KR100801354B1 - 노광장치 및 디바이스의 제조방법 - Google Patents

노광장치 및 디바이스의 제조방법 Download PDF

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Publication number
KR100801354B1
KR100801354B1 KR1020067011585A KR20067011585A KR100801354B1 KR 100801354 B1 KR100801354 B1 KR 100801354B1 KR 1020067011585 A KR1020067011585 A KR 1020067011585A KR 20067011585 A KR20067011585 A KR 20067011585A KR 100801354 B1 KR100801354 B1 KR 100801354B1
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KR
South Korea
Prior art keywords
carbon dioxide
exposure apparatus
fluid
optical system
substrate
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Expired - Fee Related
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KR1020067011585A
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English (en)
Korean (ko)
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KR20060101529A (ko
Inventor
토쿠유키 혼다
Original Assignee
캐논 가부시끼가이샤
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Publication of KR20060101529A publication Critical patent/KR20060101529A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020067011585A 2003-12-19 2004-12-13 노광장치 및 디바이스의 제조방법 Expired - Fee Related KR100801354B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00422932 2003-12-19
JP2003422932A JP4323946B2 (ja) 2003-12-19 2003-12-19 露光装置

Publications (2)

Publication Number Publication Date
KR20060101529A KR20060101529A (ko) 2006-09-25
KR100801354B1 true KR100801354B1 (ko) 2008-02-05

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KR1020067011585A Expired - Fee Related KR100801354B1 (ko) 2003-12-19 2004-12-13 노광장치 및 디바이스의 제조방법

Country Status (6)

Country Link
US (1) US7292309B2 (enExample)
EP (1) EP1697974A4 (enExample)
JP (1) JP4323946B2 (enExample)
KR (1) KR100801354B1 (enExample)
TW (1) TWI285796B (enExample)
WO (1) WO2005062351A1 (enExample)

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KR101520591B1 (ko) 2003-06-13 2015-05-14 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
TWI543235B (zh) 2003-06-19 2016-07-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1531362A3 (en) * 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
JP4295712B2 (ja) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置製造方法
EP3139214B1 (en) 2003-12-03 2019-01-30 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
DE602004030481D1 (de) 2003-12-15 2011-01-20 Nippon Kogaku Kk Bühnensystem, belichtungsvorrichtung und belichtungsverfahren
JP4319189B2 (ja) 2004-01-26 2009-08-26 株式会社ニコン 露光装置及びデバイス製造方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
WO2005122218A1 (ja) * 2004-06-09 2005-12-22 Nikon Corporation 露光装置及びデバイス製造方法
JP4752473B2 (ja) 2004-12-09 2011-08-17 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
JP2006222165A (ja) * 2005-02-08 2006-08-24 Canon Inc 露光装置
WO2006084641A2 (en) * 2005-02-10 2006-08-17 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
KR101344142B1 (ko) * 2005-04-25 2013-12-23 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
CN100541719C (zh) * 2005-04-25 2009-09-16 株式会社尼康 曝光方法和曝光装置、以及器件制造方法
JP2006319064A (ja) 2005-05-11 2006-11-24 Canon Inc 測定装置、露光方法及び装置
WO2006137410A1 (ja) * 2005-06-21 2006-12-28 Nikon Corporation 露光装置及び露光方法、メンテナンス方法、並びにデバイス製造方法
US20070085989A1 (en) * 2005-06-21 2007-04-19 Nikon Corporation Exposure apparatus and exposure method, maintenance method, and device manufacturing method
WO2007001848A2 (en) * 2005-06-24 2007-01-04 Sachem, Inc. High refractive index fluids with low absorption for immersion lithography
US7291569B2 (en) * 2005-06-29 2007-11-06 Infineon Technologies Ag Fluids for immersion lithography systems
US7420188B2 (en) * 2005-10-14 2008-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Exposure method and apparatus for immersion lithography
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
WO2007072818A1 (ja) * 2005-12-19 2007-06-28 Nikon Corporation 液体製造装置、液浸露光装置、及びデバイス製造方法
JP2007180450A (ja) * 2005-12-28 2007-07-12 Canon Inc 露光装置
US7843548B2 (en) * 2006-11-13 2010-11-30 Asml Netherlands B.V. Conduit system for a lithographic apparatus, lithographic apparatus, pump, and method for substantially reducing vibrations in a conduit system
SG143137A1 (en) 2006-11-13 2008-06-27 Asml Netherlands Bv Conduit system for a lithographic apparatus, lithographic apparatus, pump, and method for substantially reducing vibrations in a conduit system
US8045135B2 (en) * 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
JP2008311372A (ja) * 2007-06-13 2008-12-25 Nomura Micro Sci Co Ltd 超純水中の溶存窒素の測定方法及び溶存窒素測定装置
JP5180555B2 (ja) * 2007-10-04 2013-04-10 キヤノン株式会社 位置決め装置、露光装置及びデバイス製造方法
US9176393B2 (en) 2008-05-28 2015-11-03 Asml Netherlands B.V. Lithographic apparatus and a method of operating the apparatus
WO2010103822A1 (ja) 2009-03-10 2010-09-16 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
TWI399620B (zh) * 2009-05-05 2013-06-21 Nat Synchrotron Radiation Res Ct 立體光阻微結構的製作方法
NL2005655A (en) 2009-12-09 2011-06-14 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
JP2012009596A (ja) * 2010-06-24 2012-01-12 Nikon Corp 液体供給装置、露光装置、液体供給方法、メンテナンス方法、及びデバイス製造方法
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CN106471602A (zh) * 2014-03-31 2017-03-01 独立行政法人产业技术综合研究所 半导体的制造方法及晶片衬底的清洗方法
JP6070784B2 (ja) * 2015-07-14 2017-02-01 株式会社ニコン 液体供給装置、露光装置、液体供給方法、及びデバイス製造方法
JP6505534B2 (ja) * 2015-07-22 2019-04-24 株式会社平間理化研究所 現像液の管理方法及び装置

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JPH10154659A (ja) 1996-10-07 1998-06-09 Nikon Corp リソグラフィーアライナー、製造装置、または検査装置用の焦点及びチルト調節システム
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JPH10154659A (ja) 1996-10-07 1998-06-09 Nikon Corp リソグラフィーアライナー、製造装置、または検査装置用の焦点及びチルト調節システム
JPH10303114A (ja) 1997-04-23 1998-11-13 Nikon Corp 液浸型露光装置
KR20060091307A (ko) * 2003-09-29 2006-08-18 가부시키가이샤 니콘 투영 노광 장치, 투영 노광 방법 및 디바이스 제조 방법

Also Published As

Publication number Publication date
EP1697974A1 (en) 2006-09-06
JP4323946B2 (ja) 2009-09-02
US20060050257A1 (en) 2006-03-09
EP1697974A4 (en) 2009-07-29
KR20060101529A (ko) 2006-09-25
JP2005183693A (ja) 2005-07-07
WO2005062351A1 (en) 2005-07-07
TWI285796B (en) 2007-08-21
TW200532388A (en) 2005-10-01
US7292309B2 (en) 2007-11-06

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