JP2009533844A5 - - Google Patents

Download PDF

Info

Publication number
JP2009533844A5
JP2009533844A5 JP2009504308A JP2009504308A JP2009533844A5 JP 2009533844 A5 JP2009533844 A5 JP 2009533844A5 JP 2009504308 A JP2009504308 A JP 2009504308A JP 2009504308 A JP2009504308 A JP 2009504308A JP 2009533844 A5 JP2009533844 A5 JP 2009533844A5
Authority
JP
Japan
Prior art keywords
processing chamber
substrate
forming
chamber
epitaxial layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009504308A
Other languages
English (en)
Japanese (ja)
Other versions
JP5317956B2 (ja
JP2009533844A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/008549 external-priority patent/WO2007117583A2/en
Publication of JP2009533844A publication Critical patent/JP2009533844A/ja
Publication of JP2009533844A5 publication Critical patent/JP2009533844A5/ja
Application granted granted Critical
Publication of JP5317956B2 publication Critical patent/JP5317956B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009504308A 2006-04-07 2007-04-06 エピタキシャル膜を形成する方法、及び、エピタキシャル膜の形成に使用するためのクラスターツール Active JP5317956B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US79006606P 2006-04-07 2006-04-07
US60/790,066 2006-04-07
PCT/US2007/008549 WO2007117583A2 (en) 2006-04-07 2007-04-06 Cluster tool for epitaxial film formation

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012243584A Division JP5661083B2 (ja) 2006-04-07 2012-11-05 エピタキシャル膜を形成する方法、及び、エピタキシャル膜の形成に使用するためのクラスターツール

Publications (3)

Publication Number Publication Date
JP2009533844A JP2009533844A (ja) 2009-09-17
JP2009533844A5 true JP2009533844A5 (enExample) 2010-05-06
JP5317956B2 JP5317956B2 (ja) 2013-10-16

Family

ID=38581637

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009504308A Active JP5317956B2 (ja) 2006-04-07 2007-04-06 エピタキシャル膜を形成する方法、及び、エピタキシャル膜の形成に使用するためのクラスターツール
JP2012243584A Active JP5661083B2 (ja) 2006-04-07 2012-11-05 エピタキシャル膜を形成する方法、及び、エピタキシャル膜の形成に使用するためのクラスターツール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012243584A Active JP5661083B2 (ja) 2006-04-07 2012-11-05 エピタキシャル膜を形成する方法、及び、エピタキシャル膜の形成に使用するためのクラスターツール

Country Status (6)

Country Link
US (2) US20070286956A1 (enExample)
JP (2) JP5317956B2 (enExample)
KR (1) KR101074186B1 (enExample)
CN (1) CN101415865B (enExample)
TW (1) TWI446409B (enExample)
WO (1) WO2007117583A2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7682940B2 (en) 2004-12-01 2010-03-23 Applied Materials, Inc. Use of Cl2 and/or HCl during silicon epitaxial film formation
KR101038843B1 (ko) * 2005-10-05 2011-06-03 어플라이드 머티어리얼스, 인코포레이티드 에피택셜막 형성 방법 및 장치
US7598178B2 (en) * 2006-03-24 2009-10-06 Applied Materials, Inc. Carbon precursors for use during silicon epitaxial film formation
US7674337B2 (en) 2006-04-07 2010-03-09 Applied Materials, Inc. Gas manifolds for use during epitaxial film formation
US8029620B2 (en) 2006-07-31 2011-10-04 Applied Materials, Inc. Methods of forming carbon-containing silicon epitaxial layers
KR101369355B1 (ko) 2006-07-31 2014-03-04 어플라이드 머티어리얼스, 인코포레이티드 에피택셜 층 형성 동안에 형태를 제어하는 방법
CN101636522B (zh) * 2007-03-02 2011-11-30 欧瑞康太阳能股份公司(特吕巴赫) 真空涂覆装置
US7964858B2 (en) 2008-10-21 2011-06-21 Applied Materials, Inc. Ultraviolet reflector with coolant gas holes and method
US20100096569A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Ultraviolet-transmitting microwave reflector comprising a micromesh screen
CN101760775A (zh) * 2009-04-17 2010-06-30 南安市三晶阳光电力有限公司 一种连续液相外延法制备薄膜的方法和装置
FR2973159B1 (fr) * 2011-03-22 2013-04-19 Soitec Silicon On Insulator Procede de fabrication d'un substrat de base
KR101271248B1 (ko) * 2011-08-02 2013-06-07 주식회사 유진테크 에피택셜 공정을 위한 반도체 제조설비
KR101252742B1 (ko) * 2011-08-02 2013-04-09 주식회사 유진테크 에피택셜 공정을 위한 반도체 제조설비
KR101271246B1 (ko) * 2011-08-02 2013-06-07 주식회사 유진테크 에피택셜 공정을 위한 반도체 제조설비
KR101271247B1 (ko) * 2011-08-02 2013-06-07 주식회사 유진테크 에피택셜 공정을 위한 반도체 제조설비
US10006146B2 (en) 2012-03-28 2018-06-26 Kookje Electric Korea Co., Ltd. Cluster apparatus for treating substrate
US9683308B2 (en) 2013-08-09 2017-06-20 Applied Materials, Inc. Method and apparatus for precleaning a substrate surface prior to epitaxial growth
KR102705337B1 (ko) 2015-12-04 2024-09-11 어플라이드 머티어리얼스, 인코포레이티드 InGaAs(또는 Ⅲ-Ⅴ) 기판들을 세정하기 위한 방법들 및 해법들
KR101960763B1 (ko) * 2016-11-03 2019-03-21 주식회사 유진테크 저온 에피택셜층 형성방법
WO2018148189A1 (en) 2017-02-10 2018-08-16 Applied Materials, Inc. Method and apparatus for low temperature selective epitaxy in a deep trench
JP2020532114A (ja) * 2017-08-30 2020-11-05 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 一体型エピタキシシステム高温汚染物質除去
CN112106186A (zh) * 2018-07-05 2020-12-18 应用材料公司 硅化物膜成核
US10861722B2 (en) * 2018-11-13 2020-12-08 Applied Materials, Inc. Integrated semiconductor processing
US11605544B2 (en) 2020-09-18 2023-03-14 Applied Materials, Inc. Methods and systems for cleaning high aspect ratio structures

