JP2005513637A - マイクロ回路カードを作成する方法 - Google Patents
マイクロ回路カードを作成する方法 Download PDFInfo
- Publication number
- JP2005513637A JP2005513637A JP2003553620A JP2003553620A JP2005513637A JP 2005513637 A JP2005513637 A JP 2005513637A JP 2003553620 A JP2003553620 A JP 2003553620A JP 2003553620 A JP2003553620 A JP 2003553620A JP 2005513637 A JP2005513637 A JP 2005513637A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- module
- card body
- microcircuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Abstract
Description
Claims (15)
- カード本体(11)と、一方の面にマイクロ回路(26)を搭載するプリント基板を形成するサポートフィルム(23)を備えるモジュール(22)と、を備えるマイクロ回路カードを作成する方法であって、前記空洞を少なくとも部分的に満たし前記マイクロ回路を取り囲む樹脂を用いて、前記モジュールが空洞(12)中に固定される方法において、前記空洞(12)の壁への前記樹脂(30)の接着力は、前記モジュールの前記サポートフィルム(23)への前記樹脂の接着力よりいも実質的に大きくなるように、増加させられることを特徴とする方法。
- 前記カード本体(11)は、低表面エネルギーのプラスチック部材から作られることと、前記空洞(12)の少なくとも一部分の表面状態が、処理された表面への前記樹脂の接着力を増加するよう改質されることとを特徴とする請求項1に記載の方法。
- 前記カード本体(11)は、前記空洞(12)の少なくとも底面がポリエチレンテレフタレート(PET)からなるように作られることを特徴とする請求項2に記載の方法。
- 前記カード本体(11)は、前記空洞(12)の少なくとも底面がポリカーボネイトからなるように作られることを特徴とする請求項2に記載の方法。
- 前記カード本体(11)は、前記空洞(12)の少なくとも底面がポリブチレンテレフタレート(PBT)からなるように作られることを特徴とする請求項2に記載の方法。
- 前記カード本体(11)はプラスチック物質の複数の層を積層することで作られることと、前記空洞の底面を形成する層は低表面エネルギーのプラスチック物質からなることとを特徴とする請求項2〜5のいずれか一項に記載の方法。
- 前記空洞(12a)が前記カード本体の深さを加工することで形成されることを特徴とする請求項1〜6のいずれか一項に記載の方法。
- 前記カード本体(11)はモールドによって作られ、前記空洞(12)は、前記のモールド中に形成されることを特徴とする請求項1〜6のいずれか一項に記載の方法。
- 前記空洞の表面状態は、処理された表面の機械的および/または化学的な改質を作り出すレーザ処理(18)によって改質されることを特徴とする請求項2〜8のいずれか一項に記載の方法。
- 前記レーザ処理は、YAGレーザビーム生成器(19)によってもたらされることを特徴とする請求項9に記載の方法。
- 前記レーザ処理は、エキシマレーザビーム生成器によってもたらされることを特徴とする請求項9に記載の方法。
- 前記表面の状態は、ガスプラズマ処理を使って改質されることを特徴とする請求項2〜8のいずれか一項に記載の方法。
- 前記表面の状態は、コロナ処理を使って改質されることを特徴とする請求項2〜8のいずれか一項に記載の方法。
- 前記表面の状態は、紫外線処理を使って改質されることを特徴とする請求項2〜8のいずれか一項に記載の方法。
- 前記表面の状態の改質工程の後、必要な量の樹脂(30)が前記空洞の底面に堆積され、前記モジュール(22)はそのマイクロ回路(26)が液体の樹脂によって取り囲まれるように前記空洞内に位置し、前記樹脂は重合されることを特徴とする請求項2〜14のいずれか一項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0116483A FR2833801B1 (fr) | 2001-12-19 | 2001-12-19 | Procede de realisation d'une carte a microcircuit |
PCT/FR2002/004426 WO2003052822A2 (fr) | 2001-12-19 | 2002-12-18 | Procede de realisation d'une carte a microcircuit indemontable |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005513637A true JP2005513637A (ja) | 2005-05-12 |
JP4327600B2 JP4327600B2 (ja) | 2009-09-09 |
Family
ID=8870702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003553620A Expired - Lifetime JP4327600B2 (ja) | 2001-12-19 | 2002-12-18 | マイクロ回路カードを作成する方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7584537B2 (ja) |
EP (1) | EP1464083A2 (ja) |
JP (1) | JP4327600B2 (ja) |
CN (1) | CN100351863C (ja) |
AU (1) | AU2002365005A1 (ja) |
CA (1) | CA2470229C (ja) |
FR (1) | FR2833801B1 (ja) |
MX (1) | MXPA04006036A (ja) |
WO (1) | WO2003052822A2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007079632A (ja) * | 2005-09-09 | 2007-03-29 | Lintec Corp | 非接触icカード及びその非接触icカード用の平板状カード基板 |
JP2008084040A (ja) * | 2006-09-28 | 2008-04-10 | Dainippon Printing Co Ltd | Icカードのicモジュール装着方法 |
