JP4371822B2 - 露光装置 - Google Patents
露光装置 Download PDFInfo
- Publication number
- JP4371822B2 JP4371822B2 JP2004000827A JP2004000827A JP4371822B2 JP 4371822 B2 JP4371822 B2 JP 4371822B2 JP 2004000827 A JP2004000827 A JP 2004000827A JP 2004000827 A JP2004000827 A JP 2004000827A JP 4371822 B2 JP4371822 B2 JP 4371822B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- temperature
- wafer
- optical system
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004000827A JP4371822B2 (ja) | 2004-01-06 | 2004-01-06 | 露光装置 |
| US11/030,515 US7382434B2 (en) | 2004-01-06 | 2005-01-05 | Exposure apparatus and device manufacturing method |
| US12/060,393 US7719659B2 (en) | 2004-01-06 | 2008-04-01 | Exposure apparatus and device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004000827A JP4371822B2 (ja) | 2004-01-06 | 2004-01-06 | 露光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005197384A JP2005197384A (ja) | 2005-07-21 |
| JP2005197384A5 JP2005197384A5 (enExample) | 2009-09-17 |
| JP4371822B2 true JP4371822B2 (ja) | 2009-11-25 |
Family
ID=34708978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004000827A Expired - Fee Related JP4371822B2 (ja) | 2004-01-06 | 2004-01-06 | 露光装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7382434B2 (enExample) |
| JP (1) | JP4371822B2 (enExample) |
Families Citing this family (98)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7372541B2 (en) * | 2002-11-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TWI232357B (en) | 2002-11-12 | 2005-05-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| CN101713932B (zh) | 2002-11-12 | 2012-09-26 | Asml荷兰有限公司 | 光刻装置和器件制造方法 |
| US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE10261775A1 (de) * | 2002-12-20 | 2004-07-01 | Carl Zeiss Smt Ag | Vorrichtung zur optischen Vermessung eines Abbildungssystems |
| SG183572A1 (en) * | 2003-02-26 | 2012-09-27 | Nikon Corp | Exposure apparatus, exposure method, and method for producing device |
| KR101345474B1 (ko) * | 2003-03-25 | 2013-12-27 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| EP1612850B1 (en) * | 2003-04-07 | 2009-03-25 | Nikon Corporation | Exposure apparatus and method for manufacturing a device |
| WO2004093159A2 (en) | 2003-04-09 | 2004-10-28 | Nikon Corporation | Immersion lithography fluid control system |
| CN103383527B (zh) * | 2003-04-10 | 2015-10-28 | 株式会社尼康 | 包括用于沉浸光刻装置的真空清除的环境系统 |
| WO2004092833A2 (en) * | 2003-04-10 | 2004-10-28 | Nikon Corporation | Environmental system including a transport region for an immersion lithography apparatus |
| WO2004090633A2 (en) * | 2003-04-10 | 2004-10-21 | Nikon Corporation | An electro-osmotic element for an immersion lithography apparatus |
| EP1611482B1 (en) * | 2003-04-10 | 2015-06-03 | Nikon Corporation | Run-off path to collect liquid for an immersion lithography apparatus |
| EP2613195B1 (en) * | 2003-04-11 | 2015-12-16 | Nikon Corporation | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
| KR20190007532A (ko) * | 2003-04-11 | 2019-01-22 | 가부시키가이샤 니콘 | 액침 리소그래피에 의한 광학기기의 세정방법 |
| JP4582089B2 (ja) * | 2003-04-11 | 2010-11-17 | 株式会社ニコン | 液浸リソグラフィ用の液体噴射回収システム |
| JP2006523958A (ja) | 2003-04-17 | 2006-10-19 | 株式会社ニコン | 液浸リソグラフィで使用するためのオートフォーカス素子の光学的構造 |
| TWI295414B (en) * | 2003-05-13 | 2008-04-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| KR20060009356A (ko) * | 2003-05-15 | 2006-01-31 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| TWI470671B (zh) | 2003-05-23 | 2015-01-21 | 尼康股份有限公司 | Exposure method and exposure apparatus, and device manufacturing method |
| TWI616932B (zh) | 2003-05-23 | 2018-03-01 | Nikon Corp | Exposure device and component manufacturing method |
| CN101614966B (zh) | 2003-05-28 | 2015-06-17 | 株式会社尼康 | 曝光方法、曝光装置以及器件制造方法 |
| US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP2261742A3 (en) * | 2003-06-11 | 2011-05-25 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method. |
