JP2005197384A5 - - Google Patents

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Publication number
JP2005197384A5
JP2005197384A5 JP2004000827A JP2004000827A JP2005197384A5 JP 2005197384 A5 JP2005197384 A5 JP 2005197384A5 JP 2004000827 A JP2004000827 A JP 2004000827A JP 2004000827 A JP2004000827 A JP 2004000827A JP 2005197384 A5 JP2005197384 A5 JP 2005197384A5
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Japan
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chuck
substrate
flow path
liquid
temperature
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JP2004000827A
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Japanese (ja)
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JP2005197384A (ja
JP4371822B2 (ja
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Priority to JP2004000827A priority Critical patent/JP4371822B2/ja
Priority claimed from JP2004000827A external-priority patent/JP4371822B2/ja
Priority to US11/030,515 priority patent/US7382434B2/en
Publication of JP2005197384A publication Critical patent/JP2005197384A/ja
Priority to US12/060,393 priority patent/US7719659B2/en
Publication of JP2005197384A5 publication Critical patent/JP2005197384A5/ja
Application granted granted Critical
Publication of JP4371822B2 publication Critical patent/JP4371822B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004000827A 2004-01-06 2004-01-06 露光装置 Expired - Fee Related JP4371822B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004000827A JP4371822B2 (ja) 2004-01-06 2004-01-06 露光装置
US11/030,515 US7382434B2 (en) 2004-01-06 2005-01-05 Exposure apparatus and device manufacturing method
US12/060,393 US7719659B2 (en) 2004-01-06 2008-04-01 Exposure apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004000827A JP4371822B2 (ja) 2004-01-06 2004-01-06 露光装置

Publications (3)

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JP2005197384A JP2005197384A (ja) 2005-07-21
JP2005197384A5 true JP2005197384A5 (enExample) 2009-09-17
JP4371822B2 JP4371822B2 (ja) 2009-11-25

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JP2004000827A Expired - Fee Related JP4371822B2 (ja) 2004-01-06 2004-01-06 露光装置

