|
US6863774B2
(en)
*
|
2001-03-08 |
2005-03-08 |
Raytech Innovative Solutions, Inc. |
Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
|
|
JP3895949B2
(ja)
*
|
2001-07-18 |
2007-03-22 |
株式会社東芝 |
Ｃｍｐ用スラリー、およびこれを用いた半導体装置の製造方法
|
|
JP3692109B2
(ja)
*
|
2002-10-24 |
2005-09-07 |
株式会社東芝 |
半導体装置の製造方法
|
|
US6918820B2
(en)
*
|
2003-04-11 |
2005-07-19 |
Eastman Kodak Company |
Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
|
|
KR100539983B1
(ko)
*
|
2003-05-15 |
2006-01-10 |
학교법인 한양학원 |
Ｃｍｐ용 세리아 연마제 및 그 제조 방법
|
|
JP3892846B2
(ja)
*
|
2003-11-27 |
2007-03-14 |
株式会社東芝 |
Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
|
|
CN1654617A
(zh)
*
|
2004-02-10 |
2005-08-17 |
捷时雅株式会社 |
清洗用组合物和半导体基板的清洗方法及半导体装置的制造方法
|
|
CN1667026B
(zh)
|
2004-03-12 |
2011-11-30 |
K.C.科技股份有限公司 |
抛光浆料及其制备方法和基板的抛光方法
|
|
US20060165615A1
(en)
*
|
2004-11-23 |
2006-07-27 |
Shende Rajesh V |
Non-oxidative tooth whiteners for dentifrice application
|
|
US20060118760A1
(en)
*
|
2004-12-03 |
2006-06-08 |
Yang Andy C |
Slurry composition and methods for chemical mechanical polishing
|
|
KR100959439B1
(ko)
|
2005-04-14 |
2010-05-25 |
미쓰이 가가쿠 가부시키가이샤 |
연마재 슬러리 및 이것을 사용한 연마재
|
|
KR100641348B1
(ko)
|
2005-06-03 |
2006-11-03 |
주식회사 케이씨텍 |
Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
|
|
US8551202B2
(en)
*
|
2006-03-23 |
2013-10-08 |
Cabot Microelectronics Corporation |
Iodate-containing chemical-mechanical polishing compositions and methods
|
|
JP4996874B2
(ja)
*
|
2006-04-17 |
2012-08-08 |
株式会社Ａｄｅｋａ |
金属ｃｍｐ用研磨組成物
|
|
JP4912791B2
(ja)
*
|
2006-08-21 |
2012-04-11 |
Ｊｓｒ株式会社 |
洗浄用組成物、洗浄方法及び半導体装置の製造方法
|
|
WO2008109270A1
(en)
*
|
2007-03-06 |
2008-09-12 |
Arkema France |
Abrasive formulation containing organic polymer particles
|
|
CN102677538B
(zh)
*
|
2007-06-18 |
2014-12-31 |
欧美诺华解决方案公司 |
纸涂布组合物、涂布纸和方法
|
|
KR100949250B1
(ko)
*
|
2007-10-10 |
2010-03-25 |
제일모직주식회사 |
금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
|
|
WO2010039574A1
(en)
|
2008-09-30 |
2010-04-08 |
The Procter & Gamble Company |
Liquid hard surface cleaning composition
|
|
WO2010039572A1
(en)
|
2008-09-30 |
2010-04-08 |
The Procter & Gamble Company |
Liquid hard surface cleaning composition
|
|
WO2010039571A1
(en)
|
2008-09-30 |
2010-04-08 |
The Procter & Gamble Company |
Liquid hard surface cleaning composition
|
|
JP5658276B2
(ja)
|
2009-12-22 |
2015-01-21 |
ザ プロクター アンド ギャンブルカンパニー |
液体クリーニング及び／又はクレンジング組成物
|
|
JP5559893B2
(ja)
|
2009-12-22 |
2014-07-23 |
ザ プロクター アンド ギャンブル カンパニー |
液体クリーニング及び／又はクレンジング組成物
|
|
EP2561056A1
(en)
|
2010-04-21 |
2013-02-27 |
The Procter & Gamble Company |
Liquid cleaning and/or cleansing composition
|
|
EP2431453B1
(en)
|
2010-09-21 |
2019-06-19 |
The Procter & Gamble Company |
Liquid cleaning and/or cleansing composition
|
|
EP2431451A1
(en)
|
2010-09-21 |
2012-03-21 |
The Procter & Gamble Company |
Liquid detergent composition with abrasive particles
|
|
WO2012040143A1
(en)
|
2010-09-21 |
2012-03-29 |
The Procter & Gamble Company |
Liquid cleaning composition
|
|
RU2566750C2
(ru)
|
2011-06-20 |
2015-10-27 |
Дзе Проктер Энд Гэмбл Компани |
Жидкий состав для чистки и/или глубокой очистки
|
|
US8852643B2
(en)
|
2011-06-20 |
2014-10-07 |
The Procter & Gamble Company |
Liquid cleaning and/or cleansing composition
|
|
CN103717726A
(zh)
|
2011-06-20 |
2014-04-09 |
宝洁公司 |
液体清洁和/或净化组合物
|
|
EP2537917A1
(en)
|
2011-06-20 |
2012-12-26 |
The Procter & Gamble Company |
Liquid detergent composition with abrasive particles
|
|
EP2719752B1
(en)
|
2012-10-15 |
2016-03-16 |
The Procter and Gamble Company |
Liquid detergent composition with abrasive particles
|
|
JP2014216464A
(ja)
*
|
2013-04-25 |
2014-11-17 |
日本キャボット・マイクロエレクトロニクス株式会社 |
スラリー組成物および基板研磨方法
|
|
WO2014208762A1
(ja)
*
|
2013-06-29 |
2014-12-31 |
Hoya株式会社 |
ガラス基板の製造方法及び磁気ディスクの製造方法、並びにガラス基板用研磨液組成物
|
|
CN103725256A
(zh)
*
|
2013-12-31 |
2014-04-16 |
上海集成电路研发中心有限公司 |
用于cmp的研磨颗粒体系及抛光液
|
|
US20160120786A1
(en)
*
|
2014-11-03 |
2016-05-05 |
L'oreal |
Use of specific acrylates copolymer as spf booster
|
|
US9957468B2
(en)
|
2015-11-06 |
2018-05-01 |
The Procter & Gamble Company |
Shaped particles
|
|
KR101943704B1
(ko)
*
|
2016-06-27 |
2019-01-29 |
삼성에스디아이 주식회사 |
금속막용 cmp 슬러리 조성물 및 연마 방법
|
|
KR102937492B1
(ko)
*
|
2019-10-24 |
2026-03-10 |
버슘머트리얼즈 유에스, 엘엘씨 |
높은 산화물 제거율을 지닌 얕은 트렌치 절연 화학 기계적 평탄화 조성물
|
|
IL293769A
(en)
*
|
2019-12-12 |
2022-08-01 |
Versum Mat Us Llc |
Chemical Mechanical Flattening in Shallow Channel Isolation with Low Level Oxide
|
|
US11254839B2
(en)
|
2019-12-12 |
2022-02-22 |
Versum Materials Us, Llc |
Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing
|