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02225399A (ja) * 1988-11-11 1990-09-07 Fujitsu Ltd エピタキシャル成長方法および成長装置
US5236545A (en) * 1992-10-05 1993-08-17 The Board Of Governors Of Wayne State University Method for heteroepitaxial diamond film development
JP3255469B2 (ja) * 1992-11-30 2002-02-12 三菱電機株式会社 レーザ薄膜形成装置
US5495822A (en) * 1993-08-10 1996-03-05 Nippon Telegraph And Telephone Corporation Method of selectively growing Si epitaxial film
KR960026261A (ko) * 1994-12-14 1996-07-22 제임스 조셉 드롱 재 도입형 콘택 홀을 피복시키거나 또는 충진시키기 위한 방법 및 장치
US5637518A (en) * 1995-10-16 1997-06-10 Micron Technology, Inc. Method of making a field effect transistor having an elevated source and an elevated drain
US6055927A (en) * 1997-01-14 2000-05-02 Applied Komatsu Technology, Inc. Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology
US5849092A (en) * 1997-02-25 1998-12-15 Applied Materials, Inc. Process for chlorine trifluoride chamber cleaning
US5968279A (en) * 1997-06-13 1999-10-19 Mattson Technology, Inc. Method of cleaning wafer substrates
JP3298467B2 (ja) * 1997-07-18 2002-07-02 信越半導体株式会社 エピタキシャルウェーハの製造方法
IT1308606B1 (it) * 1999-02-12 2002-01-08 Lpe Spa Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore
WO2000063956A1 (en) * 1999-04-20 2000-10-26 Sony Corporation Method and apparatus for thin-film deposition, and method of manufacturing thin-film semiconductor device
JP2001156077A (ja) * 1999-11-26 2001-06-08 Nec Corp 半導体装置の製造方法
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
US20010013313A1 (en) * 2000-02-10 2001-08-16 Motorola, Inc. Apparatus for fabricating semiconductor structures and method of forming the structures
KR100373853B1 (ko) * 2000-08-11 2003-02-26 삼성전자주식회사 반도체소자의 선택적 에피택시얼 성장 방법
JP2002100762A (ja) * 2000-09-22 2002-04-05 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6569257B1 (en) * 2000-11-09 2003-05-27 Applied Materials Inc. Method for cleaning a process chamber
US6930041B2 (en) * 2000-12-07 2005-08-16 Micron Technology, Inc. Photo-assisted method for semiconductor fabrication
FR2823010B1 (fr) * 2001-04-02 2003-08-15 St Microelectronics Sa Procede de fabrication d'un transistor vertical a grille isolee a quadruple canal de conduction, et circuit integre comportant un tel transistor
US6576535B2 (en) * 2001-04-11 2003-06-10 Texas Instruments Incorporated Carbon doped epitaxial layer for high speed CB-CMOS
KR20020083767A (ko) * 2001-04-30 2002-11-04 주식회사 하이닉스반도체 선택적 에피택셜 성장 공정에서의 기판 세정 방법
US20030066486A1 (en) * 2001-08-30 2003-04-10 Applied Materials, Inc. Microwave heat shield for plasma chamber
JP3660897B2 (ja) * 2001-09-03 2005-06-15 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2003096511A (ja) * 2001-09-20 2003-04-03 Nkk Corp 高炉操業方法
US7049226B2 (en) * 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
KR20030035152A (ko) * 2001-10-30 2003-05-09 주식회사 하이닉스반도체 반도체웨이퍼 제조방법
US6590344B2 (en) * 2001-11-20 2003-07-08 Taiwan Semiconductor Manufacturing Co., Ltd. Selectively controllable gas feed zones for a plasma reactor
US6642151B2 (en) * 2002-03-06 2003-11-04 Applied Materials, Inc Techniques for plasma etching silicon-germanium
US6716719B2 (en) * 2002-05-29 2004-04-06 Micron Technology, Inc. Method of forming biasable isolation regions using epitaxially grown silicon between the isolation regions
US20040050326A1 (en) * 2002-09-12 2004-03-18 Thilderkvist Karin Anna Lena Apparatus and method for automatically controlling gas flow in a substrate processing system
JP4308502B2 (ja) * 2002-11-15 2009-08-05 浜松ホトニクス株式会社 窒化物薄膜の形成方法及び量子井戸デバイスの製造方法
JP3872027B2 (ja) * 2003-03-07 2007-01-24 株式会社東芝 クリーニング方法及び半導体製造装置
JP2004356298A (ja) * 2003-05-28 2004-12-16 Toshiba Mach Co Ltd 気相成長装置
US7166528B2 (en) * 2003-10-10 2007-01-23 Applied Materials, Inc. Methods of selective deposition of heavily doped epitaxial SiGe
US7132338B2 (en) * 2003-10-10 2006-11-07 Applied Materials, Inc. Methods to fabricate MOSFET devices using selective deposition process
US7037793B2 (en) * 2004-02-09 2006-05-02 United Microelectronics Corp. Method of forming a transistor using selective epitaxial growth
JP2005243924A (ja) * 2004-02-26 2005-09-08 Hitachi Kokusai Electric Inc 基板処理装置
US7071117B2 (en) * 2004-02-27 2006-07-04 Micron Technology, Inc. Semiconductor devices and methods for depositing a dielectric film
US7396743B2 (en) * 2004-06-10 2008-07-08 Singh Kaushal K Low temperature epitaxial growth of silicon-containing films using UV radiation
JP4369824B2 (ja) * 2004-08-11 2009-11-25 エア・ウォーター株式会社 成膜方法および装置
US7312128B2 (en) * 2004-12-01 2007-12-25 Applied Materials, Inc. Selective epitaxy process with alternating gas supply
US7682940B2 (en) * 2004-12-01 2010-03-23 Applied Materials, Inc. Use of Cl2 and/or HCl during silicon epitaxial film formation
US7235492B2 (en) * 2005-01-31 2007-06-26 Applied Materials, Inc. Low temperature etchant for treatment of silicon-containing surfaces
US7816236B2 (en) * 2005-02-04 2010-10-19 Asm America Inc. Selective deposition of silicon-containing films
US7678712B2 (en) * 2005-03-22 2010-03-16 Honeywell International, Inc. Vapor phase treatment of dielectric materials
KR101038843B1 (ko) * 2005-10-05 2011-06-03 어플라이드 머티어리얼스, 인코포레이티드 에피택셜막 형성 방법 및 장치
US20070181420A1 (en) * 2006-02-07 2007-08-09 Ming-Tung Wang Wafer stage having an encapsulated central pedestal plate
US7674337B2 (en) * 2006-04-07 2010-03-09 Applied Materials, Inc. Gas manifolds for use during epitaxial film formation
KR101369355B1 (ko) * 2006-07-31 2014-03-04 어플라이드 머티어리얼스, 인코포레이티드 에피택셜 층 형성 동안에 형태를 제어하는 방법

