KR101020375B1 - 말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법 - Google Patents
말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법 Download PDFInfo
- Publication number
- KR101020375B1 KR101020375B1 KR1020047015488A KR20047015488A KR101020375B1 KR 101020375 B1 KR101020375 B1 KR 101020375B1 KR 1020047015488 A KR1020047015488 A KR 1020047015488A KR 20047015488 A KR20047015488 A KR 20047015488A KR 101020375 B1 KR101020375 B1 KR 101020375B1
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- alkyl
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- chain
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- Expired - Lifetime
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- 0 CCCC(C)(*)C(N(*)CC=C[C@@](C)C=C)=O Chemical compound CCCC(C)(*)C(N(*)CC=C[C@@](C)C=C)=O 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09J179/085—Unsaturated polyimide precursors
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- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/113,909 US6831132B2 (en) | 2002-03-28 | 2002-03-28 | Film adhesives containing maleimide compounds and methods for use thereof |
| US10/113,909 | 2002-03-28 | ||
| PCT/US2003/009753 WO2003082940A1 (en) | 2002-03-28 | 2003-03-28 | Film adhesives containing maleimide and related compounds and methods for use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050012724A KR20050012724A (ko) | 2005-02-02 |
| KR101020375B1 true KR101020375B1 (ko) | 2011-03-08 |
Family
ID=28673669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020047015488A Expired - Lifetime KR101020375B1 (ko) | 2002-03-28 | 2003-03-28 | 말레이미드 및 관련 화합물을 함유하는 필름 접착제 및그의 사용 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6831132B2 (enExample) |
| JP (1) | JP2005521764A (enExample) |
| KR (1) | KR101020375B1 (enExample) |
| CN (1) | CN1649920A (enExample) |
| AU (1) | AU2003233460A1 (enExample) |
| WO (1) | WO2003082940A1 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101136719B1 (ko) * | 2002-06-17 | 2012-04-20 | 헨켈 코포레이션 | 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질 |
| WO2010019832A2 (en) | 2008-08-13 | 2010-02-18 | Designer Molecules, Inc. | Amide-extended crosslinking compounds and methods for use thereof |
| JP5328006B2 (ja) * | 2003-05-05 | 2013-10-30 | デジグナー モレキュールズ インコーポレイテッド | イミド−リンクしたマレインイミドおよびポリマレインイミド化合物 |
| US8513375B2 (en) | 2003-05-05 | 2013-08-20 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US7884174B2 (en) | 2003-05-05 | 2011-02-08 | Designer Molecules, Inc. | Imide-linked maleimide and polymaleimide compounds |
| US7875688B2 (en) | 2004-06-04 | 2011-01-25 | Designer Molecules, Inc. | Free-radical curable polyesters and methods for use thereof |
| JP2008501826A (ja) * | 2004-06-04 | 2008-01-24 | デジグナー モレキュールズ インコーポレイテッド | フリーラジカル硬化可能なポリエステル類およびその使用方法 |
| US7795362B2 (en) * | 2004-07-16 | 2010-09-14 | Designer Molecules, Inc. | Olefin oligomers containing pendant maleimide groups |
| US8043534B2 (en) | 2005-10-21 | 2011-10-25 | Designer Molecules, Inc. | Maleimide compositions and methods for use thereof |
| US8378017B2 (en) | 2005-12-29 | 2013-02-19 | Designer Molecules, Inc. | Thermosetting adhesive compositions |
| US8530573B2 (en) | 2006-05-10 | 2013-09-10 | Designer Molecules, Inc. | Modified calcium carbonate-filled adhesive compositions and methods for use thereof |
| US7691475B2 (en) * | 2006-07-21 | 2010-04-06 | 3M Innovative Properties Company | Anisotropic conductive adhesives |
| US8287686B2 (en) | 2006-07-24 | 2012-10-16 | Designer Molecules, Inc. | Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof |
| US7825188B2 (en) | 2006-12-19 | 2010-11-02 | Designer Molecules, Inc. | Thermoplastic elastomer with acyloxyphenyl hard block segment |
| US8344076B2 (en) | 2006-12-19 | 2013-01-01 | Designer Molecules, Inc. | Hydrolytically resistant thermoset monomers |
| KR100885794B1 (ko) * | 2006-12-27 | 2009-02-26 | 제일모직주식회사 | 라디칼 경화형 반도체 조립용 접착 필름 조성물 |
| US20080262191A1 (en) * | 2007-01-26 | 2008-10-23 | Mizori Farhad G | Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds |
| US8431655B2 (en) | 2007-04-09 | 2013-04-30 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| WO2008124797A1 (en) * | 2007-04-09 | 2008-10-16 | Designer Molecules, Inc. | Curatives for epoxy compositions |
| US7868113B2 (en) | 2007-04-11 | 2011-01-11 | Designer Molecules, Inc. | Low shrinkage polyester thermosetting resins |
| US20100056671A1 (en) * | 2007-04-12 | 2010-03-04 | Designer Molecules, Inc. | Polyfunctional epoxy oligomers |
| US8063161B2 (en) | 2007-04-16 | 2011-11-22 | Designer Molecules, Inc. | Low temperature curing acrylate and maleimide based formulations and methods for use thereof |
| US7928153B2 (en) | 2007-08-14 | 2011-04-19 | Designer Molecules, Inc. | Thermosetting polyether oligomers, compositions and methods for use thereof |
| US20090050266A1 (en) * | 2007-08-21 | 2009-02-26 | Kang Yang | Crosslinked polymeric materials as filler and spacers in adhesives |
| CN101849179B (zh) * | 2007-09-13 | 2013-12-18 | 3M创新有限公司 | 低温粘结的电子粘合剂 |
| US8398898B2 (en) | 2008-02-23 | 2013-03-19 | Designer Molecules, Inc. | Soluble metal salts for use as conductivity promoters |
| WO2009117729A2 (en) | 2008-03-21 | 2009-09-24 | Designer Molecules, Inc. | Anti-bleed compounds, compositions and methods for use thereof |
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- 2003-03-28 KR KR1020047015488A patent/KR101020375B1/ko not_active Expired - Lifetime
- 2003-03-28 CN CNA038095343A patent/CN1649920A/zh active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20050012724A (ko) | 2005-02-02 |
| JP2005521764A (ja) | 2005-07-21 |
| US20050107542A1 (en) | 2005-05-19 |
| US20030199638A1 (en) | 2003-10-23 |
| CN1649920A (zh) | 2005-08-03 |
| WO2003082940A1 (en) | 2003-10-09 |
| AU2003233460A1 (en) | 2003-10-13 |
| US6831132B2 (en) | 2004-12-14 |
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