JP2005109242A - 磁気抵抗効果素子及び磁気ヘッド - Google Patents
磁気抵抗効果素子及び磁気ヘッド Download PDFInfo
- Publication number
- JP2005109242A JP2005109242A JP2003342456A JP2003342456A JP2005109242A JP 2005109242 A JP2005109242 A JP 2005109242A JP 2003342456 A JP2003342456 A JP 2003342456A JP 2003342456 A JP2003342456 A JP 2003342456A JP 2005109242 A JP2005109242 A JP 2005109242A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- magnetoresistive effect
- effect element
- ferromagnetic
- domain wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000694 effects Effects 0.000 title claims abstract description 75
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 63
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 72
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000003302 ferromagnetic material Substances 0.000 claims description 17
- 239000011810 insulating material Substances 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 230000005381 magnetic domain Effects 0.000 abstract description 16
- 230000005415 magnetization Effects 0.000 description 19
- 238000000034 method Methods 0.000 description 14
- 230000035945 sensitivity Effects 0.000 description 12
- 230000008859 change Effects 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 9
- 229910003321 CoFe Inorganic materials 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000005290 antiferromagnetic effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910019233 CoFeNi Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005329 nanolithography Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
- G11B5/3912—Arrangements in which the active read-out elements are transducing in association with active magnetic shields, e.g. magnetically coupled shields
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Hall/Mr Elements (AREA)
- Magnetic Heads (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003342456A JP2005109242A (ja) | 2003-09-30 | 2003-09-30 | 磁気抵抗効果素子及び磁気ヘッド |
| US10/882,322 US7184247B2 (en) | 2003-09-30 | 2004-07-02 | Magnetoresistance effect element comprising nano-contact portion not more than a fermi length, method of manufacturing same and magnetic head utilizing same |
| US11/679,814 US7733611B2 (en) | 2003-09-30 | 2007-02-27 | Magnetoresistance effect element comprising nano-contact portion not more than a mean free path and magnetic head utilizing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003342456A JP2005109242A (ja) | 2003-09-30 | 2003-09-30 | 磁気抵抗効果素子及び磁気ヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005109242A true JP2005109242A (ja) | 2005-04-21 |
| JP2005109242A5 JP2005109242A5 (enExample) | 2006-11-16 |
Family
ID=34373500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003342456A Pending JP2005109242A (ja) | 2003-09-30 | 2003-09-30 | 磁気抵抗効果素子及び磁気ヘッド |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US7184247B2 (enExample) |
| JP (1) | JP2005109242A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011013249A1 (ja) * | 2009-07-31 | 2011-02-03 | 株式会社 東芝 | 磁気抵抗効果素子 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005109243A (ja) * | 2003-09-30 | 2005-04-21 | Tdk Corp | 磁気抵抗効果素子及び磁気ヘッド |
| JP4827839B2 (ja) * | 2004-06-21 | 2011-11-30 | ノキア コーポレイション | Hsdpa/f−dpchにおける失われたシグナリング接続のリカバリ方法 |
| US7356909B1 (en) * | 2004-09-29 | 2008-04-15 | Headway Technologies, Inc. | Method of forming a CPP magnetic recording head with a self-stabilizing vortex configuration |
| US7583482B2 (en) * | 2004-11-30 | 2009-09-01 | Tdk Corporation | Magnetoresistive element and magnetoresistive device having a free layer stabilized by an in-stack bias |
| JP2007220850A (ja) * | 2006-02-16 | 2007-08-30 | Fujitsu Ltd | 積層磁性膜および磁気ヘッド |
| JP2013033881A (ja) * | 2011-08-03 | 2013-02-14 | Sony Corp | 記憶素子及び記憶装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100225179B1 (ko) * | 1992-11-30 | 1999-10-15 | 니시무로 타이죠 | 박막 자기 헤드 및 자기 저항 효과형 헤드 |
| JP3293437B2 (ja) * | 1995-12-19 | 2002-06-17 | 松下電器産業株式会社 | 磁気抵抗効果素子、磁気抵抗効果型ヘッド及びメモリー素子 |
| US6590750B2 (en) * | 1996-03-18 | 2003-07-08 | International Business Machines Corporation | Limiting magnetoresistive electrical interaction to a preferred portion of a magnetic region in magnetic devices |
| KR100466975B1 (ko) * | 1996-05-28 | 2005-07-01 | 가부시키가이샤 시마쓰세사쿠쇼 | 자기저항효과소자, 자기저항효과형헤드, 메모리소자 및 그 제조방법 |
| JPH11510911A (ja) | 1996-06-12 | 1999-09-21 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 磁気抵抗式磁界センサ |
| US6052262A (en) * | 1997-03-14 | 2000-04-18 | Kabushiki Kaisha Toshiba | Magneto-resistance effect element and magnetic head |
| US6579635B2 (en) * | 2000-10-12 | 2003-06-17 | International Business Machines Corporation | Smoothing and stabilization of domain walls in perpendicularly polarized magnetic films |
| US6937446B2 (en) * | 2000-10-20 | 2005-08-30 | Kabushiki Kaisha Toshiba | Magnetoresistance effect element, magnetic head and magnetic recording and/or reproducing system |
| JP2002314168A (ja) * | 2001-04-18 | 2002-10-25 | Fujitsu Ltd | Cpp構造電磁変換素子およびその製造方法 |
| US6937447B2 (en) * | 2001-09-19 | 2005-08-30 | Kabushiki Kaisha Toshiba | Magnetoresistance effect element, its manufacturing method, magnetic reproducing element and magnetic memory |
| JP3967237B2 (ja) | 2001-09-19 | 2007-08-29 | 株式会社東芝 | 磁気抵抗効果素子及びその製造方法、磁気再生素子並びに磁気メモリ |
| US7035062B1 (en) * | 2001-11-29 | 2006-04-25 | Seagate Technology Llc | Structure to achieve sensitivity and linear density in tunneling GMR heads using orthogonal magnetic alignments |
| JP2003218425A (ja) * | 2002-01-18 | 2003-07-31 | Hitachi Ltd | 有限電圧下で高磁気抵抗率を示す強磁性トンネル接合素子、および、それを用いた強磁気抵抗効果型ヘッド、磁気ヘッドスライダ、ならびに磁気ディスク装置 |
| US6724652B2 (en) * | 2002-05-02 | 2004-04-20 | Micron Technology, Inc. | Low remanence flux concentrator for MRAM devices |
| JP4487472B2 (ja) * | 2002-07-05 | 2010-06-23 | 株式会社日立製作所 | 磁気抵抗効果素子、及びこれを備える磁気ヘッド、磁気記録装置、磁気メモリ |
| US7218484B2 (en) * | 2002-09-11 | 2007-05-15 | Kabushiki Kaisha Toshiba | Magnetoresistance effect element, magnetic head, and magnetic reproducing apparatus |
| JP2005109240A (ja) * | 2003-09-30 | 2005-04-21 | Tdk Corp | 磁気抵抗効果素子及び磁気ヘッド |
| US20050136600A1 (en) * | 2003-12-22 | 2005-06-23 | Yiming Huai | Magnetic elements with ballistic magnetoresistance utilizing spin-transfer and an MRAM device using such magnetic elements |
| JP2005191101A (ja) * | 2003-12-24 | 2005-07-14 | Tdk Corp | 磁気抵抗効果素子及び磁気ヘッド |
| ES2249974B1 (es) * | 2004-03-01 | 2007-06-01 | Consejo Sup. Investig. Cientificas | Dispositivo spintronico magnetoresistivo, su procedimiento de fabricacion y sus aplicaciones. |
-
2003
- 2003-09-30 JP JP2003342456A patent/JP2005109242A/ja active Pending
-
2004
- 2004-07-02 US US10/882,322 patent/US7184247B2/en not_active Expired - Fee Related
-
2007
- 2007-02-27 US US11/679,814 patent/US7733611B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011013249A1 (ja) * | 2009-07-31 | 2011-02-03 | 株式会社 東芝 | 磁気抵抗効果素子 |
| US8363362B2 (en) | 2009-07-31 | 2013-01-29 | Kabushiki Kaisha Toshiba | Magnetoresistive element |
Also Published As
| Publication number | Publication date |
|---|---|
| US7184247B2 (en) | 2007-02-27 |
| US20080247097A1 (en) | 2008-10-09 |
| US20050068689A1 (en) | 2005-03-31 |
| US7733611B2 (en) | 2010-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060927 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060927 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090113 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090512 |