Similar Documents

Publication Publication Date Title
JP2009533844A5 (enExample)
TW200741823A (en) Semiconductor device manufacturing method and substrate processing apparatus
WO2007117583A3 (en) Cluster tool for epitaxial film formation
JP2010527514A5 (enExample)
TW200729343A (en) Method for fabricating controlled stress silicon nitride films
TW200705551A (en) Method for forming a high density dielectric film by chemical vapor deposition
TW200710968A (en) Method for depositing tungsten film, film deposition system, storage medium, and semiconductor device
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
WO2005036593A3 (en) Deposition of silicon-containing films from hexachlorodisilane
WO2008042981A3 (en) Ald of metal silicate films
WO2011126612A3 (en) Nitrogen doped amorphous carbon hardmask
WO2011017339A3 (en) Methods of selectively depositing an epitaxial layer
TW200943389A (en) Selective formation of silicon carbon epitaxial layer
TW200604093A (en) Silicon nitride film with stress control
WO2005084231A3 (en) Germanium deposition
TW200603275A (en) Semiconductor device and fabrication method thereof
WO2006107532A3 (en) Single wafer thermal cvd processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon
WO2007149761A3 (en) Methods to improve the in-film defectivity of pecvd amorphous carbon films
WO2008127220A3 (en) Methods for in-situ generation of reactive etch and growth specie in film formation processes
TW200634976A (en) Method for forming a multiple layer passivation film and a device incorporating the same
JP2006524439A5 (enExample)
JP2009111350A5 (enExample)
TW200729303A (en) Method for manufacturing semiconductor device
WO2010102089A3 (en) Methods for depositing layers having reduced interfacial contamination
JP2012114423A5 (enExample)