KR20050013956A - 열에 의한 돌출을 감소시키기 위해 전기 저항이 낮은 기록코일 구조를 구비하는 자기 헤드 - Google Patents
열에 의한 돌출을 감소시키기 위해 전기 저항이 낮은 기록코일 구조를 구비하는 자기 헤드Info
- Publication number
- KR20050013956A KR20050013956A KR1020040058831A KR20040058831A KR20050013956A KR 20050013956 A KR20050013956 A KR 20050013956A KR 1020040058831 A KR1020040058831 A KR 1020040058831A KR 20040058831 A KR20040058831 A KR 20040058831A KR 20050013956 A KR20050013956 A KR 20050013956A
- Authority
- KR
- South Korea
- Prior art keywords
- magnetic
- coil
- recording
- layer
- pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 309
- 238000000926 separation method Methods 0.000 claims abstract description 32
- 239000000696 magnetic material Substances 0.000 claims abstract description 28
- 239000003989 dielectric material Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 26
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 230000001012 protector Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 22
- 230000008569 process Effects 0.000 abstract description 17
- 238000010438 heat treatment Methods 0.000 abstract description 16
- 238000006748 scratching Methods 0.000 abstract description 3
- 230000002393 scratching effect Effects 0.000 abstract description 3
- 239000000725 suspension Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 229910003321 CoFe Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
- G11B5/3136—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure for reducing the pole-tip-protrusion at the head transducing surface, e.g. caused by thermal expansion of dissimilar materials
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/012—Recording on, or reproducing or erasing from, magnetic disks
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/40—Protective measures on heads, e.g. against excessive temperature
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/629,060 | 2003-07-29 | ||
| US10/629,060 US7079353B2 (en) | 2003-07-29 | 2003-07-29 | Magnetic head having a write coil structure with a reduced electrical resistance for reducing thermal protrusion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050013956A true KR20050013956A (ko) | 2005-02-05 |
Family
ID=33541470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040058831A Ceased KR20050013956A (ko) | 2003-07-29 | 2004-07-27 | 열에 의한 돌출을 감소시키기 위해 전기 저항이 낮은 기록코일 구조를 구비하는 자기 헤드 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7079353B2 (https=) |
| EP (1) | EP1503373B1 (https=) |
| JP (1) | JP2005050509A (https=) |
| KR (1) | KR20050013956A (https=) |
| CN (1) | CN1291379C (https=) |
| DE (1) | DE602004018715D1 (https=) |
| SG (1) | SG120168A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6947246B2 (en) * | 2003-08-29 | 2005-09-20 | Hitachi Global Storage Technologies Netherlands, B.V. | Large protrusion recording head for controlled magnetic spacing recording/reading |
| US7397625B2 (en) * | 2003-08-29 | 2008-07-08 | Hitachi Global Storage Technologies Netherlands B.V. | Large protrusion recording head for controlled magnetic spacing recording/reading |
| US7272883B2 (en) * | 2003-08-29 | 2007-09-25 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of forming an electrical connection in a magnetic head using a damascene process |
| US7199974B1 (en) * | 2004-02-02 | 2007-04-03 | Western Digital (Fremont), Inc. | Read/write head with reduced pole tip protrusion |
| JP2006120274A (ja) * | 2004-10-25 | 2006-05-11 | Hitachi Global Storage Technologies Netherlands Bv | 薄膜磁気ヘッド |
| JP2006252620A (ja) * | 2005-03-09 | 2006-09-21 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ヘッド及びその製造方法 |
| US7952375B2 (en) * | 2006-06-06 | 2011-05-31 | Formfactor, Inc. | AC coupled parameteric test probe |
| US7633710B2 (en) * | 2006-06-28 | 2009-12-15 | Hitachi Global Storage Technologies B.V. | Magnetic head having reduced induction coil electrical resistance and method for the fabrication thereof |
| US7804662B2 (en) * | 2006-12-26 | 2010-09-28 | Hitachi Global Storage Technologies Netherlands B.V. | Perpendicular magnetic recording head including wrap around shield with notched top write gap and method of fabricating the same |
| US7633711B2 (en) * | 2007-02-07 | 2009-12-15 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic write head with helical coil structure using multiple materials |
| US7835111B2 (en) * | 2007-02-15 | 2010-11-16 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic write head with upper return pole optimization for reduced trailing shield protrusion |
| US7440220B1 (en) | 2007-05-29 | 2008-10-21 | Western Digital (Fremont), Llc | Method for defining a touch-down power for head having a flying height actuator |
