JP2005050509A - 磁気記録ヘッド及び磁気記録装置 - Google Patents
磁気記録ヘッド及び磁気記録装置 Download PDFInfo
- Publication number
- JP2005050509A JP2005050509A JP2004212628A JP2004212628A JP2005050509A JP 2005050509 A JP2005050509 A JP 2005050509A JP 2004212628 A JP2004212628 A JP 2004212628A JP 2004212628 A JP2004212628 A JP 2004212628A JP 2005050509 A JP2005050509 A JP 2005050509A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- coil
- recording
- layer
- pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 338
- 238000000926 separation method Methods 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 38
- 239000003989 dielectric material Substances 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 25
- 230000008569 process Effects 0.000 abstract description 17
- 238000006748 scratching Methods 0.000 abstract description 3
- 230000002393 scratching effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 14
- 239000000725 suspension Substances 0.000 description 11
- 238000002955 isolation Methods 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910003321 CoFe Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
- G11B5/3136—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure for reducing the pole-tip-protrusion at the head transducing surface, e.g. caused by thermal expansion of dissimilar materials
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/012—Recording on, or reproducing or erasing from, magnetic disks
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/40—Protective measures on heads, e.g. against excessive temperature
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/629,060 US7079353B2 (en) | 2003-07-29 | 2003-07-29 | Magnetic head having a write coil structure with a reduced electrical resistance for reducing thermal protrusion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005050509A true JP2005050509A (ja) | 2005-02-24 |
| JP2005050509A5 JP2005050509A5 (https=) | 2007-08-30 |
Family
ID=33541470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004212628A Withdrawn JP2005050509A (ja) | 2003-07-29 | 2004-07-21 | 磁気記録ヘッド及び磁気記録装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7079353B2 (https=) |
| EP (1) | EP1503373B1 (https=) |
| JP (1) | JP2005050509A (https=) |
| KR (1) | KR20050013956A (https=) |
| CN (1) | CN1291379C (https=) |
| DE (1) | DE602004018715D1 (https=) |
| SG (1) | SG120168A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6947246B2 (en) * | 2003-08-29 | 2005-09-20 | Hitachi Global Storage Technologies Netherlands, B.V. | Large protrusion recording head for controlled magnetic spacing recording/reading |
| US7397625B2 (en) * | 2003-08-29 | 2008-07-08 | Hitachi Global Storage Technologies Netherlands B.V. | Large protrusion recording head for controlled magnetic spacing recording/reading |
| US7272883B2 (en) * | 2003-08-29 | 2007-09-25 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of forming an electrical connection in a magnetic head using a damascene process |
| US7199974B1 (en) * | 2004-02-02 | 2007-04-03 | Western Digital (Fremont), Inc. | Read/write head with reduced pole tip protrusion |
| JP2006120274A (ja) * | 2004-10-25 | 2006-05-11 | Hitachi Global Storage Technologies Netherlands Bv | 薄膜磁気ヘッド |
| JP2006252620A (ja) * | 2005-03-09 | 2006-09-21 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ヘッド及びその製造方法 |
| US7952375B2 (en) * | 2006-06-06 | 2011-05-31 | Formfactor, Inc. | AC coupled parameteric test probe |
| US7633710B2 (en) * | 2006-06-28 | 2009-12-15 | Hitachi Global Storage Technologies B.V. | Magnetic head having reduced induction coil electrical resistance and method for the fabrication thereof |
| US7804662B2 (en) * | 2006-12-26 | 2010-09-28 | Hitachi Global Storage Technologies Netherlands B.V. | Perpendicular magnetic recording head including wrap around shield with notched top write gap and method of fabricating the same |
| US7633711B2 (en) * | 2007-02-07 | 2009-12-15 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic write head with helical coil structure using multiple materials |
| US7835111B2 (en) * | 2007-02-15 | 2010-11-16 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic write head with upper return pole optimization for reduced trailing shield protrusion |
| US7440220B1 (en) | 2007-05-29 | 2008-10-21 | Western Digital (Fremont), Llc | Method for defining a touch-down power for head having a flying height actuator |
| US7436620B1 (en) | 2007-05-29 | 2008-10-14 | Western Digital (Fremont), Llc | Method for selecting an electrical power to be applied to a head-based flying height actuator |
| US8066892B2 (en) * | 2008-09-30 | 2011-11-29 | Hitachi Global Storage Technologies Netherlands B.V. | Method for manufacturing a perpendicular magnetic write head with a wrap around shield |
