JP2005521764A - マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法 - Google Patents

マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法 Download PDF

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JP2005521764A
JP2005521764A JP2003580397A JP2003580397A JP2005521764A JP 2005521764 A JP2005521764 A JP 2005521764A JP 2003580397 A JP2003580397 A JP 2003580397A JP 2003580397 A JP2003580397 A JP 2003580397A JP 2005521764 A JP2005521764 A JP 2005521764A
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alkyl
adhesive composition
substituted
independently
group
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JP2005521764A5 (enExample
Inventor
プウェイ リウ、
スティーヴン エム． ダーシェム、
カン ヤン、
キャロリン シー． アルビノ、
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Henkel Corp
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Henkel Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
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    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
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    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
JP2003580397A 2002-03-28 2003-03-28 マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法 Pending JP2005521764A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/113,909 US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof
PCT/US2003/009753 WO2003082940A1 (en) 2002-03-28 2003-03-28 Film adhesives containing maleimide and related compounds and methods for use thereof

Publications (2)

Publication Number Publication Date
JP2005521764A true JP2005521764A (ja) 2005-07-21
JP2005521764A5 JP2005521764A5 (enExample) 2012-03-29

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JP2003580397A Pending JP2005521764A (ja) 2002-03-28 2003-03-28 マレイミドおよび関連化合物を含有するフィルム接着剤およびそれを用いた方法

Country Status (6)

Country Link
US (2) US6831132B2 (enExample)
JP (1) JP2005521764A (enExample)
KR (1) KR101020375B1 (enExample)
CN (1) CN1649920A (enExample)
AU (1) AU2003233460A1 (enExample)
WO (1) WO2003082940A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015510003A (ja) * 2012-01-25 2015-04-02 ヘンケル ユーエス アイピー エルエルシー シアノアクリレート組成物
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions

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KR101136719B1 (ko) * 2002-06-17 2012-04-20 헨켈 코포레이션 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
JP5328006B2 (ja) * 2003-05-05 2013-10-30 デジグナー モレキュールズ インコーポレイテッド イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7875688B2 (en) 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
JP2008501826A (ja) * 2004-06-04 2008-01-24 デジグナー モレキュールズ インコーポレイテッド フリーラジカル硬化可能なポリエステル類およびその使用方法
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US7691475B2 (en) * 2006-07-21 2010-04-06 3M Innovative Properties Company Anisotropic conductive adhesives
US8287686B2 (en) 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US7825188B2 (en) 2006-12-19 2010-11-02 Designer Molecules, Inc. Thermoplastic elastomer with acyloxyphenyl hard block segment
US8344076B2 (en) 2006-12-19 2013-01-01 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
KR100885794B1 (ko) * 2006-12-27 2009-02-26 제일모직주식회사 라디칼 경화형 반도체 조립용 접착 필름 조성물
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
WO2008124797A1 (en) * 2007-04-09 2008-10-16 Designer Molecules, Inc. Curatives for epoxy compositions
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