KR101020375B1 - 말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법 - Google Patents

말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법 Download PDF

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Publication number
KR101020375B1
KR101020375B1 KR1020047015488A KR20047015488A KR101020375B1 KR 101020375 B1 KR101020375 B1 KR 101020375B1 KR 1020047015488 A KR1020047015488 A KR 1020047015488A KR 20047015488 A KR20047015488 A KR 20047015488A KR 101020375 B1 KR101020375 B1 KR 101020375B1
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South Korea
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adhesive composition
alkyl
substituted
range
chain
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KR20050012724A (ko
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푸웨이 리우
스티븐 엠. 더쉠
캉 양
캐롤린 씨 알비노
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헨켈 코포레이션
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Assigned to 헨켈 유에스 아이피 엘엘씨 reassignment 헨켈 유에스 아이피 엘엘씨 권리의 전부이전등록 Assignors: 헨켈 코포레이션
Assigned to 헨켈 아이피 앤드 홀딩 게엠베하 reassignment 헨켈 아이피 앤드 홀딩 게엠베하 권리의 전부이전등록 Assignors: 헨켈 유에스 아이피 엘엘씨
Assigned to 헨켈 아게 운트 코. 카게아아 reassignment 헨켈 아게 운트 코. 카게아아 권리의 전부이전등록 Assignors: 헨켈 아이피 앤드 홀딩 게엠베하
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09J179/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
KR1020047015488A 2002-03-28 2003-03-28 말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법 Expired - Lifetime KR101020375B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/113,909 2002-03-28
US10/113,909 US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof
PCT/US2003/009753 WO2003082940A1 (en) 2002-03-28 2003-03-28 Film adhesives containing maleimide and related compounds and methods for use thereof

Publications (2)

Publication Number Publication Date
KR20050012724A KR20050012724A (ko) 2005-02-02
KR101020375B1 true KR101020375B1 (ko) 2011-03-08

Family

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Family Applications (1)

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KR1020047015488A Expired - Lifetime KR101020375B1 (ko) 2002-03-28 2003-03-28 말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법

Country Status (6)

Country Link
US (2) US6831132B2 (https=)
JP (1) JP2005521764A (https=)
KR (1) KR101020375B1 (https=)
CN (1) CN1649920A (https=)
AU (1) AU2003233460A1 (https=)
WO (1) WO2003082940A1 (https=)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101164671B1 (ko) * 2002-06-17 2012-07-11 헨켈 코포레이션 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
KR101179815B1 (ko) * 2003-05-05 2012-09-04 디자이너 몰레큘스 인코퍼레이티드 이미드-연결된 말레이미드 및 폴리말레이미드 화합물
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US7875688B2 (en) 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
WO2005121190A2 (en) * 2004-06-04 2005-12-22 Designer Molecules Inc. Free-radical curable polyesters and methods for use thereof
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US7691475B2 (en) * 2006-07-21 2010-04-06 3M Innovative Properties Company Anisotropic conductive adhesives
US8287686B2 (en) 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US8344076B2 (en) * 2006-12-19 2013-01-01 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
US7825188B2 (en) * 2006-12-19 2010-11-02 Designer Molecules, Inc. Thermoplastic elastomer with acyloxyphenyl hard block segment
KR100885794B1 (ko) * 2006-12-27 2009-02-26 제일모직주식회사 라디칼 경화형 반도체 조립용 접착 필름 조성물
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US20100056671A1 (en) * 2007-04-12 2010-03-04 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US8063161B2 (en) 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
CN101849179B (zh) * 2007-09-13 2013-12-18 3M创新有限公司 低温粘结的电子粘合剂
US8398898B2 (en) * 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
WO2009117729A2 (en) * 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US7826200B2 (en) * 2008-03-25 2010-11-02 Avx Corporation Electrolytic capacitor assembly containing a resettable fuse
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8158748B2 (en) * 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8288591B2 (en) * 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
FR2983204B1 (fr) 2011-11-30 2014-01-10 Hutchinson Composition liquide d'etancheite reticulable a la demande, son procede de preparation et ses applications
KR101499899B1 (ko) 2011-12-27 2015-03-09 삼성전자 주식회사 광학필름용 고분자, 이의 제조 방법 및 이를 포함하는 광학필름
WO2013112315A1 (en) * 2012-01-25 2013-08-01 Henkel Corporation Cyanoacrylate compositions
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
TWI651387B (zh) 2013-09-30 2019-02-21 漢高智慧財產控股公司 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物
CN104531047B (zh) * 2015-01-13 2016-06-08 黑龙江省科学院石油化学研究院 一种低填充量的耐高温导热双马来酰亚胺胶黏剂及其制备方法和胶黏剂的应用
CN108699411B (zh) * 2016-02-04 2021-03-26 苏州润邦半导体材料科技有限公司 可脱粘粘合剂及其高温用途
TWI839353B (zh) * 2018-06-28 2024-04-21 德商漢高股份有限及兩合公司 展現低固化溫度之含有潛還原劑的陽離子性可固化組合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
EP0970946A2 (en) * 1998-07-02 2000-01-12 National Starch and Chemical Investment Holding Corporation Allylated amide compounds and die attach adhesives prepared therefrom
KR20010006722A (ko) * 1999-03-01 2001-01-26 가마이 고로 가열-박리성 감압성 접착제 시이트
KR100568491B1 (ko) 1997-07-04 2006-04-07 제온 코포레이션 반도체부품 접착제

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851454A (en) * 1986-07-17 1989-07-25 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US5015695A (en) * 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
BR9507878A (pt) * 1994-05-19 1997-08-12 Du Pont Composição de revestimento composição de revestimento transparente camada de base de pigmento e processo para preparar uma composição de revestimento
JPH10147762A (ja) * 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH1112555A (ja) * 1997-06-24 1999-01-19 Sumitomo Bakelite Co Ltd 異方導電性接着剤
US5973166A (en) 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
JP2000044905A (ja) * 1998-03-18 2000-02-15 Sumitomo Bakelite Co Ltd 異方導電性接着剤及びそれを用いた電子機器
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
JP2001011135A (ja) * 1999-06-30 2001-01-16 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2002047475A (ja) * 2000-05-18 2002-02-12 Natl Starch & Chem Investment Holding Corp ビニルエーテルおよびカルバメートまたは尿素官能基を有するダイ結合性接着剤
US6620651B2 (en) * 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
KR100568491B1 (ko) 1997-07-04 2006-04-07 제온 코포레이션 반도체부품 접착제
EP0970946A2 (en) * 1998-07-02 2000-01-12 National Starch and Chemical Investment Holding Corporation Allylated amide compounds and die attach adhesives prepared therefrom
KR20010006722A (ko) * 1999-03-01 2001-01-26 가마이 고로 가열-박리성 감압성 접착제 시이트

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JP2005521764A (ja) 2005-07-21
CN1649920A (zh) 2005-08-03
WO2003082940A1 (en) 2003-10-09
US20030199638A1 (en) 2003-10-23
US6831132B2 (en) 2004-12-14
US20050107542A1 (en) 2005-05-19
AU2003233460A1 (en) 2003-10-13
KR20050012724A (ko) 2005-02-02

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