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US (2) US7382434B2 (enExample)
JP (1) JP4371822B2 (enExample)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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US7372541B2 (en) * 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG2010050110A (en) * 2002-11-12 2014-06-27 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10261775A1 (de) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
KR101506408B1 (ko) * 2003-02-26 2015-03-26 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
EP1610361B1 (en) 2003-03-25 2014-05-21 Nikon Corporation Exposure system and device production method
KR101176817B1 (ko) 2003-04-07 2012-08-24 가부시키가이샤 니콘 노광장치 및 디바이스 제조방법
WO2004093159A2 (en) 2003-04-09 2004-10-28 Nikon Corporation Immersion lithography fluid control system
KR20180089562A (ko) * 2003-04-10 2018-08-08 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
EP3062152B1 (en) * 2003-04-10 2017-12-20 Nikon Corporation Environmental system including vaccum scavenge for an immersion lithography apparatus
JP4656057B2 (ja) * 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
WO2004093160A2 (en) 2003-04-10 2004-10-28 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
KR101324818B1 (ko) 2003-04-11 2013-11-01 가부시키가이샤 니콘 액침 리소그래피에 의한 광학기기의 세정방법
JP4315198B2 (ja) 2003-04-11 2009-08-19 株式会社ニコン 液浸液体を光学アセンブリ下に維持するリソグラフィ装置及び液浸液体維持方法並びにそれらを用いるデバイス製造方法
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
CN1774667A (zh) 2003-04-17 2006-05-17 株式会社尼康 用在浸没式平版印刷方法中自动聚焦部件的光学配置
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
TWI518742B (zh) * 2003-05-23 2016-01-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
TWI511181B (zh) * 2003-05-23 2015-12-01 尼康股份有限公司 Exposure method and exposure apparatus, and device manufacturing method
KR20180122033A (ko) * 2003-05-28 2018-11-09 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2261742A3 (en) * 2003-06-11 2011-05-25 ASML Netherlands BV Lithographic apparatus and device manufacturing method.
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EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
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KR101288140B1 (ko) * 2003-09-03 2013-07-19 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
WO2005029559A1 (ja) * 2003-09-19 2005-03-31 Nikon Corporation 露光装置及びデバイス製造方法
KR101743378B1 (ko) * 2003-09-29 2017-06-15 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
KR101111364B1 (ko) 2003-10-08 2012-02-27 가부시키가이샤 자오 니콘 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광방법, 디바이스 제조 방법
WO2005036623A1 (ja) 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
TWI553701B (zh) 2003-10-09 2016-10-11 尼康股份有限公司 Exposure apparatus and exposure method, component manufacturing method
US7411653B2 (en) * 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
EP1531362A3 (en) * 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
JP4295712B2 (ja) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置及び装置製造方法
TWI605315B (zh) 2003-12-03 2017-11-11 尼康股份有限公司 Exposure device, exposure method, and device manufacturing method
US20070081133A1 (en) * 2004-12-14 2007-04-12 Niikon Corporation Projection exposure apparatus and stage unit, and exposure method
KR101941351B1 (ko) 2003-12-15 2019-01-22 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 노광 방법
KR101111363B1 (ko) * 2003-12-15 2012-04-12 가부시키가이샤 니콘 투영노광장치 및 스테이지 장치, 그리고 노광방법
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
WO2005071491A2 (en) * 2004-01-20 2005-08-04 Carl Zeiss Smt Ag Exposure apparatus and measuring device for a projection lens
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR101276392B1 (ko) 2004-02-03 2013-06-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP5167572B2 (ja) * 2004-02-04 2013-03-21 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
KR101554772B1 (ko) * 2004-02-04 2015-09-22 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR101504445B1 (ko) 2004-03-25 2015-03-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8054448B2 (en) * 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7616383B2 (en) * 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7796274B2 (en) 2004-06-04 2010-09-14 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system
KR101162128B1 (ko) * 2004-06-09 2012-07-03 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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US8305553B2 (en) * 2004-08-18 2012-11-06 Nikon Corporation Exposure apparatus and device manufacturing method
US7701550B2 (en) * 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7397533B2 (en) * 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7880860B2 (en) * 2004-12-20 2011-02-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1843387A4 (en) * 2005-01-25 2010-01-13 Jsr Corp IMMERSION EXPOSURE SYSTEM AND RECYCLING METHOD AND METHOD OF LIQUID FEEDING FOR IMMERSION EXPOSURE
EP3079164A1 (en) * 2005-01-31 2016-10-12 Nikon Corporation Exposure apparatus and method for producing device
US8692973B2 (en) * 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
US7282701B2 (en) 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
JP4072543B2 (ja) * 2005-03-18 2008-04-09 キヤノン株式会社 液浸露光装置及びデバイス製造方法
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
WO2006112436A1 (ja) 2005-04-18 2006-10-26 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US7357768B2 (en) * 2005-09-22 2008-04-15 William Marshall Recliner exerciser
US20070124987A1 (en) * 2005-12-05 2007-06-07 Brown Jeffrey K Electronic pest control apparatus
JP5194799B2 (ja) * 2005-12-06 2013-05-08 株式会社ニコン 露光方法、露光装置、及びデバイス製造方法
KR100768849B1 (ko) * 2005-12-06 2007-10-22 엘지전자 주식회사 계통 연계형 연료전지 시스템의 전원공급장치 및 방법
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102006021797A1 (de) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optische Abbildungseinrichtung mit thermischer Dämpfung
US7826030B2 (en) * 2006-09-07 2010-11-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2008053918A1 (en) * 2006-10-31 2008-05-08 Nikon Corporation Liquid holding apparatus, liquid holding method, exposure apparatus, exposure method and device manufacturing method
US8654305B2 (en) * 2007-02-15 2014-02-18 Asml Holding N.V. Systems and methods for insitu lens cleaning in immersion lithography
US8817226B2 (en) 2007-02-15 2014-08-26 Asml Holding N.V. Systems and methods for insitu lens cleaning using ozone in immersion lithography
US8237911B2 (en) 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US9025126B2 (en) 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
US8681308B2 (en) * 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4964904B2 (ja) * 2008-01-23 2012-07-04 エーエスエムエル ホールディング エヌ.ブイ. 液浸流体再循環システムを有する液浸リソグラフィ装置
JP5369443B2 (ja) 2008-02-05 2013-12-18 株式会社ニコン ステージ装置、露光装置、露光方法、及びデバイス製造方法
KR101448152B1 (ko) * 2008-03-26 2014-10-07 삼성전자주식회사 수직 포토게이트를 구비한 거리측정 센서 및 그를 구비한입체 컬러 이미지 센서
US9176393B2 (en) 2008-05-28 2015-11-03 Asml Netherlands B.V. Lithographic apparatus and a method of operating the apparatus
JP2010098172A (ja) * 2008-10-17 2010-04-30 Canon Inc 液体回収装置、露光装置及びデバイス製造方法
CA2784148A1 (en) * 2009-12-28 2011-07-28 Pioneer Hi-Bred International, Inc. Sorghum fertility restorer genotypes and methods of marker-assisted selection
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
USRE49066E1 (en) 2015-10-06 2022-05-10 Asml Holding N.V. Chucks and clamps for holding objects of a lithographic apparatus and methods for controlling a temperature of an object held by a clamp of a lithographic apparatus
WO2020164868A1 (en) * 2019-02-11 2020-08-20 Asml Netherlands B.V. Lithographic apparatus and method with a thermal control system

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
DE68921687T2 (de) * 1988-09-02 1995-08-03 Canon K.K., Tokio/Tokyo Belichtungseinrichtung.
JP3253675B2 (ja) * 1991-07-04 2002-02-04 株式会社東芝 荷電ビーム照射装置及び方法
US5430303A (en) * 1992-07-01 1995-07-04 Nikon Corporation Exposure apparatus
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
WO1999027568A1 (en) * 1997-11-21 1999-06-03 Nikon Corporation Projection aligner and projection exposure method
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
US6105589A (en) * 1999-01-11 2000-08-22 Vane; Ronald A. Oxidative cleaning method and apparatus for electron microscopes using an air plasma as an oxygen radical source
JP2000277415A (ja) * 1999-03-25 2000-10-06 Canon Inc 露光装置
US6394109B1 (en) * 1999-04-13 2002-05-28 Applied Materials, Inc. Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
US6614505B2 (en) * 2001-01-10 2003-09-02 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method, and device manufactured thereby
DE60323927D1 (de) * 2002-12-13 2008-11-20 Asml Netherlands Bv Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
WO2004093159A2 (en) * 2003-04-09 2004-10-28 Nikon Corporation Immersion lithography fluid control system
KR20180089562A (ko) * 2003-04-10 2018-08-08 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
KR101324818B1 (ko) * 2003-04-11 2013-11-01 가부시키가이샤 니콘 액침 리소그래피에 의한 광학기기의 세정방법
US7061579B2 (en) * 2003-11-13 2006-06-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
US7271878B2 (en) * 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography

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