JP2005521764A5 - - Google Patents

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Publication number
JP2005521764A5
JP2005521764A5 JP2003580397A JP2003580397A JP2005521764A5 JP 2005521764 A5 JP2005521764 A5 JP 2005521764A5 JP 2003580397 A JP2003580397 A JP 2003580397A JP 2003580397 A JP2003580397 A JP 2003580397A JP 2005521764 A5 JP2005521764 A5 JP 2005521764A5
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JP
Japan
Prior art keywords
range
substituted
adhesive composition
thermoplastic elastomer
heteroatom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003580397A
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English (en)
Japanese (ja)
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JP2005521764A (ja
Filing date
Publication date
Priority claimed from US10/113,909 external-priority patent/US6831132B2/en
Application filed filed Critical
Publication of JP2005521764A publication Critical patent/JP2005521764A/ja
Publication of JP2005521764A5 publication Critical patent/JP2005521764A5/ja
Pending legal-status Critical Current

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JP2003580397A 2002-03-28 2003-03-28 マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法 Pending JP2005521764A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/113,909 US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof
PCT/US2003/009753 WO2003082940A1 (en) 2002-03-28 2003-03-28 Film adhesives containing maleimide and related compounds and methods for use thereof

Publications (2)

Publication Number Publication Date
JP2005521764A JP2005521764A (ja) 2005-07-21
JP2005521764A5 true JP2005521764A5 (https=) 2012-03-29

Family

ID=28673669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003580397A Pending JP2005521764A (ja) 2002-03-28 2003-03-28 マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法

Country Status (6)

Country Link
US (2) US6831132B2 (https=)
JP (1) JP2005521764A (https=)
KR (1) KR101020375B1 (https=)
CN (1) CN1649920A (https=)
AU (1) AU2003233460A1 (https=)
WO (1) WO2003082940A1 (https=)

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US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US20100056671A1 (en) * 2007-04-12 2010-03-04 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US8063161B2 (en) 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
CN101849179B (zh) * 2007-09-13 2013-12-18 3M创新有限公司 低温粘结的电子粘合剂
US8398898B2 (en) * 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
WO2009117729A2 (en) * 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
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US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8158748B2 (en) * 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8288591B2 (en) * 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
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US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
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KR101499899B1 (ko) 2011-12-27 2015-03-09 삼성전자 주식회사 광학필름용 고분자, 이의 제조 방법 및 이를 포함하는 광학필름
WO2013112315A1 (en) * 2012-01-25 2013-08-01 Henkel Corporation Cyanoacrylate compositions
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
TWI651387B (zh) 2013-09-30 2019-02-21 漢高智慧財產控股公司 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物
CN104531047B (zh) * 2015-01-13 2016-06-08 黑龙江省科学院石油化学研究院 一种低填充量的耐高温导热双马来酰亚胺胶黏剂及其制备方法和胶黏剂的应用
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