KR101427283B1 (ko) | 2013-06-10 | 2014-08-07 | 옴니시스템 주식회사 | 플라스틱 카드의 제조방법 및 그 방법에 의해 제조된 금속 메탈층을 포함한 플라스틱 카드 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1676471B1 (en) * | 2003-10-15 | 2011-06-01 | Chimei InnoLux Corporation | Electronic device and method of manufacturing thereof |
FR2861201B1 (fr) * | 2003-10-17 | 2006-01-27 | Oberthur Card Syst Sa | Procede de fabrication d'une carte a double interface, et carte a microcircuit ainsi obtenue. |
FR2862410B1 (fr) * | 2003-11-18 | 2006-03-10 | Oberthur Card Syst Sa | Carte a microcircuit a fond marque d'un motif et procede pour sa realisation |
JP4867150B2 (ja) * | 2004-09-30 | 2012-02-01 | 凸版印刷株式会社 | クリーニング用icタグの製造方法 |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
US8987632B2 (en) * | 2009-10-09 | 2015-03-24 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Modification of surface energy via direct laser ablative surface patterning |
DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
DE102017213080A1 (de) * | 2017-07-28 | 2019-01-31 | Robert Bosch Gmbh | Verfahren zum Integrieren einer elektrischen Schaltung in eine Vorrichtung und Vorrichtung |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0696357B2 (ja) * | 1986-12-11 | 1994-11-30 | 三菱電機株式会社 | Icカードの製造方法 |
WO1989010269A1 (en) * | 1988-04-20 | 1989-11-02 | Matsushita Electric Industrial Co., Ltd. | Ic card and production method thereof |
DE4122049A1 (de) | 1991-07-03 | 1993-01-07 | Gao Ges Automation Org | Verfahren zum einbau eines traegerelements |
EP0688051B1 (fr) * | 1994-06-15 | 1999-09-15 | De La Rue Cartes Et Systemes | Procédé de fabrication et d'assemblage de carte à circuit intégré. |
WO1996009175A1 (fr) * | 1994-09-22 | 1996-03-28 | Rohm Co., Ltd. | Carte de ci du type sans contact et procede de fabrication de cette carte |
FR2736740A1 (fr) * | 1995-07-11 | 1997-01-17 | Trt Telecom Radio Electr | Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue |
JPH0948190A (ja) | 1995-08-04 | 1997-02-18 | Dainippon Printing Co Ltd | Icモジュールのカードに対する接着方法及びicカード |
US5817207A (en) * | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US6241153B1 (en) * | 1998-03-17 | 2001-06-05 | Cardxx, Inc. | Method for making tamper-preventing, contact-type, smart cards |
JP2000090226A (ja) | 1998-09-08 | 2000-03-31 | Dainippon Printing Co Ltd | Icモジュールの製造方法およびicカードの製造方法 |
FR2793330B1 (fr) | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue |
FR2793331B1 (fr) * | 1999-05-06 | 2001-08-10 | Oberthur Card Systems Sas | Procede de fabrication d'une carte a microcircuit |
JP4095741B2 (ja) * | 1999-06-29 | 2008-06-04 | シチズンミヨタ株式会社 | Icタグ構造 |
-
2001
- 2001-12-19 FR FR0116483A patent/FR2833801B1/fr not_active Expired - Lifetime
-
2002
- 2002-12-18 CN CNB028254457A patent/CN100351863C/zh not_active Expired - Lifetime
- 2002-12-18 EP EP02804942A patent/EP1464083A2/fr not_active Ceased
- 2002-12-18 US US10/499,359 patent/US7584537B2/en not_active Expired - Lifetime
- 2002-12-18 MX MXPA04006036A patent/MXPA04006036A/es active IP Right Grant
- 2002-12-18 CA CA2470229A patent/CA2470229C/fr not_active Expired - Lifetime
- 2002-12-18 JP JP2003553620A patent/JP4327600B2/ja not_active Expired - Lifetime
- 2002-12-18 AU AU2002365005A patent/AU2002365005A1/en not_active Abandoned
- 2002-12-18 WO PCT/FR2002/004426 patent/WO2003052822A2/fr active Application Filing
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007079632A (ja) * | 2005-09-09 | 2007-03-29 | Lintec Corp | 非接触icカード及びその非接触icカード用の平板状カード基板 |
JP2008084040A (ja) * | 2006-09-28 | 2008-04-10 | Dainippon Printing Co Ltd | Icカードのicモジュール装着方法 |
KR101427283B1 (ko) | 2013-06-10 | 2014-08-07 | 옴니시스템 주식회사 | 플라스틱 카드의 제조방법 및 그 방법에 의해 제조된 금속 메탈층을 포함한 플라스틱 카드 |
Also Published As
Publication number | Publication date |
---|---|
WO2003052822A2 (fr) | 2003-06-26 |
JP4327600B2 (ja) | 2009-09-09 |
CA2470229A1 (fr) | 2003-06-26 |
CA2470229C (fr) | 2012-02-14 |
FR2833801A1 (fr) | 2003-06-20 |
AU2002365005A1 (en) | 2003-06-30 |
WO2003052822A3 (fr) | 2004-01-22 |
FR2833801B1 (fr) | 2005-07-01 |
MXPA04006036A (es) | 2005-03-31 |
US7584537B2 (en) | 2009-09-08 |
EP1464083A2 (fr) | 2004-10-06 |
CN100351863C (zh) | 2007-11-28 |
US20050223550A1 (en) | 2005-10-13 |
AU2002365005A8 (en) | 2003-06-30 |
CN1606805A (zh) | 2005-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4327600B2 (ja) | マイクロ回路カードを作成する方法 | |
US6625880B2 (en) | Method for producing printed wiring board | |
US20190263054A1 (en) | Hybrid, multi-material 3D printing | |
US20070171078A1 (en) | Electronic device and method of forming an electronic device | |
JP4028863B2 (ja) | 基板製造方法 | |
KR101144202B1 (ko) | 엘이디 내장형 인쇄회로기판 | |
JP2012044163A (ja) | 電気的構成要素を埋め込む方法 | |
WO2004054336A1 (ja) | プリント配線基板の製造方法 | |
EP1257157B1 (en) | Method for manufacturing printed circuit boards | |
JP2008147520A (ja) | 巻線型電子部品の製造方法 | |
WO2017150435A1 (ja) | 配線基板の製造方法および配線基板 | |
CN105378912B (zh) | 半导体封装件的制造方法以及半导体封装件 | |
WO2015152364A1 (ja) | 電子部品の製造方法 | |
EP0949855A2 (en) | Multilayer circuit board | |
JPH09148698A (ja) | 両面プリント配線板およびその製造方法 | |
JP2006287077A (ja) | 回路基板の製造方法 | |
JP4575723B2 (ja) | 立体回路板の製造方法及び立体回路板 | |
JPH07307564A (ja) | 配線板の製造法 | |
JP2000200975A (ja) | 多層配線基板の製造方法 | |
KR102435126B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
KR100619349B1 (ko) | 인쇄회로기판의 회로패턴 형성방법 | |
US6198044B1 (en) | Process for manufacture of a microcircuit board permitting limitation of the mechanical stresses transmitted to the microcircuit and board thus obtained | |
JPH0499088A (ja) | 多層プリント配線板の製造方法 | |
JP2004342859A (ja) | 多層回路基板の製造方法 | |
EP1387602A1 (en) | A method of forming an electrically conductive coating on support sheets for printed circuit cards |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050719 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080811 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080826 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20081125 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20081202 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090512 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090611 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120619 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4327600 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130619 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |