JP2005158926A - ロードロック装置および方法 - Google Patents

ロードロック装置および方法 Download PDF

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Publication number
JP2005158926A
JP2005158926A JP2003393670A JP2003393670A JP2005158926A JP 2005158926 A JP2005158926 A JP 2005158926A JP 2003393670 A JP2003393670 A JP 2003393670A JP 2003393670 A JP2003393670 A JP 2003393670A JP 2005158926 A JP2005158926 A JP 2005158926A
Authority
JP
Japan
Prior art keywords
load lock
chamber
valve
substrate
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003393670A
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English (en)
Japanese (ja)
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JP2005158926A5 (enExample
Inventor
Kazuyuki Harumi
和之 春見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003393670A priority Critical patent/JP2005158926A/ja
Priority to US10/994,360 priority patent/US20050118002A1/en
Publication of JP2005158926A publication Critical patent/JP2005158926A/ja
Publication of JP2005158926A5 publication Critical patent/JP2005158926A5/ja
Priority to US11/843,074 priority patent/US8347915B2/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87917—Flow path with serial valves and/or closures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electron Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003393670A 2003-11-25 2003-11-25 ロードロック装置および方法 Pending JP2005158926A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003393670A JP2005158926A (ja) 2003-11-25 2003-11-25 ロードロック装置および方法
US10/994,360 US20050118002A1 (en) 2003-11-25 2004-11-23 Load-lock technique
US11/843,074 US8347915B2 (en) 2003-11-25 2007-08-22 Load-lock technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003393670A JP2005158926A (ja) 2003-11-25 2003-11-25 ロードロック装置および方法

Publications (2)

Publication Number Publication Date
JP2005158926A true JP2005158926A (ja) 2005-06-16
JP2005158926A5 JP2005158926A5 (enExample) 2007-01-18

Family

ID=34616486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003393670A Pending JP2005158926A (ja) 2003-11-25 2003-11-25 ロードロック装置および方法

Country Status (2)

Country Link
US (2) US20050118002A1 (enExample)
JP (1) JP2005158926A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015053391A1 (ja) * 2013-10-10 2015-04-16 日東電工株式会社 スパッタ装置およびスパッタ装置のフィルムロールの交換方法
CN108352289A (zh) * 2015-11-20 2018-07-31 株式会社岛津制作所 真空处理装置和质谱分析仪

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158926A (ja) * 2003-11-25 2005-06-16 Canon Inc ロードロック装置および方法
JP4478440B2 (ja) 2003-12-02 2010-06-09 キヤノン株式会社 ロードロック装置および方法
JP2005191494A (ja) * 2003-12-26 2005-07-14 Canon Inc 露光装置、デバイスの製造方法
US7828504B2 (en) * 2006-05-12 2010-11-09 Axcellis Technologies, Inc. Combination load lock for handling workpieces
US8693856B2 (en) 2010-09-03 2014-04-08 Kla-Tencor Corporation Apparatus and methods for vacuum-compatible substrate thermal management
DE102010048043A1 (de) 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
CN104385778B (zh) * 2014-10-27 2017-05-17 合肥京东方光电科技有限公司 一种取向膜印刷设备和取向膜印刷系统
DK178352B1 (da) * 2015-02-27 2016-01-04 Intelligent Systems As Transport- og lagersystem til servicering af et antal behandlings og plejeområder på et hospital, samt fremgangsmåde til drift heraf.
CN108506342B (zh) * 2018-03-20 2020-02-21 北京石油化工学院 一种主动悬浮的双驱动天车
KR101892129B1 (ko) * 2018-05-25 2018-10-04 주식회사 디엠티 진공 챔버 이송 장치
JP7168430B2 (ja) * 2018-12-04 2022-11-09 株式会社アイシン福井 レーザ溶接装置
JP7239307B2 (ja) * 2018-12-04 2023-03-14 株式会社アイシン福井 レーザ溶接装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529448A (ja) * 1991-07-25 1993-02-05 Tokyo Electron Ltd 排気方法
JPH10173025A (ja) * 1996-12-16 1998-06-26 Kokusai Electric Co Ltd 半導体製造装置のロードロック室
JPH113867A (ja) * 1997-06-11 1999-01-06 Kokusai Electric Co Ltd 半導体製造装置
JP2001102281A (ja) * 1999-09-28 2001-04-13 Canon Inc ロードロック室、チャンバ、半導体製造装置およびデバイス製造方法
JP2003168712A (ja) * 2001-11-30 2003-06-13 Japan Steel Works Ltd:The ロードロック装置の基板搬送方法及びその装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2812271C2 (de) * 1978-03-21 1983-01-27 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung mit mehreren Schleusenkammern zum chargenweisen Beschichten von Substraten
FR2659263B1 (fr) * 1990-03-07 1992-05-15 Commissariat Energie Atomique Porte soufflante pour conteneur de confinement ultrapropre.
KR0155572B1 (ko) * 1991-05-28 1998-12-01 이노우에 아키라 감압처리 시스템 및 감압처리 방법
US5363872A (en) * 1993-03-16 1994-11-15 Applied Materials, Inc. Low particulate slit valve system and method for controlling same
JP3311126B2 (ja) * 1993-12-20 2002-08-05 キヤノン株式会社 ミラーユニットおよび該ミラーユニットを備えた露光装置
US5835560A (en) * 1994-05-24 1998-11-10 Canon Kabushiki Kaisha Exposure apparatus
US6048154A (en) * 1996-10-02 2000-04-11 Applied Materials, Inc. High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
JP4689064B2 (ja) * 2000-03-30 2011-05-25 キヤノン株式会社 露光装置およびデバイス製造方法
JP2003059801A (ja) * 2001-08-14 2003-02-28 Canon Inc 露光装置及び露光方法
JP2004047517A (ja) * 2002-07-08 2004-02-12 Canon Inc 放射線生成装置、放射線生成方法、露光装置並びに露光方法
JP4164414B2 (ja) * 2003-06-19 2008-10-15 キヤノン株式会社 ステージ装置
US6916009B2 (en) * 2003-07-14 2005-07-12 Vat Holding Ag Load-lock device for introducing substrates into a vacuum chamber
JP2005158926A (ja) 2003-11-25 2005-06-16 Canon Inc ロードロック装置および方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529448A (ja) * 1991-07-25 1993-02-05 Tokyo Electron Ltd 排気方法
JPH10173025A (ja) * 1996-12-16 1998-06-26 Kokusai Electric Co Ltd 半導体製造装置のロードロック室
JPH113867A (ja) * 1997-06-11 1999-01-06 Kokusai Electric Co Ltd 半導体製造装置
JP2001102281A (ja) * 1999-09-28 2001-04-13 Canon Inc ロードロック室、チャンバ、半導体製造装置およびデバイス製造方法
JP2003168712A (ja) * 2001-11-30 2003-06-13 Japan Steel Works Ltd:The ロードロック装置の基板搬送方法及びその装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015053391A1 (ja) * 2013-10-10 2015-04-16 日東電工株式会社 スパッタ装置およびスパッタ装置のフィルムロールの交換方法
JP2015074810A (ja) * 2013-10-10 2015-04-20 日東電工株式会社 スパッタ装置およびスパッタ装置のフィルムロールの交換方法
CN108352289A (zh) * 2015-11-20 2018-07-31 株式会社岛津制作所 真空处理装置和质谱分析仪

Also Published As

Publication number Publication date
US20050118002A1 (en) 2005-06-02
US20080003081A1 (en) 2008-01-03
US8347915B2 (en) 2013-01-08

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