JP2005502202A5 - - Google Patents
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- Publication number
- JP2005502202A5 JP2005502202A5 JP2003525884A JP2003525884A JP2005502202A5 JP 2005502202 A5 JP2005502202 A5 JP 2005502202A5 JP 2003525884 A JP2003525884 A JP 2003525884A JP 2003525884 A JP2003525884 A JP 2003525884A JP 2005502202 A5 JP2005502202 A5 JP 2005502202A5
- Authority
- JP
- Japan
- Prior art keywords
- compound
- spin
- substrate
- groove
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 150000001875 compounds Chemical class 0.000 claims 20
- 238000000034 method Methods 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 5
- 238000005229 chemical vapour deposition Methods 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims 2
- 238000002955 isolation Methods 0.000 claims 2
- 239000011877 solvent mixture Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 229940116333 ethyl lactate Drugs 0.000 claims 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 claims 1
- 229940090181 propyl acetate Drugs 0.000 claims 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/943,237 US20030054616A1 (en) | 2001-08-29 | 2001-08-29 | Electronic devices and methods of manufacture |
| PCT/US2002/026780 WO2003021636A2 (en) | 2001-08-29 | 2002-08-23 | Electronic devices and methods of manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005502202A JP2005502202A (ja) | 2005-01-20 |
| JP2005502202A5 true JP2005502202A5 (enExample) | 2005-12-22 |
Family
ID=25479290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003525884A Withdrawn JP2005502202A (ja) | 2001-08-29 | 2002-08-23 | 電子デバイスおよび製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20030054616A1 (enExample) |
| EP (1) | EP1421615A2 (enExample) |
| JP (1) | JP2005502202A (enExample) |
| KR (1) | KR20040033000A (enExample) |
| CN (1) | CN1579016A (enExample) |
| AU (1) | AU2002326737A1 (enExample) |
| TW (1) | TW569340B (enExample) |
| WO (1) | WO2003021636A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI320214B (en) * | 2002-08-22 | 2010-02-01 | Method of forming a trench isolation structure | |
| US7348281B2 (en) * | 2003-09-19 | 2008-03-25 | Brewer Science Inc. | Method of filling structures for forming via-first dual damascene interconnects |
| JP2005150500A (ja) * | 2003-11-18 | 2005-06-09 | Toshiba Corp | 半導体装置および半導体装置の製造方法 |
| JP2005166700A (ja) | 2003-11-28 | 2005-06-23 | Toshiba Corp | 半導体装置及びその製造方法 |
| KR100562302B1 (ko) * | 2003-12-27 | 2006-03-22 | 동부아남반도체 주식회사 | 멀티 화학액 처리 단계를 이용한 랜덤 폴리머 제거 방법 |
| US7924778B2 (en) * | 2005-08-12 | 2011-04-12 | Nextel Communications Inc. | System and method of increasing the data throughput of the PDCH channel in a wireless communication system |
| WO2012137675A1 (ja) * | 2011-04-06 | 2012-10-11 | コニカミノルタホールディングス株式会社 | 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子 |
| KR102021484B1 (ko) * | 2014-10-31 | 2019-09-16 | 삼성에스디아이 주식회사 | 막 구조물 제조 방법, 막 구조물, 및 패턴형성방법 |
| KR101926023B1 (ko) * | 2015-10-23 | 2018-12-06 | 삼성에스디아이 주식회사 | 막 구조물 제조 방법 및 패턴형성방법 |
| KR101907499B1 (ko) * | 2015-11-20 | 2018-10-12 | 삼성에스디아이 주식회사 | 막 구조물 제조 방법 및 패턴형성방법 |
| KR102015406B1 (ko) * | 2016-01-25 | 2019-08-28 | 삼성에스디아이 주식회사 | 막 구조물 제조 방법 및 패턴형성방법 |
| TWI713679B (zh) * | 2017-01-23 | 2020-12-21 | 聯華電子股份有限公司 | 互補式金氧半導體元件及其製作方法 |
| KR102112737B1 (ko) * | 2017-04-28 | 2020-05-19 | 삼성에스디아이 주식회사 | 막 구조물 제조 방법 및 패턴형성방법 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4510176A (en) * | 1983-09-26 | 1985-04-09 | At&T Bell Laboratories | Removal of coating from periphery of a semiconductor wafer |
| US4732785A (en) * | 1986-09-26 | 1988-03-22 | Motorola, Inc. | Edge bead removal process for spin on films |
| US5296330A (en) * | 1991-08-30 | 1994-03-22 | Ciba-Geigy Corp. | Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive |
| JP2951504B2 (ja) * | 1992-06-05 | 1999-09-20 | シャープ株式会社 | シリル化平坦化レジスト及び平坦化方法並びに集積回路デバイスの製造方法 |
| JP3740207B2 (ja) * | 1996-02-13 | 2006-02-01 | 大日本スクリーン製造株式会社 | 基板表面に形成されたシリカ系被膜の膜溶解方法 |
| US5866481A (en) * | 1996-06-07 | 1999-02-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Selective partial curing of spin-on-glass by ultraviolet radiation to protect integrated circuit dice near the wafer edge |
| TW438860B (en) * | 1996-11-20 | 2001-06-07 | Japan Synthetic Rubber Co Ltd | Curable resin composition and cured products |
| US6485576B1 (en) * | 1996-11-22 | 2002-11-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for removing coating bead at wafer flat edge |
| US5913979A (en) * | 1997-01-08 | 1999-06-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for removing spin-on-glass at wafer edge |
| US6194283B1 (en) * | 1997-10-29 | 2001-02-27 | Advanced Micro Devices, Inc. | High density trench fill due to new spacer fill method including isotropically etching silicon nitride spacers |
| US6008109A (en) * | 1997-12-19 | 1999-12-28 | Advanced Micro Devices, Inc. | Trench isolation structure having a low K dielectric encapsulated by oxide |
| US6140254A (en) * | 1998-09-18 | 2000-10-31 | Alliedsignal Inc. | Edge bead removal for nanoporous dielectric silica coatings |
| JP2001181577A (ja) * | 1999-12-27 | 2001-07-03 | Sumitomo Chem Co Ltd | 多孔質有機膜形成用塗布液および多孔質有機膜の形成方法 |
| US6565920B1 (en) * | 2000-06-08 | 2003-05-20 | Honeywell International Inc. | Edge bead removal for spin-on materials containing low volatility solvents fusing carbon dioxide cleaning |
| US6444495B1 (en) * | 2001-01-11 | 2002-09-03 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
-
2001
- 2001-08-29 US US09/943,237 patent/US20030054616A1/en not_active Abandoned
-
2002
- 2002-08-23 KR KR10-2004-7003141A patent/KR20040033000A/ko not_active Withdrawn
- 2002-08-23 EP EP02761473A patent/EP1421615A2/en not_active Withdrawn
- 2002-08-23 AU AU2002326737A patent/AU2002326737A1/en not_active Abandoned
- 2002-08-23 JP JP2003525884A patent/JP2005502202A/ja not_active Withdrawn
- 2002-08-23 CN CNA028214544A patent/CN1579016A/zh active Pending
- 2002-08-23 WO PCT/US2002/026780 patent/WO2003021636A2/en not_active Ceased
- 2002-08-29 TW TW091119682A patent/TW569340B/zh active
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