JP2005223331A - リードフレーム、これを利用した半導体チップパッケージ及びその製造方法 - Google Patents
リードフレーム、これを利用した半導体チップパッケージ及びその製造方法 Download PDFInfo
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Abstract
【解決手段】半導体チップパッケージは、四面に形成された複数のリード100と、四面の各隅部分から延びて形成されてその底面がリセスされたタイバー200を含むリードフレームと、タイバー200のリセス面に付着される半導体チップ500と、半導体チップ500上部面に形成された複数のチップパッド510と複数のリード100を電気的に連結させる連結手段と、半導体チップ500の上部と連結手段及びその接合部分を封止する封止手段700を含んで構成される。ここで、タイバー200は上に曲がった方式でアップセットした構造を有することが望ましい。
【選択図】 図4
Description
また、前記タイバーを上に曲げるアップセット方式で半導体チップ実装空間を確保することができ、半導体チップの下部面が外部に露出されて熱放出特性が良くなる。
200 タイバー
500 半導体チップ
600 ボンディングワイヤー
700 封止手段
Claims (22)
- 四面に形成された複数のリードと、前記四面の各隅部分から延びて形成されてその底面がリセスされたタイバーと、を含むリードフレームと;
前記タイバーのリセス面に付着される半導体チップと;
前記半導体チップ上部面に形成された複数のチップパッドと前記複数のリードとを電気的に連結させる連結手段と;
前記半導体チップの上部、前記連結手段及びその接合部分を封止する封止手段と;
を含む半導体チップパッケージ。 - 前記複数のリードの下部面は外部に露出されることを特徴とする請求項1に記載の半導体チップパッケージ。
- 前記半導体チップの下部面は外部に露出されることを特徴とする請求項2に記載の半導体チップパッケージ。
- 前記タイバーは上に曲がった方式でアップセットした構造を有することを特徴とする請求項3に記載の半導体チップパッケージ。
- 前記連結手段はボンディングワイヤーであることを特徴とする請求項1に記載の半導体チップパッケージ。
- 前記封止手段はエポキシモールディング樹脂で形成されたことを特徴とする請求項1に記載の半導体チップパッケージ。
- 前記リードフレームの封止しない部分は錫/鉛合金またはパラジウム/金合金または銀/金合金で構成されたグループから選択された伝導性坑酸化物質でコーティングされたことを特徴とする請求項1に記載の半導体チップパッケージ。
- 前記半導体チップの露出した下部面に熱放出装置がさらに付着したことを特徴とする請求項1に記載の半導体チップパッケージ。
- 前記パッケージの総高さは0.3mmないし0.4mmの厚さに形成されたことを特徴とする請求項1に記載の半導体チップパッケージ。
- 四面に形成された複数のリード;及び
前記四面の各隅部分から延びて形成されてその底面がリセスされたタイバー;を含むリードフレーム。 - 前記タイバーは上に曲がった方式でアップセットした構造を有することを特徴とする請求項10に記載のリードフレーム。
- 前記リードフレームは0.18mmないし0.22mmの厚さに形成されたことを特徴とする請求項11に記載のリードフレーム。
- 前記タイバーのリセスされた部分は前記リードフレーム厚さの半分以下にエッチングしたことを特徴とする請求項12に記載のリードフレーム。
- 複数のリードと、底面がリセスされたタイバーと、を含むリードフレームを提供する第1段階と;
半導体チップの活性面が上に向かうようにして前記タイバーのリセス面に前記半導体チップを付着する第2段階と;
前記半導体チップの前記活性面上に形成された複数のチップパッドと前記複数のリードとを連結手段により電気的に連結させる第3段階と;
前記複数のリードの下部面と前記半導体チップの下部面とが露出されるようにして前記半導体チップの上部、リードフレームの上部、前記連結手段及びそれらの接合部分が封止されるようにモールディングを遂行する第4段階と;
を含む半導体チップパッケージの製造方法。 - 前記第1段階以後に、金型を利用して前記タイバーを上に曲げるアップセット工程段階をさらに含むことを特徴とする請求項14に記載の半導体チップパッケージの製造方法。
- 前記リードフレームの封止しない部分は錫/鉛合金またはパラジウム/金合金または銀/金合金で構成されたグループから選択された伝導性坑酸化物質でコーティングする段階をさらに含むことを特徴とする請求項14に記載の半導体チップパッケージの製造方法。
- 前記パッケージの総高さが0.3mmないし0.4mmの厚さになるように形成することを特徴とする請求項14に記載の半導体チップパッケージの製造方法。
- 前記複数のリードの下部面と前記半導体チップ下部面とは外部に露出されるようにすることを特徴とする請求項14に記載の半導体チップパッケージの製造方法。
- 前記半導体チップの露出した下部面に熱放出装置をさらに付着することを特徴とする請求項18に記載の半導体チップパッケージの製造方法。
- 前記リードフレームは0.18mmないし0.22mmの厚さで形成することを特徴とする請求項14に記載の半導体チップパッケージの製造方法。
- 前記タイバーのリセスされた部分は前記リードフレーム厚さの半分以下にエッチングして形成することを特徴とする請求項20に記載の半導体チップパッケージの製造方法。
- 前記連結手段はボンディングワイヤーであることを特徴とする請求項14に記載の半導体チップパッケージの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR2004-007295 | 2004-02-04 | ||
KR1020040007295A KR100621555B1 (ko) | 2004-02-04 | 2004-02-04 | 리드 프레임, 이를 이용한 반도체 칩 패키지 및 그의 제조방법 |
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JP2005223331A true JP2005223331A (ja) | 2005-08-18 |
JP5100967B2 JP5100967B2 (ja) | 2012-12-19 |
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JP2005025708A Active JP5100967B2 (ja) | 2004-02-04 | 2005-02-01 | リードフレーム、これを利用した半導体チップパッケージ及びその製造方法 |
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JP (1) | JP5100967B2 (ja) |
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JP2008091818A (ja) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Ind Co Ltd | 光半導体装置用リードフレームおよびこれを用いた光半導体装置、並びにこれらの製造方法 |
GB2451077A (en) * | 2007-07-17 | 2009-01-21 | Zetex Semiconductors Plc | Semiconductor chip package |
KR100895353B1 (ko) * | 2007-10-12 | 2009-04-29 | 스테코 주식회사 | 반도체 패키지 |
US7986048B2 (en) * | 2009-02-18 | 2011-07-26 | Stats Chippac Ltd. | Package-on-package system with through vias and method of manufacture thereof |
KR101122463B1 (ko) * | 2010-01-04 | 2012-02-29 | 삼성전기주식회사 | 리드 프레임 |
TWI427750B (zh) * | 2010-07-20 | 2014-02-21 | Siliconix Electronic Co Ltd | 包括晶粒及l形引線之半導體封裝及其製造方法 |
US8987022B2 (en) * | 2011-01-17 | 2015-03-24 | Samsung Electronics Co., Ltd. | Light-emitting device package and method of manufacturing the same |
US9887144B2 (en) * | 2011-09-08 | 2018-02-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ring structure for chip packaging |
KR101356389B1 (ko) * | 2012-03-07 | 2014-01-29 | 에스티에스반도체통신 주식회사 | 상부면에 도전성 단자가 형성되는 반도체 패키지 및 그 제조방법 |
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JP5100967B2 (ja) | 2012-12-19 |
DE102005006730A1 (de) | 2005-08-25 |
KR100621555B1 (ko) | 2006-09-14 |
CN1652314A (zh) | 2005-08-10 |
CN100541748C (zh) | 2009-09-16 |
US20050167791A1 (en) | 2005-08-04 |
DE102005006730B4 (de) | 2007-02-22 |
US7436049B2 (en) | 2008-10-14 |
KR20050079145A (ko) | 2005-08-09 |
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