| US20100290157A1 (en) * | 2009-05-14 | 2010-11-18 | Western Digital (Fremont), Llc | Damascene coil processes and structures |
| US8681446B2 (en) | 2011-12-21 | 2014-03-25 | Seagate Technology Llc | Methods and devices including multiple resistive heating elements |
| CN102601097A (zh) * | 2012-03-01 | 2012-07-25 | 浙江工业大学 | 一种分离餐厨废弃物中固体杂质和油脂的装置和方法 |
| US8947807B2 (en) | 2012-12-20 | 2015-02-03 | Seagate Technology Llc | Independently driven write coils |
| US11393776B2 (en) * | 2018-05-17 | 2022-07-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| WO2021258303A1 (zh) * | 2020-06-23 | 2021-12-30 | 庆鼎精密电子(淮安)有限公司 | 相机模组及其制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US60879A (en) * | 1867-01-01 | Nicholas gotten | ||
| US174435A (en) * | 1876-03-07 | Improvement in wire-fence-barb formers | ||
| US5331495A (en) * | 1990-06-11 | 1994-07-19 | Fuji Photo Film Co., Ltd. | Thin film magnetic head and methods for producing same |
| US5173826A (en) * | 1991-06-03 | 1992-12-22 | Read-Rite Corp. | Thin film head with coils of varying thickness |
| US6043959A (en) * | 1998-03-23 | 2000-03-28 | Read-Rite Corporation | Inductive write head formed with flat yoke and merged with magnetoresistive read transducer |
| US6191918B1 (en) * | 1998-10-23 | 2001-02-20 | International Business Machines Corporation | Embedded dual coil planar structure |
| US6226149B1 (en) * | 1998-12-15 | 2001-05-01 | International Business Machines Corporation | Planar stitched write head having write coil insulated with inorganic insulation |
| JP2000268321A (ja) * | 1999-03-18 | 2000-09-29 | Alps Electric Co Ltd | 薄膜磁気ヘッド |
| US6466402B1 (en) * | 1999-06-18 | 2002-10-15 | Read-Rite Corporation | Compact MR write structure |
| US6396660B1 (en) * | 1999-08-23 | 2002-05-28 | Read-Rite Corporation | Magnetic write element having a thermally dissipative structure |
| US6452742B1 (en) * | 1999-09-02 | 2002-09-17 | Read-Rite Corporation | Thin film write having reduced resistance conductor coil partially recessed within middle coat insulation |
| JP2001076320A (ja) * | 1999-09-02 | 2001-03-23 | Tdk Corp | 薄膜磁気ヘッドおよびその製造方法 |
| US7023658B1 (en) * | 2000-02-08 | 2006-04-04 | Western Digital (Fremont), Inc. | Submicron track-width pole-tips for electromagnetic transducers |
| JP2001250203A (ja) * | 2000-03-08 | 2001-09-14 | Fujitsu Ltd | 薄膜磁気ヘッドの製造方法 |
| JP2002025006A (ja) * | 2000-07-11 | 2002-01-25 | Tdk Corp | 薄膜磁気ヘッド及び薄膜磁気ヘッドの製造方法 |
| JP2002157707A (ja) | 2000-11-21 | 2002-05-31 | Alps Electric Co Ltd | 薄膜磁気ヘッド |
| US7117583B2 (en) | 2002-03-18 | 2006-10-10 | International Business Machines Corporation | Method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure |
| US7035046B1 (en) * | 2002-03-19 | 2006-04-25 | Western Digital (Fremont), Inc. | System and method for minimizing thermal pole tip protrusion |
| US6927939B2 (en) * | 2003-01-30 | 2005-08-09 | Headway Technologies, Inc. | Thin-film magnetic head and method of manufacturing same |
-
2003
- 2003-07-29 US US10/629,060 patent/US7079353B2/en not_active Expired - Fee Related
-
2004
- 2004-06-30 SG SG200403776A patent/SG120168A1/en unknown
- 2004-07-19 DE DE602004018715T patent/DE602004018715D1/de not_active Expired - Fee Related
- 2004-07-19 EP EP04017016A patent/EP1503373B1/en not_active Expired - Lifetime
- 2004-07-21 JP JP2004212628A patent/JP2005050509A/ja not_active Withdrawn
- 2004-07-27 KR KR1020040058831A patent/KR20050013956A/ko not_active Ceased
- 2004-07-29 CN CNB200410059033XA patent/CN1291379C/zh not_active Expired - Fee Related
-
2006
- 2006-03-14 US US11/375,160 patent/US7190552B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1503373A1 (en) | 2005-02-02 |
| SG120168A1 (en) | 2006-03-28 |
| US7190552B2 (en) | 2007-03-13 |
| CN1291379C (zh) | 2006-12-20 |
| DE602004018715D1 (de) | 2009-02-12 |
| US20060152849A1 (en) | 2006-07-13 |
| KR20050013956A (ko) | 2005-02-05 |
| US7079353B2 (en) | 2006-07-18 |
| US20050024764A1 (en) | 2005-02-03 |
| CN1577494A (zh) | 2005-02-09 |
| EP1503373B1 (en) | 2008-12-31 |
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Legal Events
| Date | Code | Title | Description |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070718 |
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| A621 | Written request for application examination |
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| RD02 | Notification of acceptance of power of attorney |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20090511 |
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| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090519 |