JP2005197384A5 - - Google Patents

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Publication number
JP2005197384A5
JP2005197384A5 JP2004000827A JP2004000827A JP2005197384A5 JP 2005197384 A5 JP2005197384 A5 JP 2005197384A5 JP 2004000827 A JP2004000827 A JP 2004000827A JP 2004000827 A JP2004000827 A JP 2004000827A JP 2005197384 A5 JP2005197384 A5 JP 2005197384A5
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Japan
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chuck
substrate
flow path
liquid
temperature
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JP2004000827A
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English (en)
Japanese (ja)
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JP4371822B2 (ja
JP2005197384A (ja
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Priority to JP2004000827A priority Critical patent/JP4371822B2/ja
Priority claimed from JP2004000827A external-priority patent/JP4371822B2/ja
Priority to US11/030,515 priority patent/US7382434B2/en
Publication of JP2005197384A publication Critical patent/JP2005197384A/ja
Priority to US12/060,393 priority patent/US7719659B2/en
Publication of JP2005197384A5 publication Critical patent/JP2005197384A5/ja
Application granted granted Critical
Publication of JP4371822B2 publication Critical patent/JP4371822B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004000827A 2004-01-06 2004-01-06 露光装置 Expired - Fee Related JP4371822B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004000827A JP4371822B2 (ja) 2004-01-06 2004-01-06 露光装置
US11/030,515 US7382434B2 (en) 2004-01-06 2005-01-05 Exposure apparatus and device manufacturing method
US12/060,393 US7719659B2 (en) 2004-01-06 2008-04-01 Exposure apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004000827A JP4371822B2 (ja) 2004-01-06 2004-01-06 露光装置

Publications (3)

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JP2005197384A JP2005197384A (ja) 2005-07-21
JP2005197384A5 true JP2005197384A5 (enExample) 2009-09-17
JP4371822B2 JP4371822B2 (ja) 2009-11-25

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JP2004000827A Expired - Fee Related JP4371822B2 (ja) 2004-01-06 2004-01-06 露光装置

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US (2) US7382434B2 (enExample)
JP (1) JP4371822B2 (enExample)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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US7372541B2 (en) * 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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WO2004086470A1 (ja) * 2003-03-25 2004-10-07 Nikon Corporation 露光装置及びデバイス製造方法
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SG2014015184A (en) * 2003-04-10 2015-06-29 Nippon Kogaku Kk Environmental system including vacuum scavange for an immersion lithography apparatus
KR101177330B1 (ko) 2003-04-10 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 장치
WO2004090633A2 (en) * 2003-04-10 2004-10-21 Nikon Corporation An electro-osmotic element for an immersion lithography apparatus
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WO2004092830A2 (en) 2003-04-11 2004-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
SG139733A1 (en) 2003-04-11 2008-02-29 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
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TW201415536A (zh) 2003-05-23 2014-04-16 尼康股份有限公司 曝光方法及曝光裝置以及元件製造方法
TWI474380B (zh) * 2003-05-23 2015-02-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
CN100541717C (zh) * 2003-05-28 2009-09-16 株式会社尼康 曝光方法、曝光装置以及器件制造方法
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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KR101523180B1 (ko) 2003-09-03 2015-05-26 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
JP4444920B2 (ja) * 2003-09-19 2010-03-31 株式会社ニコン 露光装置及びデバイス製造方法
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JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
EP1672682A4 (en) 2003-10-08 2008-10-15 Zao Nikon Co Ltd SUBSTRATE TRANSPORT DEVICE AND METHOD, EXPOSURE DEVICE AND METHOD AND COMPONENT MANUFACTURING METHOD
KR101111364B1 (ko) 2003-10-08 2012-02-27 가부시키가이샤 자오 니콘 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광방법, 디바이스 제조 방법
TWI598934B (zh) * 2003-10-09 2017-09-11 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
US7411653B2 (en) * 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
EP1531362A3 (en) * 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
JP4295712B2 (ja) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置製造方法
EP3370115A1 (en) 2003-12-03 2018-09-05 Nikon Corporation Exposure apparatus, exposure method and method for producing a device
US20070081133A1 (en) * 2004-12-14 2007-04-12 Niikon Corporation Projection exposure apparatus and stage unit, and exposure method
WO2005057635A1 (ja) * 2003-12-15 2005-06-23 Nikon Corporation 投影露光装置及びステージ装置、並びに露光方法
KR101941351B1 (ko) 2003-12-15 2019-01-22 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 노광 방법
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
WO2005071491A2 (en) 2004-01-20 2005-08-04 Carl Zeiss Smt Ag Exposure apparatus and measuring device for a projection lens
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR101377815B1 (ko) * 2004-02-03 2014-03-26 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP2765595B1 (en) * 2004-02-04 2016-12-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
JP5167572B2 (ja) * 2004-02-04 2013-03-21 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
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US7616383B2 (en) * 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101368523B1 (ko) 2004-06-04 2014-02-27 칼 짜이스 에스엠테 게엠베하 광학적 결상 시스템의 결상 품질을 측정하기 위한 시스템
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US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101433491B1 (ko) 2004-07-12 2014-08-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8305553B2 (en) * 2004-08-18 2012-11-06 Nikon Corporation Exposure apparatus and device manufacturing method
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7397533B2 (en) * 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7880860B2 (en) * 2004-12-20 2011-02-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20070095399A (ko) * 2005-01-25 2007-09-28 제이에스알 가부시끼가이샤 액침형 노광 시스템, 액침형 노광용 액체의 리사이클 방법및 공급 방법
US8692973B2 (en) * 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
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US7282701B2 (en) 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
JP4072543B2 (ja) * 2005-03-18 2008-04-09 キヤノン株式会社 液浸露光装置及びデバイス製造方法
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
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US7357768B2 (en) * 2005-09-22 2008-04-15 William Marshall Recliner exerciser
US20070124987A1 (en) * 2005-12-05 2007-06-07 Brown Jeffrey K Electronic pest control apparatus
WO2007066692A1 (ja) 2005-12-06 2007-06-14 Nikon Corporation 露光方法、露光装置、及びデバイス製造方法
KR100768849B1 (ko) * 2005-12-06 2007-10-22 엘지전자 주식회사 계통 연계형 연료전지 시스템의 전원공급장치 및 방법
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102006021797A1 (de) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optische Abbildungseinrichtung mit thermischer Dämpfung
US7826030B2 (en) * 2006-09-07 2010-11-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2008053918A1 (en) * 2006-10-31 2008-05-08 Nikon Corporation Liquid holding apparatus, liquid holding method, exposure apparatus, exposure method and device manufacturing method
US8817226B2 (en) 2007-02-15 2014-08-26 Asml Holding N.V. Systems and methods for insitu lens cleaning using ozone in immersion lithography
US8654305B2 (en) * 2007-02-15 2014-02-18 Asml Holding N.V. Systems and methods for insitu lens cleaning in immersion lithography
US8237911B2 (en) 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US9025126B2 (en) 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
US8681308B2 (en) * 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL1036432A1 (nl) * 2008-01-23 2009-07-27 Asml Holding Nv An immersion lithographic apparatus with immersion fluid re-circulating system.
JP5369443B2 (ja) 2008-02-05 2013-12-18 株式会社ニコン ステージ装置、露光装置、露光方法、及びデバイス製造方法
KR101448152B1 (ko) * 2008-03-26 2014-10-07 삼성전자주식회사 수직 포토게이트를 구비한 거리측정 센서 및 그를 구비한입체 컬러 이미지 센서
JP5097166B2 (ja) 2008-05-28 2012-12-12 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置の動作方法
JP2010098172A (ja) * 2008-10-17 2010-04-30 Canon Inc 液体回収装置、露光装置及びデバイス製造方法
WO2011090690A1 (en) * 2009-12-28 2011-07-28 Pioneer Hi-Bred International, Inc. Sorghum fertility restorer genotypes and methods of marker-assisted selection
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
NL2017576A (en) 2015-10-06 2017-04-11 Asml Netherlands Bv Chucks and clamps for holding objects of a lithographic apparatus and methods for controlling a temperature of an object held by a clamp of a lithographic apparatus
NL2024711A (en) * 2019-02-11 2020-08-19 Asml Netherlands Bv Lithographic apparatus and method with a thermal control system

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
DE68921687T2 (de) * 1988-09-02 1995-08-03 Canon K.K., Tokio/Tokyo Belichtungseinrichtung.
JP3253675B2 (ja) * 1991-07-04 2002-02-04 株式会社東芝 荷電ビーム照射装置及び方法
US5430303A (en) * 1992-07-01 1995-07-04 Nikon Corporation Exposure apparatus
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
AU1175799A (en) * 1997-11-21 1999-06-15 Nikon Corporation Projection aligner and projection exposure method
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
US6105589A (en) * 1999-01-11 2000-08-22 Vane; Ronald A. Oxidative cleaning method and apparatus for electron microscopes using an air plasma as an oxygen radical source
JP2000277415A (ja) * 1999-03-25 2000-10-06 Canon Inc 露光装置
US6394109B1 (en) * 1999-04-13 2002-05-28 Applied Materials, Inc. Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system
US6614505B2 (en) * 2001-01-10 2003-09-02 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method, and device manufactured thereby
DE60323927D1 (de) * 2002-12-13 2008-11-20 Asml Netherlands Bv Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
KR101177331B1 (ko) * 2003-04-09 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 유체 제어 시스템
SG2014015184A (en) * 2003-04-10 2015-06-29 Nippon Kogaku Kk Environmental system including vacuum scavange for an immersion lithography apparatus
SG185136A1 (en) * 2003-04-11 2012-11-29 Nikon Corp Cleanup method for optics in immersion lithography
US7061579B2 (en) * 2003-11-13 2006-06-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
US7271878B2 (en) * 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography

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