 2010-05-06 | Designer Molecules, Inc. | Curatives for epoxy adhesive compositions |
| US8431655B2 (en) | 2007-04-09 | 2013-04-30 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| US7868113B2 (en) | 2007-04-11 | 2011-01-11 | Designer Molecules, Inc. | Low shrinkage polyester thermosetting resins |
| US20100056671A1 (en) * | 2007-04-12 | 2010-03-04 | Designer Molecules, Inc. | Polyfunctional epoxy oligomers |
| WO2008130894A1 (en) | 2007-04-16 | 2008-10-30 | Designer Molecules, Inc. | Low temperature curing acrylate and maleimide based formulations and methods for use thereof |
| US7928153B2 (en) | 2007-08-14 | 2011-04-19 | Designer Molecules, Inc. | Thermosetting polyether oligomers, compositions and methods for use thereof |
| US20090050266A1 (en) * | 2007-08-21 | 2009-02-26 | Kang Yang | Crosslinked polymeric materials as filler and spacers in adhesives |
| WO2009035958A2 (en) * | 2007-09-13 | 2009-03-19 | 3M Innovative Properties Company | Low temperature bonding electronic adhesives |
| US8398898B2 (en) | 2008-02-23 | 2013-03-19 | Designer Molecules, Inc. | Soluble metal salts for use as conductivity promoters |
| WO2009117729A2 (en) | 2008-03-21 | 2009-09-24 | Designer Molecules, Inc. | Anti-bleed compounds, compositions and methods for use thereof |
| US7826200B2 (en) * | 2008-03-25 | 2010-11-02 | Avx Corporation | Electrolytic capacitor assembly containing a resettable fuse |
| US8308892B2 (en) | 2008-04-09 | 2012-11-13 | Designer Molecules, Inc. | Di-cinnamyl compounds and methods for use thereof |
| US8008419B2 (en) | 2008-08-13 | 2011-08-30 | Designer Molecules, Inc. | Siloxane monomers and methods for use thereof |
| US8217120B2 (en) | 2008-08-13 | 2012-07-10 | Designer Molecules, Inc. | Functionalized styrene oligomers and polymers |
| US8013104B2 (en) | 2008-08-13 | 2011-09-06 | Designer Molecules, Inc. | Thermosetting hyperbranched compositions and methods for use thereof |
| US8158748B2 (en) | 2008-08-13 | 2012-04-17 | Designer Molecules, Inc. | Hetero-functional compounds and methods for use thereof |
| US8288591B2 (en) | 2008-11-20 | 2012-10-16 | Designer Molecules, Inc. | Curing agents for epoxy resins |
| US8710682B2 (en) * | 2009-09-03 | 2014-04-29 | Designer Molecules Inc, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8415812B2 (en) | 2009-09-03 | 2013-04-09 | Designer Molecules, Inc. | Materials and methods for stress reduction in semiconductor wafer passivation layers |
| US8686162B2 (en) | 2010-08-25 | 2014-04-01 | Designer Molecules Inc, Inc. | Maleimide-functional monomers in amorphous form |
| US8816021B2 (en) | 2010-09-10 | 2014-08-26 | Designer Molecules, Inc. | Curable composition with rubber-like properties |
| FR2983204B1 (fr) * | 2011-11-30 | 2014-01-10 | Hutchinson | Composition liquide d'etancheite reticulable a la demande, son procede de preparation et ses applications |
| KR101499899B1 (ko) | 2011-12-27 | 2015-03-09 | 삼성전자 주식회사 | 광학필름용 고분자, 이의 제조 방법 및 이를 포함하는 광학필름 |
| US9550883B2 (en) | 2012-01-25 | 2017-01-24 | Henkel IP & Holding GmbH | Cyanoacrylate compositions |
| CN104204121A (zh) * | 2012-01-25 | 2014-12-10 | 汉高美国知识产权有限责任公司 | 氰基丙烯酸酯组合物 |
| TWI651387B (zh) | 2013-09-30 | 2019-02-21 | 漢高智慧財產控股公司 | 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物 |
| CN104531047B (zh) * | 2015-01-13 | 2016-06-08 | 黑龙江省科学院石油化学研究院 | 一种低填充量的耐高温导热双马来酰亚胺胶黏剂及其制备方法和胶黏剂的应用 |
| JP2019511587A (ja) * | 2016-02-04 | 2019-04-25 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 剥離可能接着剤及びその高温使用 |
| TWI839353B (zh) * | 2018-06-28 | 2024-04-21 | 德商漢高股份有限及兩合公司 | 展現低固化溫度之含有潛還原劑的陽離子性可固化組合物 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851454A (en) * | 1986-07-17 | 1989-07-25 | The Dow Chemical Company | Photolytically crosslinkable thermally stable composition |
| US5015695A (en) * | 1989-05-09 | 1991-05-14 | Shell Oil Company | Functionalized elastomeric polymer production |
| EP0759946B1 (en) * | 1994-05-19 | 2005-01-26 | E.I. Du Pont De Nemours And Company | Coatings comprising self-stabilized lattices prepared in an aqueous carrier |
| US5717034A (en) * | 1996-07-29 | 1998-02-10 | Quantum Materials, Inc. | Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor |
| JPH10147762A (ja) * | 1996-11-20 | 1998-06-02 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
| JPH1112555A (ja) * | 1997-06-24 | 1999-01-19 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
| WO1999001519A1 (fr) | 1997-07-04 | 1999-01-14 | Nippon Zeon Co., Ltd. | Adhesif pour composants semi-conducteurs |
| US5973166A (en) | 1998-03-02 | 1999-10-26 | The Dexter Corporation | Method for the preparation of maleimides |
| JP2000044905A (ja) * | 1998-03-18 | 2000-02-15 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤及びそれを用いた電子機器 |
| SG105450A1 (en) * | 1998-07-02 | 2004-08-27 | Nat Starch Chem Invest | Allylated amide compounds and die attach adhesives prepared therefrom |
| US6355750B1 (en) * | 1998-07-02 | 2002-03-12 | National Starch And Chemical Investment Holding Corporation | Dye attach adhesives for use in microelectronic devices |
| US6265530B1 (en) * | 1998-07-02 | 2001-07-24 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives for use in microelectronic devices |
| JP2000248240A (ja) * | 1999-03-01 | 2000-09-12 | Nitto Denko Corp | 加熱剥離型粘着シート |
| JP2001011135A (ja) * | 1999-06-30 | 2001-01-16 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| DE60109356T2 (de) * | 2000-05-18 | 2005-07-28 | National Starch And Chemical Investment Holding Corp., Wilmington | Vinylether und Karbamat oder Harnstofffunktionalität enthaltende Haftklebemittel für Halbleiterplatten |
| US6620651B2 (en) | 2001-10-23 | 2003-09-16 | National Starch And Chemical Investment Holding Corporation | Adhesive wafers for die attach application |
-
2002
- 2002-03-28 US US10/113,909 patent/US6831132B2/en not_active Expired - Lifetime
-
2003
- 2003-03-28 KR KR1020047015488A patent/KR101020375B1/ko not_active Expired - Lifetime
- 2003-03-28 JP JP2003580397A patent/JP2005521764A/ja active Pending
- 2003-03-28 WO PCT/US2003/009753 patent/WO2003082940A1/en not_active Ceased
- 2003-03-28 CN CNA038095343A patent/CN1649920A/zh active Pending
- 2003-03-28 AU AU2003233460A patent/AU2003233460A1/en not_active Abandoned
-
2004
- 2004-12-13 US US11/008,980 patent/US20050107542A1/en not_active Abandoned
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