JP2005244132A5 - - Google Patents

Download PDF

Info

Publication number
JP2005244132A5
JP2005244132A5 JP2004055466A JP2004055466A JP2005244132A5 JP 2005244132 A5 JP2005244132 A5 JP 2005244132A5 JP 2004055466 A JP2004055466 A JP 2004055466A JP 2004055466 A JP2004055466 A JP 2004055466A JP 2005244132 A5 JP2005244132 A5 JP 2005244132A5
Authority
JP
Japan
Prior art keywords
thin film
integrated circuit
region
channel formation
semiconductor film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004055466A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005244132A (ja
JP4841807B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004055466A priority Critical patent/JP4841807B2/ja
Priority claimed from JP2004055466A external-priority patent/JP4841807B2/ja
Publication of JP2005244132A publication Critical patent/JP2005244132A/ja
Publication of JP2005244132A5 publication Critical patent/JP2005244132A5/ja
Application granted granted Critical
Publication of JP4841807B2 publication Critical patent/JP4841807B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004055466A 2004-02-27 2004-02-27 薄膜集積回路及び薄型半導体装置 Expired - Fee Related JP4841807B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004055466A JP4841807B2 (ja) 2004-02-27 2004-02-27 薄膜集積回路及び薄型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004055466A JP4841807B2 (ja) 2004-02-27 2004-02-27 薄膜集積回路及び薄型半導体装置

Publications (3)

Publication Number Publication Date
JP2005244132A JP2005244132A (ja) 2005-09-08
JP2005244132A5 true JP2005244132A5 (enExample) 2007-03-29
JP4841807B2 JP4841807B2 (ja) 2011-12-21

Family

ID=35025510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004055466A Expired - Fee Related JP4841807B2 (ja) 2004-02-27 2004-02-27 薄膜集積回路及び薄型半導体装置

Country Status (1)

Country Link
JP (1) JP4841807B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7557367B2 (en) 2004-06-04 2009-07-07 The Board Of Trustees Of The University Of Illinois Stretchable semiconductor elements and stretchable electrical circuits
TWI427802B (zh) * 2005-06-02 2014-02-21 美國伊利諾大學理事會 可印刷半導體結構及製造和組合之相關方法
JP2012054288A (ja) * 2010-08-31 2012-03-15 Murata Mfg Co Ltd 電子部品パッケージの製造方法
JP5757083B2 (ja) 2010-12-01 2015-07-29 セイコーエプソン株式会社 薄膜トランジスタ形成用基板、半導体装置、電気装置
US10714427B2 (en) 2016-09-08 2020-07-14 Asml Netherlands B.V. Secure chips with serial numbers
US10079206B2 (en) 2016-10-27 2018-09-18 Mapper Lithography Ip B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
CN110249408B (zh) * 2016-12-23 2023-05-12 Asml荷兰有限公司 具有序列号的安全芯片
US11374037B2 (en) 2017-02-21 2022-06-28 Sharp Kabushiki Kaisha Driving circuit, TFT substrate, and display device
KR102620564B1 (ko) * 2023-06-21 2024-01-03 주식회사 하스인더스트리 레이저 기술을 이용한 ic카드용 ic칩의 표면가공방법 및 이의 방법으로 표면가공된 ic카드용 ic칩

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62298105A (ja) * 1986-06-18 1987-12-25 Hitachi Micro Comput Eng Ltd 半導体集積回路装置
JP3590419B2 (ja) * 1994-05-19 2004-11-17 大日本印刷株式会社 Ｉｃカード処理装置を用いたｉｃカードのデータの更新方法
JP3621482B2 (ja) * 1995-11-29 2005-02-16 シチズン時計株式会社 半導体装置およびその製造方法
JPH10287072A (ja) * 1997-04-17 1998-10-27 Toppan Printing Co Ltd Ｉｃカードおよびその製造方法
JP2000113155A (ja) * 1998-09-30 2000-04-21 Oji Paper Co Ltd Ｉｃカード

Similar Documents

Publication Publication Date Title
CN103745978B (zh) 显示装置、阵列基板及其制作方法
US9214482B2 (en) Array substrate and display device
CN104022126B (zh) 一种阵列基板、其制作方法及显示装置
EP1670079A3 (en) Method of forming a conductive pattern of a thin film transistor
TW200500763A (en) Thin film transistor array panel and manufacturing method thereof
TW200725911A (en) Fabricating method for thin film transistor array substrate and thin film transistor array substrate using the same
JP2007005757A (ja) 薄膜トランジスタ、および、それの製造方法、並びに、液晶表示装置、および、それの製造方法
TW200703662A (en) Wiring for display device and thin film transistor array panel including the same and method for manufacturing thereof
TW200734780A (en) Display device and manufacturing method therefor
WO2014186988A1 (zh) 主动元件阵列基板及其制造方法
JP2005244132A5 (enExample)
US10871688B2 (en) Array substrate, manufacturing method thereof, and display device
CN106784014A (zh) 薄膜晶体管及其制作方法、显示基板、显示装置
TW200732804A (en) Display substrate, method of manufacturing the same and display panel having the same
TW200608576A (en) Method for fabricating organic thin film transistor and method for fabricating liquid crystal display device using the same
CN103928530A (zh) 氧化物薄膜晶体管阵列基板及其制造方法
WO2015096309A1 (zh) 薄膜晶体管及其制造方法、阵列基板、显示装置
CN206774547U (zh) 薄膜晶体管结构、电路结构、显示基板及显示装置
JP2006106106A5 (enExample)
TW200641445A (en) Liquid crystal display apparatus and manufacturing method thereof
TW200614515A (en) Method of manufacturing thin film semiconductor device, thin film semiconductor device, electro-optical device, and electronic apparatus
CN104064568B (zh) 一种薄膜晶体管阵列基板、其制造方法及显示装置
JP2006106110A5 (enExample)
CN105977267A (zh) 阵列基板及其制作方法、显示装置
WO2004081976A3 (en) Thin film transistor substrate ofa display device and method of manufacturing the same