ATE291048T1 - Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten - Google Patents

Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten

Info

Publication number
ATE291048T1
ATE291048T1 AT01111271T AT01111271T ATE291048T1 AT E291048 T1 ATE291048 T1 AT E291048T1 AT 01111271 T AT01111271 T AT 01111271T AT 01111271 T AT01111271 T AT 01111271T AT E291048 T1 ATE291048 T1 AT E291048T1
Authority
AT
Austria
Prior art keywords
vinyl ether
carbamat
containing vinyl
urea functionality
adhesives containing
Prior art date
Application number
AT01111271T
Other languages
English (en)
Inventor
Osama M Musa
Donald E Herr
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of ATE291048T1 publication Critical patent/ATE291048T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67Unsaturated compounds having active hydrogen
    • C08G18/671Unsaturated compounds having only one group containing active hydrogen
    • C08G18/6715Unsaturated monofunctional alcohols or amines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J135/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/08Copolymers with vinyl ethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Conductive Materials (AREA)
AT01111271T 2000-05-18 2001-05-16 Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten ATE291048T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57330300A 2000-05-18 2000-05-18

Publications (1)

Publication Number Publication Date
ATE291048T1 true ATE291048T1 (de) 2005-04-15

Family

ID=24291427

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01111271T ATE291048T1 (de) 2000-05-18 2001-05-16 Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten

Country Status (11)

Country Link
US (2) US20020032260A1 (de)
EP (1) EP1156068B1 (de)
JP (1) JP2002047475A (de)
KR (1) KR100789332B1 (de)
CN (1) CN1180044C (de)
AT (1) ATE291048T1 (de)
CA (1) CA2347872A1 (de)
DE (1) DE60109356T2 (de)
HK (1) HK1042316A1 (de)
SG (1) SG95650A1 (de)
TW (1) TWI301491B (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2347872A1 (en) * 2000-05-18 2001-11-18 National Starch And Chemical Investment Holding Corporation Die attach adhesives with vinyl ether and carbamate or urea functionality
US6831132B2 (en) * 2002-03-28 2004-12-14 Henkel Corporation Film adhesives containing maleimide compounds and methods for use thereof
US20030232926A1 (en) * 2002-05-14 2003-12-18 Nikolic Nikola A. Thermoset adhesive films
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
KR101179815B1 (ko) * 2003-05-05 2012-09-04 디자이너 몰레큘스 인코퍼레이티드 이미드-연결된 말레이미드 및 폴리말레이미드 화합물
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
TW200610753A (en) * 2004-05-02 2006-04-01 Ashland Inc Radiation-curable coatings for metal substrates from multifunctional acrylate oligomers
US20050267254A1 (en) * 2004-05-28 2005-12-01 Mizori Farhad G Functionalized urethanes and methods for use thereof
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
WO2005121190A2 (en) * 2004-06-04 2005-12-22 Designer Molecules Inc. Free-radical curable polyesters and methods for use thereof
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications
JP5478827B2 (ja) * 2004-10-28 2014-04-23 ダウ・コーニング・コーポレイション 硬化可能な伝導組成物
JP2006193666A (ja) * 2005-01-14 2006-07-27 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きキャリア材料および半導体装置
US20060235137A1 (en) * 2005-04-18 2006-10-19 Eunsook Chae Die attach adhesives with improved stress performance
EP1926602B1 (de) * 2005-09-21 2014-06-18 Dow Corning Corporation Organoboran-amin-komplexe verwendendes, unter umgebungsbedingungen durchgeführtes lithographisches verfahren
US8043534B2 (en) * 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
DE602006001393D1 (de) * 2006-03-06 2008-07-17 Umicore Ag & Co Kg Zusammensetzung zur Befestigung von Hochleistungshalbleiter
WO2008092168A2 (en) * 2007-01-26 2008-07-31 Designer Molecules, Inc. Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008130894A1 (en) * 2007-04-16 2008-10-30 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8158748B2 (en) 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
GB201102035D0 (en) * 2011-02-04 2011-03-23 Zephyros Inc Improvements in or relating to extrusion
WO2013161828A1 (ja) * 2012-04-27 2013-10-31 旭硝子株式会社 蓄電デバイス用バインダー
KR102058113B1 (ko) * 2015-11-23 2019-12-23 주식회사 엘지화학 접착력이 개선된 리튬 이차전지용 전극 및 이의 제조방법