| US7436620B1 (en) | 2007-05-29 | 2008-10-14 | Western Digital (Fremont), Llc | Method for selecting an electrical power to be applied to a head-based flying height actuator |
| US8066892B2 (en) * | 2008-09-30 | 2011-11-29 | Hitachi Global Storage Technologies Netherlands B.V. | Method for manufacturing a perpendicular magnetic write head with a wrap around shield |
| US20100290157A1 (en) * | 2009-05-14 | 2010-11-18 | Western Digital (Fremont), Llc | Damascene coil processes and structures |
| US8681446B2 (en) | 2011-12-21 | 2014-03-25 | Seagate Technology Llc | Methods and devices including multiple resistive heating elements |
| CN102601097A (zh) * | 2012-03-01 | 2012-07-25 | 浙江工业大学 | 一种分离餐厨废弃物中固体杂质和油脂的装置和方法 |
| US8947807B2 (en) | 2012-12-20 | 2015-02-03 | Seagate Technology Llc | Independently driven write coils |
| US11393776B2 (en) * | 2018-05-17 | 2022-07-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| WO2021258303A1 (zh) * | 2020-06-23 | 2021-12-30 | 庆鼎精密电子（淮安）有限公司 | 相机模组及其制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US60879A (en) * | 1867-01-01 | Nicholas gotten | ||
| US174435A (en) * | 1876-03-07 | Improvement in wire-fence-barb formers | ||
| US5331495A (en) * | 1990-06-11 | 1994-07-19 | Fuji Photo Film Co., Ltd. | Thin film magnetic head and methods for producing same |
| US5173826A (en) * | 1991-06-03 | 1992-12-22 | Read-Rite Corp. | Thin film head with coils of varying thickness |
| US6043959A (en) * | 1998-03-23 | 2000-03-28 | Read-Rite Corporation | Inductive write head formed with flat yoke and merged with magnetoresistive read transducer |
| US6191918B1 (en) * | 1998-10-23 | 2001-02-20 | International Business Machines Corporation | Embedded dual coil planar structure |
| US6226149B1 (en) * | 1998-12-15 | 2001-05-01 | International Business Machines Corporation | Planar stitched write head having write coil insulated with inorganic insulation |
| JP2000268321A (ja) * | 1999-03-18 | 2000-09-29 | Alps Electric Co Ltd | 薄膜磁気ヘッド |
| US6466402B1 (en) * | 1999-06-18 | 2002-10-15 | Read-Rite Corporation | Compact MR write structure |
| US6396660B1 (en) * | 1999-08-23 | 2002-05-28 | Read-Rite Corporation | Magnetic write element having a thermally dissipative structure |
| US6452742B1 (en) * | 1999-09-02 | 2002-09-17 | Read-Rite Corporation | Thin film write having reduced resistance conductor coil partially recessed within middle coat insulation |
| JP2001076320A (ja) * | 1999-09-02 | 2001-03-23 | Tdk Corp | 薄膜磁気ヘッドおよびその製造方法 |
| US7023658B1 (en) * | 2000-02-08 | 2006-04-04 | Western Digital (Fremont), Inc. | Submicron track-width pole-tips for electromagnetic transducers |
| JP2001250203A (ja) * | 2000-03-08 | 2001-09-14 | Fujitsu Ltd | 薄膜磁気ヘッドの製造方法 |
| JP2002025006A (ja) * | 2000-07-11 | 2002-01-25 | Tdk Corp | 薄膜磁気ヘッド及び薄膜磁気ヘッドの製造方法 |
| JP2002157707A (ja) | 2000-11-21 | 2002-05-31 | Alps Electric Co Ltd | 薄膜磁気ヘッド |
| US7117583B2 (en) | 2002-03-18 | 2006-10-10 | International Business Machines Corporation | Method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure |
| US7035046B1 (en) * | 2002-03-19 | 2006-04-25 | Western Digital (Fremont), Inc. | System and method for minimizing thermal pole tip protrusion |
| US6927939B2 (en) * | 2003-01-30 | 2005-08-09 | Headway Technologies, Inc. | Thin-film magnetic head and method of manufacturing same |
-
2003
- 2003-07-29 US US10/629,060 patent/US7079353B2/en not_active Expired - Fee Related
-
2004
- 2004-06-30 SG SG200403776A patent/SG120168A1/en unknown
- 2004-07-19 DE DE602004018715T patent/DE602004018715D1/de not_active Expired - Fee Related
- 2004-07-19 EP EP04017016A patent/EP1503373B1/en not_active Expired - Lifetime
- 2004-07-21 JP JP2004212628A patent/JP2005050509A/ja not_active Withdrawn
- 2004-07-27 KR KR1020040058831A patent/KR20050013956A/ko not_active Ceased
- 2004-07-29 CN CNB200410059033XA patent/CN1291379C/zh not_active Expired - Fee Related
-
2006
- 2006-03-14 US US11/375,160 patent/US7190552B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1503373A1 (en) | 2005-02-02 |
| SG120168A1 (en) | 2006-03-28 |
| US7190552B2 (en) | 2007-03-13 |
| CN1291379C (zh) | 2006-12-20 |
| DE602004018715D1 (de) | 2009-02-12 |
| JP2005050509A (ja) | 2005-02-24 |
| US20060152849A1 (en) | 2006-07-13 |
| US7079353B2 (en) | 2006-07-18 |
| US20050024764A1 (en) | 2005-02-03 |
| CN1577494A (zh) | 2005-02-09 |
| EP1503373B1 (en) | 2008-12-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20040727 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20080918 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20040727 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20091228 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20100315 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20091228 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |