CN1649920A - 含有马来酰亚胺和相关化合物的粘合膜及其使用方法 - Google Patents

含有马来酰亚胺和相关化合物的粘合膜及其使用方法 Download PDF

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CN1649920A
CN1649920A CNA038095343A CN03809534A CN1649920A CN 1649920 A CN1649920 A CN 1649920A CN A038095343 A CNA038095343 A CN A038095343A CN 03809534 A CN03809534 A CN 03809534A CN 1649920 A CN1649920 A CN 1649920A
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alkyl
group
independently
binder composition
chain
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Chinese (zh)
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刘圃伟
S·M·德施姆
杨钢
C·C·阿尔比诺
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Henkel Corp
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Henkel Corp
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  • Chemical & Material Sciences (AREA)
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  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
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  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
CNA038095343A 2002-03-28 2003-03-28 含有马来酰亚胺和相关化合物的粘合膜及其使用方法 Pending CN1649920A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/113,909 US6831132B2 (en) 2002-03-28 2002-03-28 Film adhesives containing maleimide compounds and methods for use thereof
US10/113,909 2002-03-28

Publications (1)

Publication Number Publication Date
CN1649920A true CN1649920A (zh) 2005-08-03

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CNA038095343A Pending CN1649920A (zh) 2002-03-28 2003-03-28 含有马来酰亚胺和相关化合物的粘合膜及其使用方法

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Country Link
US (2) US6831132B2 (enExample)
JP (1) JP2005521764A (enExample)
KR (1) KR101020375B1 (enExample)
CN (1) CN1649920A (enExample)
AU (1) AU2003233460A1 (enExample)
WO (1) WO2003082940A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103131185A (zh) * 2011-11-30 2013-06-05 哈特奇桑公司 一种按需固化的液态密封剂组合物及其制备方法和应用
CN108699411A (zh) * 2016-02-04 2018-10-23 汉高知识产权控股有限责任公司 可脱粘粘合剂及其高温用途

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101136719B1 (ko) * 2002-06-17 2012-04-20 헨켈 코포레이션 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
JP5328006B2 (ja) * 2003-05-05 2013-10-30 デジグナー モレキュールズ インコーポレイテッド イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7875688B2 (en) 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
JP2008501826A (ja) * 2004-06-04 2008-01-24 デジグナー モレキュールズ インコーポレイテッド フリーラジカル硬化可能なポリエステル類およびその使用方法
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US7691475B2 (en) * 2006-07-21 2010-04-06 3M Innovative Properties Company Anisotropic conductive adhesives
US8287686B2 (en) 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
US7825188B2 (en) 2006-12-19 2010-11-02 Designer Molecules, Inc. Thermoplastic elastomer with acyloxyphenyl hard block segment
US8344076B2 (en) 2006-12-19 2013-01-01 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
KR100885794B1 (ko) * 2006-12-27 2009-02-26 제일모직주식회사 라디칼 경화형 반도체 조립용 접착 필름 조성물
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
WO2008124797A1 (en) * 2007-04-09 2008-10-16 Designer Molecules, Inc. Curatives for epoxy compositions
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US20100056671A1 (en) * 2007-04-12 2010-03-04 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US8063161B2 (en) 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
CN101849179B (zh) * 2007-09-13 2013-12-18 3M创新有限公司 低温粘结的电子粘合剂
US8398898B2 (en) 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
WO2009117729A2 (en) 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US7826200B2 (en) * 2008-03-25 2010-11-02 Avx Corporation Electrolytic capacitor assembly containing a resettable fuse
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8217120B2 (en) 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8013104B2 (en) 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8158748B2 (en) 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8288591B2 (en) 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
KR101499899B1 (ko) 2011-12-27 2015-03-09 삼성전자 주식회사 광학필름용 고분자, 이의 제조 방법 및 이를 포함하는 광학필름
CN104204121A (zh) * 2012-01-25 2014-12-10 汉高美国知识产权有限责任公司 氰基丙烯酸酯组合物
US9550883B2 (en) 2012-01-25 2017-01-24 Henkel IP & Holding GmbH Cyanoacrylate compositions
TWI651387B (zh) 2013-09-30 2019-02-21 漢高智慧財產控股公司 用於大型晶粒半導體封裝之導電黏晶薄膜及供其製備之組合物
CN104531047B (zh) * 2015-01-13 2016-06-08 黑龙江省科学院石油化学研究院 一种低填充量的耐高温导热双马来酰亚胺胶黏剂及其制备方法和胶黏剂的应用
TWI839353B (zh) * 2018-06-28 2024-04-21 德商漢高股份有限及兩合公司 展現低固化溫度之含有潛還原劑的陽離子性可固化組合物

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851454A (en) * 1986-07-17 1989-07-25 The Dow Chemical Company Photolytically crosslinkable thermally stable composition
US5015695A (en) * 1989-05-09 1991-05-14 Shell Oil Company Functionalized elastomeric polymer production
CA2188552A1 (en) * 1994-05-19 1995-11-30 Jozef Huybrechts Coatings comprising self-stabilized lattices prepared in an aqueous carrier
US5717034A (en) 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
JPH10147762A (ja) * 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH1112555A (ja) * 1997-06-24 1999-01-19 Sumitomo Bakelite Co Ltd 異方導電性接着剤
DE69826476T2 (de) 1997-07-04 2005-01-20 Nippon Zeon Co., Ltd. Klebstoff für halbleiterbauteile
US5973166A (en) 1998-03-02 1999-10-26 The Dexter Corporation Method for the preparation of maleimides
JP2000044905A (ja) * 1998-03-18 2000-02-15 Sumitomo Bakelite Co Ltd 異方導電性接着剤及びそれを用いた電子機器
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
SG105450A1 (en) * 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
JP2000248240A (ja) * 1999-03-01 2000-09-12 Nitto Denko Corp 加熱剥離型粘着シート
JP2001011135A (ja) * 1999-06-30 2001-01-16 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
ATE291048T1 (de) * 2000-05-18 2005-04-15 Nat Starch Chem Invest Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten
US6620651B2 (en) 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103131185A (zh) * 2011-11-30 2013-06-05 哈特奇桑公司 一种按需固化的液态密封剂组合物及其制备方法和应用
CN108699411A (zh) * 2016-02-04 2018-10-23 汉高知识产权控股有限责任公司 可脱粘粘合剂及其高温用途

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