| KR101520591B1 (ko) | 2003-06-13 | 2015-05-14 | 가부시키가이샤 니콘 | 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법 |
| CN101436003B (zh) | 2003-06-19 | 2011-08-17 | 株式会社尼康 | 曝光装置及器件制造方法 |
| WO2005006026A2 (en) * | 2003-07-01 | 2005-01-20 | Nikon Corporation | Using isotopically specified fluids as optical elements |
| EP2466383B1 (en) * | 2003-07-08 | 2014-11-19 | Nikon Corporation | Wafer table for immersion lithography |
| DE602004030247D1 (de) * | 2003-07-09 | 2011-01-05 | Nippon Kogaku Kk | Belichtungsvorrichtung und verfahren zur bauelementherstellung |
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| EP3346485A1 (en) | 2003-07-25 | 2018-07-11 | Nikon Corporation | Projection optical system inspecting method and inspection apparatus, and a projection optical system manufacturing method |
| EP1503244A1 (en) | 2003-07-28 | 2005-02-02 | ASML Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
| CN102323724B (zh) | 2003-07-28 | 2014-08-13 | 株式会社尼康 | 液浸曝光装置及其制造方法、曝光装置、器件制造方法 |
| US7779781B2 (en) | 2003-07-31 | 2010-08-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| WO2005022616A1 (ja) * | 2003-08-29 | 2005-03-10 | Nikon Corporation | 露光装置及びデバイス製造方法 |
| TWI263859B (en) | 2003-08-29 | 2006-10-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| KR101748923B1 (ko) | 2003-09-03 | 2017-06-19 | 가부시키가이샤 니콘 | 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법 |
| JP4444920B2 (ja) * | 2003-09-19 | 2010-03-31 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| SG131929A1 (en) | 2003-09-29 | 2007-05-28 | Nikon Corp | Exposure apparatus, exposure method, and device manufacturing method |
| KR101111364B1 (ko) | 2003-10-08 | 2012-02-27 | 가부시키가이샤 자오 니콘 | 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광방법, 디바이스 제조 방법 |
| JP2005136364A (ja) * | 2003-10-08 | 2005-05-26 | Zao Nikon Co Ltd | 基板搬送装置、露光装置、並びにデバイス製造方法 |
| EP1672682A4 (en) | 2003-10-08 | 2008-10-15 | Zao Nikon Co Ltd | SUBSTRATE TRANSPORT DEVICE AND METHOD, EXPOSURE DEVICE AND METHOD AND COMPONENT MANUFACTURING METHOD |
| TWI598934B (zh) | 2003-10-09 | 2017-09-11 | Nippon Kogaku Kk | Exposure apparatus, exposure method, and device manufacturing method |
| US7411653B2 (en) * | 2003-10-28 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus |
| EP1531362A3 (en) * | 2003-11-13 | 2007-07-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor manufacturing apparatus and pattern formation method |
| US7528929B2 (en) * | 2003-11-14 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| SG2014014955A (en) | 2003-12-03 | 2014-07-30 | Nippon Kogaku Kk | Exposure apparatus, exposure method, method for producing device, and optical part |
| KR101111363B1 (ko) * | 2003-12-15 | 2012-04-12 | 가부시키가이샤 니콘 | 투영노광장치 및 스테이지 장치, 그리고 노광방법 |
| WO2005057636A1 (ja) | 2003-12-15 | 2005-06-23 | Nikon Corporation | ステージ装置、露光装置、及び露光方法 |
| US20070081133A1 (en) * | 2004-12-14 | 2007-04-12 | Niikon Corporation | Projection exposure apparatus and stage unit, and exposure method |
| JP4371822B2 (ja) * | 2004-01-06 | 2009-11-25 | キヤノン株式会社 | 露光装置 |
| JP4843503B2 (ja) * | 2004-01-20 | 2011-12-21 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィ投影露光装置および投影レンズのための測定装置 |
| US7589822B2 (en) * | 2004-02-02 | 2009-09-15 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
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| US8111373B2 (en) | 2004-03-25 | 2012-02-07 | Nikon Corporation | Exposure apparatus and device fabrication method |
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| JPWO2006080250A1 (ja) * | 2005-01-25 | 2008-08-07 | Jsr株式会社 | 液浸型露光システム、液浸型露光用液体のリサイクル方法及び供給方法 |
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| USRE43576E1 (en) | 2005-04-08 | 2012-08-14 | Asml Netherlands B.V. | Dual stage lithographic apparatus and device manufacturing method |
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| US20070124987A1 (en) * | 2005-12-05 | 2007-06-07 | Brown Jeffrey K | Electronic pest control apparatus |
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| US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE102006021797A1 (de) | 2006-05-09 | 2007-11-15 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit thermischer Dämpfung |
| US7826030B2 (en) * | 2006-09-07 | 2010-11-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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| US8654305B2 (en) * | 2007-02-15 | 2014-02-18 | Asml Holding N.V. | Systems and methods for insitu lens cleaning in immersion lithography |
| US8817226B2 (en) | 2007-02-15 | 2014-08-26 | Asml Holding N.V. | Systems and methods for insitu lens cleaning using ozone in immersion lithography |
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| US8681308B2 (en) * | 2007-09-13 | 2014-03-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US8629970B2 (en) * | 2008-01-23 | 2014-01-14 | Asml Netherlands B.V. | Immersion lithographic apparatus with immersion fluid re-circulating system |
| JP5369443B2 (ja) | 2008-02-05 | 2013-12-18 | 株式会社ニコン | ステージ装置、露光装置、露光方法、及びデバイス製造方法 |
| KR101448152B1 (ko) * | 2008-03-26 | 2014-10-07 | 삼성전자주식회사 | 수직 포토게이트를 구비한 거리측정 센서 및 그를 구비한입체 컬러 이미지 센서 |
| EP2128703A1 (en) * | 2008-05-28 | 2009-12-02 | ASML Netherlands BV | Lithographic Apparatus and a Method of Operating the Apparatus |
| JP2010098172A (ja) * | 2008-10-17 | 2010-04-30 | Canon Inc | 液体回収装置、露光装置及びデバイス製造方法 |
| US8946514B2 (en) * | 2009-12-28 | 2015-02-03 | E.I. Du Pont De Nemours And Company | Sorghum fertility restorer genotypes and methods of marker-assisted selection |
| EP2381310B1 (en) | 2010-04-22 | 2015-05-06 | ASML Netherlands BV | Fluid handling structure and lithographic apparatus |
| US10324383B2 (en) | 2015-10-06 | 2019-06-18 | Asml Holding N.V. | Chucks and clamps for holding objects of a lithographic apparatus and methods for controlling a temperature of an object held by a clamp of a lithographic apparatus |
| WO2020164868A1 (en) * | 2019-02-11 | 2020-08-20 | Asml Netherlands B.V. | Lithographic apparatus and method with a thermal control system |
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|---|---|---|---|---|
| US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
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| JP2000277415A (ja) * | 1999-03-25 | 2000-10-06 | Canon Inc | 露光装置 |
| US6394109B1 (en) * | 1999-04-13 | 2002-05-28 | Applied Materials, Inc. | Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system |
| US6614505B2 (en) * | 2001-01-10 | 2003-09-02 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method, and device manufactured thereby |
| DE60323927D1 (de) * | 2002-12-13 | 2008-11-20 | Asml Netherlands Bv | Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung |
| WO2004093159A2 (en) * | 2003-04-09 | 2004-10-28 | Nikon Corporation | Immersion lithography fluid control system |
| CN103383527B (zh) * | 2003-04-10 | 2015-10-28 | 株式会社尼康 | 包括用于沉浸光刻装置的真空清除的环境系统 |
| KR20190007532A (ko) * | 2003-04-11 | 2019-01-22 | 가부시키가이샤 니콘 | 액침 리소그래피에 의한 광학기기의 세정방법 |
| US7061579B2 (en) * | 2003-11-13 | 2006-06-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4371822B2 (ja) * | 2004-01-06 | 2009-11-25 | キヤノン株式会社 | 露光装置 |
| US7271878B2 (en) * | 2004-04-22 | 2007-09-18 | International Business Machines Corporation | Wafer cell for immersion lithography |
-
2004
- 2004-01-06 JP JP2004000827A patent/JP4371822B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-05 US US11/030,515 patent/US7382434B2/en not_active Expired - Fee Related
-
2008
- 2008-04-01 US US12/060,393 patent/US7719659B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7719659B2 (en) | 2010-05-18 |
| US7382434B2 (en) | 2008-06-03 |
| US20080186463A1 (en) | 2008-08-07 |
| JP2005197384A (ja) | 2005-07-21 |
| US20050146695A1 (en) | 2005-07-07 |
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