JP2005347529A5 - - Google Patents

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Publication number
JP2005347529A5
JP2005347529A5 JP2004165621A JP2004165621A JP2005347529A5 JP 2005347529 A5 JP2005347529 A5 JP 2005347529A5 JP 2004165621 A JP2004165621 A JP 2004165621A JP 2004165621 A JP2004165621 A JP 2004165621A JP 2005347529 A5 JP2005347529 A5 JP 2005347529A5
Authority
JP
Japan
Prior art keywords
soldering
lead
electronic component
type electronic
jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004165621A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005347529A (ja
JP4222260B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004165621A priority Critical patent/JP4222260B2/ja
Priority claimed from JP2004165621A external-priority patent/JP4222260B2/ja
Priority to ES05252366T priority patent/ES2401585T3/es
Priority to EP05252366A priority patent/EP1603375B1/en
Priority to CNB2005100728005A priority patent/CN100475002C/zh
Publication of JP2005347529A publication Critical patent/JP2005347529A/ja
Publication of JP2005347529A5 publication Critical patent/JP2005347529A5/ja
Application granted granted Critical
Publication of JP4222260B2 publication Critical patent/JP4222260B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004165621A 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機 Expired - Fee Related JP4222260B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004165621A JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機
ES05252366T ES2401585T3 (es) 2004-06-03 2005-04-15 Placa de circuito impreso, método de soldadura de componentes electrónicos y aparato de aire acondicionado con placa de circuito impreso
EP05252366A EP1603375B1 (en) 2004-06-03 2005-04-15 Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board
CNB2005100728005A CN100475002C (zh) 2004-06-03 2005-05-20 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004165621A JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機

Publications (3)

Publication Number Publication Date
JP2005347529A JP2005347529A (ja) 2005-12-15
JP2005347529A5 true JP2005347529A5 (OSRAM) 2006-10-12
JP4222260B2 JP4222260B2 (ja) 2009-02-12

Family

ID=34940856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004165621A Expired - Fee Related JP4222260B2 (ja) 2004-06-03 2004-06-03 リード形電子部品実装プリント配線基板及び空気調和機

Country Status (4)

Country Link
EP (1) EP1603375B1 (OSRAM)
JP (1) JP4222260B2 (OSRAM)
CN (1) CN100475002C (OSRAM)
ES (1) ES2401585T3 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4196979B2 (ja) * 2005-09-07 2008-12-17 三菱電機株式会社 リード形電子部品実装プリント配線基板、リード形電子部品の半田付方法、空気調和機。
JP5599151B2 (ja) 2009-01-30 2014-10-01 三菱電機株式会社 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3211408A1 (de) * 1982-03-27 1983-09-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Substrat
JPS62243393A (ja) 1986-04-15 1987-10-23 キヤノン株式会社 プリント基板
JPS63157492A (ja) 1986-12-22 1988-06-30 株式会社東芝 プリント配線板
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
JPH01300588A (ja) 1988-05-28 1989-12-05 Nec Home Electron Ltd プリント配線板及びそのはんだ付け方法
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
JP2675473B2 (ja) * 1992-01-13 1997-11-12 三洋電機株式会社 フラットパッケージｉｃ半田ディップ型プリント配線板
FR2714566B1 (fr) * 1993-12-24 1996-03-15 Marelli Autronica Plaque de circuit imprimé comportant des plages de drainage de soudure perfectionnées.
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
JPH08307022A (ja) * 1995-05-10 1996-11-22 Fuji Electric Co Ltd プリント板
KR100319291B1 (ko) * 1999-03-13 2002-01-09 윤종용 회로 기판 및 회로 기판의 솔더링 방법
JP2002280717A (ja) * 2001-03-19 2002-09-27 Matsushita Graphic Communication Systems Inc プリント基板
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法
JP3988720B2 (ja) * 2003-12-11 2007-10-10 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板及び４方向リードフラットパッケージｉｃの半田付け方法、４方向リードフラットパッケージｉｃ実装プリント配線基板を備えた空気調和機。

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