JP2005340816A5 - - Google Patents

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Publication number
JP2005340816A5
JP2005340816A5 JP2005147746A JP2005147746A JP2005340816A5 JP 2005340816 A5 JP2005340816 A5 JP 2005340816A5 JP 2005147746 A JP2005147746 A JP 2005147746A JP 2005147746 A JP2005147746 A JP 2005147746A JP 2005340816 A5 JP2005340816 A5 JP 2005340816A5
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JP
Japan
Prior art keywords
polycrystalline
region
layer
precursor
sige
Prior art date
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Granted
Application number
JP2005147746A
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English (en)
Japanese (ja)
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JP2005340816A (ja
JP4948785B2 (ja
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Priority claimed from US10/851,821 external-priority patent/US7135391B2/en
Application filed filed Critical
Publication of JP2005340816A publication Critical patent/JP2005340816A/ja
Publication of JP2005340816A5 publication Critical patent/JP2005340816A5/ja
Application granted granted Critical
Publication of JP4948785B2 publication Critical patent/JP4948785B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005147746A 2004-05-21 2005-05-20 シリコン単結晶基板中に、ｍｏｓｆｅｔデバイスのための接合を形成するための方法 Expired - Fee Related JP4948785B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/851,821 US7135391B2 (en) 2004-05-21 2004-05-21 Polycrystalline SiGe junctions for advanced devices
US10/851,821 2004-05-21

Publications (3)

Publication Number Publication Date
JP2005340816A JP2005340816A (ja) 2005-12-08
JP2005340816A5 true JP2005340816A5 (enExample) 2008-05-15
JP4948785B2 JP4948785B2 (ja) 2012-06-06

Family

ID=35375736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005147746A Expired - Fee Related JP4948785B2 (ja) 2004-05-21 2005-05-20 シリコン単結晶基板中に、ｍｏｓｆｅｔデバイスのための接合を形成するための方法

Country Status (4)

Country Link
US (3) US7135391B2 (enExample)
JP (1) JP4948785B2 (enExample)
CN (1) CN100369199C (enExample)
TW (1) TWI346974B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2781485B1 (fr) 1998-07-21 2003-08-08 Denis Barritault Polymeres biocompatibles leur procede de preparation et les compositions les contenant
US8323157B2 (en) * 2004-02-24 2012-12-04 Total Gym Global Corp. Method of using an exercise device having an adjustable incline
US7135391B2 (en) * 2004-05-21 2006-11-14 International Business Machines Corporation Polycrystalline SiGe junctions for advanced devices
NO324539B1 (no) * 2005-06-14 2007-11-19 Thin Film Electronics Asa Fremgangsmate i fabrikasjonen av en ferroelektrisk minneinnretning
US8278176B2 (en) 2006-06-07 2012-10-02 Asm America, Inc. Selective epitaxial formation of semiconductor films
US20080124874A1 (en) * 2006-11-03 2008-05-29 Samsung Electronics Co., Ltd. Methods of Forming Field Effect Transistors Having Silicon-Germanium Source and Drain Regions
JP2009043916A (ja) 2007-08-08 2009-02-26 Toshiba Corp 半導体装置及びその製造方法
DE102007052626B4 (de) 2007-11-05 2018-05-30 Robert Bosch Gmbh Verfahren zur Herstellung von porösen Strukturen in auf Silizium basierenden Halbleiterstrukturen
US9095506B2 (en) * 2008-11-17 2015-08-04 Allergan, Inc. Biodegradable alpha-2 agonist polymeric implants and therapeutic uses thereof
US8809170B2 (en) 2011-05-19 2014-08-19 Asm America Inc. High throughput cyclical epitaxial deposition and etch process
JP2013089889A (ja) * 2011-10-21 2013-05-13 Elpida Memory Inc 半導体装置及びその製造方法
US8741726B2 (en) * 2011-12-01 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Reacted layer for improving thickness uniformity of strained structures
US11575043B1 (en) * 2021-07-23 2023-02-07 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method of the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3902936A (en) * 1973-04-04 1975-09-02 Motorola Inc Germanium bonded silicon substrate and method of manufacture
JPS57128022A (en) * 1981-01-30 1982-08-09 Tadatsugu Ito Forming method for silicon epitaxially grown film
JPH01248668A (ja) * 1988-03-30 1989-10-04 Seiko Epson Corp 薄膜トランジスタ
US5101247A (en) * 1990-04-27 1992-03-31 North Carolina State University Germanium silicon dioxide gate MOSFET
US5250452A (en) * 1990-04-27 1993-10-05 North Carolina State University Deposition of germanium thin films on silicon dioxide employing interposed polysilicon layer
JPH04127522A (ja) * 1990-09-19 1992-04-28 Nec Corp 半導体多結晶の選択的成長方法
JP2965094B2 (ja) * 1991-06-28 1999-10-18 キヤノン株式会社 堆積膜形成方法
US5571744A (en) 1993-08-27 1996-11-05 National Semiconductor Corporation Defect free CMOS process
JP2919281B2 (ja) * 1994-11-11 1999-07-12 日本電気株式会社 半導体装置の製造方法
US5646073A (en) 1995-01-18 1997-07-08 Lsi Logic Corporation Process for selective deposition of polysilicon over single crystal silicon substrate and resulting product
FR2765394B1 (fr) * 1997-06-25 1999-09-24 France Telecom Procede d'obtention d'un transistor a grille en silicium-germanium
FR2773177B1 (fr) * 1997-12-29 2000-03-17 France Telecom Procede d'obtention d'une couche de germanium ou silicium monocristallin sur un substrat de silicium ou germanium monocristallin, respectivement, et produits multicouches obtenus
EP1192646B1 (en) * 1999-06-25 2008-08-13 Massachusetts Institute Of Technology Cyclic thermal anneal for dislocation reduction
DE10246718A1 (de) * 2002-10-07 2004-04-22 Infineon Technologies Ag Feldeffekttransistor mit lokaler Source-/Drainisolation sowie zugehöriges Herstellungsverfahren
US7166528B2 (en) * 2003-10-10 2007-01-23 Applied Materials, Inc. Methods of selective deposition of heavily doped epitaxial SiGe
US6872626B1 (en) * 2003-11-21 2005-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a source/drain and a transistor employing the same
US7135391B2 (en) * 2004-05-21 2006-11-14 International Business Machines Corporation Polycrystalline SiGe junctions for advanced devices

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