JP4841807B2 - 薄膜集積回路及び薄型半導体装置 - Google Patents
薄膜集積回路及び薄型半導体装置 Download PDFInfo
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- JP4841807B2 JP4841807B2 JP2004055466A JP2004055466A JP4841807B2 JP 4841807 B2 JP4841807 B2 JP 4841807B2 JP 2004055466 A JP2004055466 A JP 2004055466A JP 2004055466 A JP2004055466 A JP 2004055466A JP 4841807 B2 JP4841807 B2 JP 4841807B2
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- Prior art keywords
- thin film
- integrated circuit
- identification information
- antenna
- idf chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- JOHWNGGYGAVMGU-UHFFFAOYSA-N trifluorochlorine Chemical compound FCl(F)F JOHWNGGYGAVMGU-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004055466A JP4841807B2 (ja) | 2004-02-27 | 2004-02-27 | 薄膜集積回路及び薄型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004055466A JP4841807B2 (ja) | 2004-02-27 | 2004-02-27 | 薄膜集積回路及び薄型半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005244132A JP2005244132A (ja) | 2005-09-08 |
| JP2005244132A5 JP2005244132A5 (enExample) | 2007-03-29 |
| JP4841807B2 true JP4841807B2 (ja) | 2011-12-21 |
Family
ID=35025510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004055466A Expired - Fee Related JP4841807B2 (ja) | 2004-02-27 | 2004-02-27 | 薄膜集積回路及び薄型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4841807B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1759422B1 (en) | 2004-06-04 | 2022-01-26 | The Board Of Trustees Of The University Of Illinois | Electrical device comprising printable semiconductor elements |
| MY151572A (en) * | 2005-06-02 | 2014-06-13 | Univ Illinois | Printable semiconductor structures and related methods of making and assembling |
| JP2012054288A (ja) * | 2010-08-31 | 2012-03-15 | Murata Mfg Co Ltd | 電子部品パッケージの製造方法 |
| JP5757083B2 (ja) | 2010-12-01 | 2015-07-29 | セイコーエプソン株式会社 | 薄膜トランジスタ形成用基板、半導体装置、電気装置 |
| US10079206B2 (en) | 2016-10-27 | 2018-09-18 | Mapper Lithography Ip B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
| US10714427B2 (en) * | 2016-09-08 | 2020-07-14 | Asml Netherlands B.V. | Secure chips with serial numbers |
| KR102257854B1 (ko) * | 2016-12-23 | 2021-05-31 | 에이에스엠엘 네델란즈 비.브이. | 일련번호를 갖는 보안 칩 |
| WO2018155284A1 (ja) * | 2017-02-21 | 2018-08-30 | シャープ株式会社 | 駆動回路、ｔｆｔ基板、表示装置 |
| KR102620564B1 (ko) * | 2023-06-21 | 2024-01-03 | 주식회사 하스인더스트리 | 레이저 기술을 이용한 ic카드용 ic칩의 표면가공방법 및 이의 방법으로 표면가공된 ic카드용 ic칩 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62298105A (ja) * | 1986-06-18 | 1987-12-25 | Hitachi Micro Comput Eng Ltd | 半導体集積回路装置 |
| JP3590419B2 (ja) * | 1994-05-19 | 2004-11-17 | 大日本印刷株式会社 | Ｉｃカード処理装置を用いたｉｃカードのデータの更新方法 |
| JP3621482B2 (ja) * | 1995-11-29 | 2005-02-16 | シチズン時計株式会社 | 半導体装置およびその製造方法 |
| JPH10287072A (ja) * | 1997-04-17 | 1998-10-27 | Toppan Printing Co Ltd | Ｉｃカードおよびその製造方法 |
| JP2000113155A (ja) * | 1998-09-30 | 2000-04-21 | Oji Paper Co Ltd | Ｉｃカード |
-
2004
- 2004-02-27 JP JP2004055466A patent/JP4841807B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005244132A (ja) | 2005-09-08 |
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