JP2005268282A - 半導体チップの実装体及びこれを用いた表示装置 - Google Patents
半導体チップの実装体及びこれを用いた表示装置 Download PDFInfo
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Abstract
【解決手段】 ガラス基板に半導体チップ3が実装され、半導体チップ3の複数の電源線(第一の配線25及び第二の配線26)が半導体チップ3内の長尺方向に伸びて形成されている半導体チップ3の構造において、電位の異なる上記電源線が重ねて形成されていることを特徴とする半導体チップ3の構造を有する。配線の重ね合わせ領域で容量を形成し、単独で配線を形成するよりも狭幅化された配線とすることができる。
【選択図】 図2
Description
2 透明な第二の基板
3 走査線駆動用の半導体チップ
4 信号線駆動用の半導体チップ
5、5A、5B、5C フレキシブル配線基板
6 プリント基板
11 表示部
12 走査線
13 信号線
14 制御・電源線
15 ダミー配線
16 第一の基板上の第一の配線
17 第一の基板上の第二の配線
21 出力端子
22 接続端子
23 半導体回路層
24 絶縁膜
25 第一の配線
26 第二の配線
27 配線
28 半導体回路層の配線
32 フレキシブル配線
34 プリント基板配線
Claims (13)
- 主基板に長方形状の半導体チップが実装され、前記半導体チップ用の複数の電源線が当該半導体チップ内の長尺方向に伸びて形成された、半導体チップの実装体において、
前記複数の電源線のうちの電位の異なるもの同士の少なくとも一部が絶縁膜を介して重ねて形成された、
ことを特徴とする半導体チップの実装体。 - 信号用又は電源用の配線がフレキシブル配線基板上に形成され、中継用の配線が主基板上に形成され、この主基板上に前記フレキシブル配線基板とともに長方形状の半導体チップが実装され、前記信号用又は電源用の配線に前記中継用の配線を介して前記半導体チップが電気的に接続され、前記半導体チップ用の複数の電源線が当該半導体チップ内の長尺方向に伸びて形成された、半導体チップの実装体において、
前記複数の電源線のうちの電位の異なるもの同士の少なくとも一部が絶縁膜を介して重ねて形成された、
ことを特徴とする半導体チップの実装体。 - 主基板と配線が形成された副基板とがフレキシブル配線基板を介して接続され、前記副基板に長方形状の半導体チップが実装され、前記半導体チップ用の複数の電源線が当該半導体チップ内の長尺方向に伸びて形成された、半導体チップの実装体において、
前記複数の電源線のうちの電位の異なるもの同士の少なくとも一部が絶縁膜を介して重ねて形成された、
ことを特徴とする半導体チップの実装体。 - フレキシブル配線基板が主基板に接続され、前記フレキシブル配線基板に長方形状の半導体チップが実装され、前記半導体チップ用の複数の電源線が当該半導体チップ内の長尺方向に伸びて形成された、半導体チップの実装体において、
前記複数の電源線のうちの電位の異なるもの同士の少なくとも一部が絶縁膜を介して重ねて形成された、
ことを特徴とする半導体チップの実装体。 - 主基板に長方形状の半導体チップが実装され、前記半導体チップ用の複数の電源線が前記主基板上に当該半導体チップの長尺方向に伸びて形成された、半導体チップの実装体において、
前記複数の電源線のうちの電位の異なるもの同士の少なくとも一部が絶縁膜を介して重ねて形成された、
ことを特徴とする半導体チップの実装体。 - 主基板と長方形状の副基板とがフレキシブル配線基板を介して接続され、前記副基板に半導体チップが実装され、前記半導体チップ用の複数の電源線が前記副基板の長尺方向に伸びて形成された、半導体チップの実装体において、
前記複数の電源線のうちの電位の異なるもの同士の少なくとも一部が絶縁膜を介して重ねて形成された、
ことを特徴とする半導体チップの実装体。
- 前記電位の異なる電源線の延長部分又は途中部分に当該電源線同士が重なる領域を設けることにより静電容量を形成した、
請求項1乃至6のいずれかに記載の半導体チップの実装体。 - 前記電源線同士が重なる領域として、前記電源線に電気的に接続する端子を利用した、
請求項1乃至7のいずれかに記載の半導体チップの実装体。 - 前記電源線は、長尺方向に幹部が伸び、この幹部から枝部が分岐した形状を有し、この枝部同士のみが重なる、
請求項1乃至8のいずれかに記載の半導体チップの実装体。 - 前記半導体チップは半導体回路が搭載されたガラス基板である、
請求項1乃至9のいずれかに記載の半導体チップの実装体。 - 前記主基板がガラス基板である、
請求項1乃至10のいずれかに記載の半導体チップの実装体。 - 前記副基板がプリント基板、フレキシブル配線基板又はガラス基板である、
請求項3又は6記載の半導体チップの実装体。
- 請求項1乃至12のいずれかに記載の半導体チップの実装体を備え、前記主基板が表示部を少なくとも有するガラス基板であり、前記半導体チップが前記表示部を駆動又は制御するものである、
表示装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2004074365A JP2005268282A (ja) | 2004-03-16 | 2004-03-16 | 半導体チップの実装体及びこれを用いた表示装置 |
US11/072,431 US20050206600A1 (en) | 2004-03-16 | 2005-03-07 | Structure of semiconductor chip and display device using the same |
CNB2005100550534A CN100464236C (zh) | 2004-03-16 | 2005-03-15 | 半导体芯片的结构和利用其的显示设备 |