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2116082A (en) * 1982-02-26 1983-09-21 Gen Electric Inserts for cutting tools
US4486582A (en) * 1983-01-27 1984-12-04 The Dow Chemical Company Reactive monomers and thermosettable compositions containing same
CA1229196A (en) * 1983-07-18 1987-11-10 General Electric Company Polyimide molding compositions
US4543397A (en) * 1984-06-18 1985-09-24 Loctite (Ireland) Ltd. Styryloxy resins and compositions thereof
US4732956A (en) * 1984-06-18 1988-03-22 Loctite (Ireland) Ltd. Styryloxy resins and compositions thereof
US4640849A (en) * 1986-01-31 1987-02-03 Loctite (Ireland) Limited Meta-bridged styryloxy resins
US4751273A (en) * 1986-08-19 1988-06-14 Allied-Signal, Inc. Vinyl ether terminated urethane resins
US4749807A (en) * 1987-02-17 1988-06-07 Allied-Signal Inc. Vinyl ether terminated ester oligomers
US4775732A (en) * 1988-01-11 1988-10-04 Allied-Signal Inc. Vinyl ether terminated ester and urethane resins from bis(hydroxyalkyl)cycloalkanes
US5334456A (en) * 1988-08-12 1994-08-02 Stamicarbon B.V. Free-radical curable compositions
AU4432789A (en) * 1988-11-10 1990-05-17 Loctite (Ireland) Limited Polymerisable styryloxy resins and compositions thereof
US5183946A (en) * 1989-02-08 1993-02-02 Isp Investments Inc. Vinyloxy hydroxyalkylcycloalkane and preparation therefor
US5084490A (en) * 1990-12-10 1992-01-28 Loctite (Ireland) Limited Styryloxy compounds and polymers thereof
CA2139124A1 (en) 1993-05-03 1994-11-10 Anthony F. Jacobine Polymer dispersed liquid crystals in electron-rich alkene-thiol polymers
ATE195510T1 (de) 1993-08-09 2000-09-15 Ciba Sc Holding Ag Neue urethangruppenhaltige (meth)acrylate
US6034194A (en) 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
US5514727A (en) 1994-07-13 1996-05-07 Alliedsignal Inc. Stabilizers for vinyl ether-based coating systems
US5491178A (en) 1994-07-13 1996-02-13 Alliedsignal Inc. Hydrogen stabilizers for vinyl ether-based coating systems
US5539014A (en) 1994-07-13 1996-07-23 Alliedsignal Inc. Adhesion promoters for vinyl ether-based coating systems
US5789757A (en) 1996-09-10 1998-08-04 The Dexter Corporation Malemide containing formulations and uses therefor
US5708129A (en) 1995-04-28 1998-01-13 Johnson Matthey, Inc. Die attach adhesive with reduced resin bleed
US5633411A (en) 1995-06-07 1997-05-27 Loctite Corporation Method for production of allyloxystyrene compounds
US6121358A (en) 1997-09-22 2000-09-19 The Dexter Corporation Hydrophobic vinyl monomers, formulations containing same, and uses therefor
US6291704B1 (en) 1998-01-20 2001-09-18 Alliedsignal Inc. Polymerizable halogenated vinyl ethers
EP1084390A4 (de) 1998-06-09 2005-07-27 California Inst Of Techn Kolloidal-teilchen zur verwendung in sensor-arrays
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
CA2347872A1 (en) * 2000-05-18 2001-11-18 National Starch And Chemical Investment Holding Corporation Die attach adhesives with vinyl ether and carbamate or urea functionality

Also Published As

Publication number Publication date
US6699929B2 (en) 2004-03-02
KR100789332B1 (ko) 2007-12-28
DE60109356T2 (de) 2005-07-28
JP2002047475A (ja) 2002-02-12
US20020032260A1 (en) 2002-03-14
CN1324908A (zh) 2001-12-05
EP1156068B1 (de) 2005-03-16
CN1180044C (zh) 2004-12-15
TWI301491B (en) 2008-10-01
EP1156068A1 (de) 2001-11-21
KR20010106259A (ko) 2001-11-29
SG95650A1 (en) 2003-04-23
US20020032257A1 (en) 2002-03-14
HK1042316A1 (en) 2002-08-09
CA2347872A1 (en) 2001-11-18
DE60109356D1 (de) 2005-04-21

Similar Documents

Publication Publication Date Title
ATE291048T1 (de) Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten
MX2007003984A (es) Materiales elastizados.
DE69826476D1 (de) Klebstoff für halbleiterbauteile
DK1743008T3 (da) Tokomponent-klæbe/forseglingsmiddel
FR2781794B1 (fr) Compose photo-initiateur, composition le contenant, et leurs utilisations
DE60132471D1 (de) Modulation der immunostimulatorischen aktivität von immunostimulierenden oligonukleotidanaloga durch positionelle chemische veränderungen
ATE254145T1 (de) Beschichtungsstoff mit einer mischung aus kieselsäuren und harnstoff und/oder harnstoffderivaten
ATE526999T1 (de) Enzyminhibierende klebstoffe
DE60237851D1 (de) Modifiziertes Propylenpolymer, dieses enthaltende Zusammensetzung und deren Verwendung
DE60225398D1 (de) Transparente druckempfindliche Klebstoffzusammensetzung und damit hergestellte druckempfindliche Klebefolie
HK1064697A1 (en) Polyurethane bonding agent having two constituentsand used as an adhesive
DE60225375D1 (de) Druckempfindlicher Klebebogen zur Bearbeitung von Halbleiter-Wafers
NO20015713D0 (no) Naftalenurea som glukoseopptaksforsterkere
BR0305192B1 (pt) conversor de amônia
DE69915903D1 (de) Gehäuse für Halbleiterbauelemente und Halbleitermodul, das das Gehäuse verwendet
DE69829322D1 (de) Druckempfindliche Klebefolie für Oberflächenschutz, und druckempfindliche Klebstoffzusammensetzung für Oberflächenschutz
DE50000153D1 (de) Spitzer, insbesondere für Weichminenstifte
DE59900399D1 (de) Spitzer, insbesondere für Weichminenstifte
DE60320440D1 (de) Stickstoff-oxidierung der geätzten mos-gate-struktur
NO20004737L (no) Herdemiddel for anvendelse i urea-formaldehyd og urea-melamin- formaldehydbaserte adhesiver, og et adhesivpreparat omfattende nevnte herdemiddel og dets anvendelse
DE60107071D1 (de) Polymerische zusammensetzung für die verpackung von einer halbleitervorrichtung und damit hergestellte verpackung
ID29383A (id) Perekat yang mengeras dalam beberapa tingkatan
DE60317828D1 (de) Klebstoffzusammensetzung für verpackungsklebebänder und diese zusammensetzung enthaltende klebebänder
ATE327873T1 (de) Bearbeitungsstation
DE50109576D1 (de) Klebeband für das endloskleben am kalander

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties