JP2005183693A5 - - Google Patents

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Publication number
JP2005183693A5
JP2005183693A5 JP2003422932A JP2003422932A JP2005183693A5 JP 2005183693 A5 JP2005183693 A5 JP 2005183693A5 JP 2003422932 A JP2003422932 A JP 2003422932A JP 2003422932 A JP2003422932 A JP 2003422932A JP 2005183693 A5 JP2005183693 A5 JP 2005183693A5
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JP
Japan
Prior art keywords
liquid
exposure apparatus
substrate
carbon dioxide
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003422932A
Other languages
English (en)
Japanese (ja)
Other versions
JP4323946B2 (ja
JP2005183693A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2003422932A external-priority patent/JP4323946B2/ja
Priority to JP2003422932A priority Critical patent/JP4323946B2/ja
Priority to US10/538,467 priority patent/US7292309B2/en
Priority to KR1020067011585A priority patent/KR100801354B1/ko
Priority to PCT/JP2004/018958 priority patent/WO2005062351A1/en
Priority to EP04807315A priority patent/EP1697974A4/en
Priority to TW093139536A priority patent/TWI285796B/zh
Publication of JP2005183693A publication Critical patent/JP2005183693A/ja
Publication of JP2005183693A5 publication Critical patent/JP2005183693A5/ja
Publication of JP4323946B2 publication Critical patent/JP4323946B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003422932A 2003-12-19 2003-12-19 露光装置 Expired - Fee Related JP4323946B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003422932A JP4323946B2 (ja) 2003-12-19 2003-12-19 露光装置
EP04807315A EP1697974A4 (en) 2003-12-19 2004-12-13 EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD
KR1020067011585A KR100801354B1 (ko) 2003-12-19 2004-12-13 노광장치 및 디바이스의 제조방법
PCT/JP2004/018958 WO2005062351A1 (en) 2003-12-19 2004-12-13 Exposure apparatus and device manufacturing method
US10/538,467 US7292309B2 (en) 2003-12-19 2004-12-13 Exposure apparatus and device manufacturing method
TW093139536A TWI285796B (en) 2003-12-19 2004-12-17 Exposure apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003422932A JP4323946B2 (ja) 2003-12-19 2003-12-19 露光装置

Publications (3)

Publication Number Publication Date
JP2005183693A JP2005183693A (ja) 2005-07-07
JP2005183693A5 true JP2005183693A5 (enExample) 2007-02-08
JP4323946B2 JP4323946B2 (ja) 2009-09-02

Family

ID=34708744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003422932A Expired - Fee Related JP4323946B2 (ja) 2003-12-19 2003-12-19 露光装置

Country Status (6)

Country Link
US (1) US7292309B2 (enExample)
EP (1) EP1697974A4 (enExample)
JP (1) JP4323946B2 (enExample)
KR (1) KR100801354B1 (enExample)
TW (1) TWI285796B (enExample)
WO (1) WO2005062351A1 (enExample)

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TWI543235B (zh) 2003-06-19 2016-07-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
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JP4295712B2 (ja) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置製造方法
EP3139214B1 (en) 2003-12-03 2019-01-30 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
DE602004030481D1 (de) 2003-12-15 2011-01-20 Nippon Kogaku Kk Bühnensystem, belichtungsvorrichtung und belichtungsverfahren
JP4319189B2 (ja) 2004-01-26 2009-08-26 株式会社ニコン 露光装置及びデバイス製造方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
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JP4752473B2 (ja) 2004-12-09 2011-08-17 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
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WO2006084641A2 (en) * 2005-02-10 2006-08-17 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
KR101344142B1 (ko) * 2005-04-25 2013-12-23 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
CN100541719C (zh) * 2005-04-25 2009-09-16 株式会社尼康 曝光方法和曝光装置、以及器件制造方法
JP2006319064A (ja) 2005-05-11 2006-11-24 Canon Inc 測定装置、露光方法及び装置
WO2006137410A1 (ja) * 2005-06-21 2006-12-28 Nikon Corporation 露光装置及び露光方法、メンテナンス方法、並びにデバイス製造方法
US20070085989A1 (en) * 2005-06-21 2007-04-19 Nikon Corporation Exposure apparatus and exposure method, maintenance method, and device manufacturing method
WO2007001848A2 (en) * 2005-06-24 2007-01-04 Sachem, Inc. High refractive index fluids with low absorption for immersion lithography
US7291569B2 (en) * 2005-06-29 2007-11-06 Infineon Technologies Ag Fluids for immersion lithography systems
US7420188B2 (en) * 2005-10-14 2008-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure method and apparatus for immersion lithography
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
WO2007072818A1 (ja) * 2005-12-19 2007-06-28 Nikon Corporation 液体製造装置、液浸露光装置、及びデバイス製造方法
JP2007180450A (ja) * 2005-12-28 2007-07-12 Canon Inc 露光装置
US7843548B2 (en) * 2006-11-13 2010-11-30 Asml Netherlands B.V. Conduit system for a lithographic apparatus, lithographic apparatus, pump, and method for substantially reducing vibrations in a conduit system
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US8045135B2 (en) * 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
JP2008311372A (ja) * 2007-06-13 2008-12-25 Nomura Micro Sci Co Ltd 超純水中の溶存窒素の測定方法及び溶存窒素測定装置
JP5180555B2 (ja) * 2007-10-04 2013-04-10 キヤノン株式会社 位置決め装置、露光装置及びデバイス製造方法
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JP2012009596A (ja) * 2010-06-24 2012-01-12 Nikon Corp 液体供給装置、露光装置、液体供給方法、メンテナンス方法、及びデバイス製造方法
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CN106471602A (zh) * 2014-03-31 2017-03-01 独立行政法人产业技术综合研究所 半导体的制造方法及晶片衬底的清洗方法
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JP6505534B2 (ja) * 2015-07-22 2019-04-24 株式会社平間理化研究所 現像液の管理方法及び装置

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JP2005136374A (ja) * 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd 半導体製造装置及びそれを用いたパターン形成方法

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