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JP2004074365A JP2005268282A (ja) | 2004-03-16 | 2004-03-16 | 半導体チップの実装体及びこれを用いた表示装置 |
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JP2005268282A true JP2005268282A (ja) | 2005-09-29 |
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JP2004074365A Pending JP2005268282A (ja) | 2004-03-16 | 2004-03-16 | 半導体チップの実装体及びこれを用いた表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050206600A1 (ja) |
JP (1) | JP2005268282A (ja) |
CN (1) | CN100464236C (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091947A (ja) * | 2007-12-13 | 2008-04-17 | Renesas Technology Corp | 半導体装置 |
JP2015070086A (ja) * | 2013-09-27 | 2015-04-13 | シナプティクス・ディスプレイ・デバイス株式会社 | 集積回路モジュール及び表示モジュール |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100755975B1 (ko) * | 2006-08-23 | 2007-09-06 | 삼성전자주식회사 | 휴대 단말기의 정보 표시방법 |
JP5526592B2 (ja) * | 2009-04-24 | 2014-06-18 | ソニー株式会社 | 固体撮像装置、撮像装置および固体撮像装置の駆動方法 |
CN101996988B (zh) * | 2009-08-20 | 2013-02-27 | 精材科技股份有限公司 | 电子装置及其制造方法 |
KR101879831B1 (ko) * | 2012-03-21 | 2018-07-20 | 삼성디스플레이 주식회사 | 플렉시블 표시 장치, 유기 발광 표시 장치 및 플렉시블 표시 장치용 원장 기판 |
CN103728750A (zh) * | 2013-12-26 | 2014-04-16 | 京东方科技集团股份有限公司 | 一种显示面板及显示面板制备方法 |
CN105047123B (zh) | 2015-09-10 | 2017-10-17 | 京东方科技集团股份有限公司 | 显示驱动方法、显示驱动装置和显示装置 |
KR20170065713A (ko) * | 2015-12-03 | 2017-06-14 | 삼성디스플레이 주식회사 | 표시 장치 |
TWI684170B (zh) * | 2018-03-15 | 2020-02-01 | 友達光電股份有限公司 | 電子裝置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5610414A (en) * | 1993-07-28 | 1997-03-11 | Sharp Kabushiki Kaisha | Semiconductor device |
JPH10153795A (ja) * | 1996-11-26 | 1998-06-09 | Matsushita Electric Ind Co Ltd | 液晶表示装置 |
JP4401461B2 (ja) * | 1999-01-20 | 2010-01-20 | 三菱電機株式会社 | 液晶表示装置及びその製造方法 |
JP2002169176A (ja) * | 2000-12-04 | 2002-06-14 | Rohm Co Ltd | 液晶表示装置の構造 |
TW538294B (en) * | 2000-12-04 | 2003-06-21 | Rohm Co Ltd | Liquid crystal display |
-
2004
- 2004-03-16 JP JP2004074365A patent/JP2005268282A/ja active Pending
-
2005
- 2005-03-07 US US11/072,431 patent/US20050206600A1/en not_active Abandoned
- 2005-03-15 CN CNB2005100550534A patent/CN100464236C/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091947A (ja) * | 2007-12-13 | 2008-04-17 | Renesas Technology Corp | 半導体装置 |
JP4585564B2 (ja) * | 2007-12-13 | 2010-11-24 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2015070086A (ja) * | 2013-09-27 | 2015-04-13 | シナプティクス・ディスプレイ・デバイス株式会社 | 集積回路モジュール及び表示モジュール |
Also Published As
Publication number | Publication date |
---|---|
US20050206600A1 (en) | 2005-09-22 |
CN1670596A (zh) | 2005-09-21 |
CN100464236C (zh) | 2009-02-25 |
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