JP2004532521A5 - - Google Patents

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Publication number
JP2004532521A5
JP2004532521A5 JP2002579953A JP2002579953A JP2004532521A5 JP 2004532521 A5 JP2004532521 A5 JP 2004532521A5 JP 2002579953 A JP2002579953 A JP 2002579953A JP 2002579953 A JP2002579953 A JP 2002579953A JP 2004532521 A5 JP2004532521 A5 JP 2004532521A5
Authority
JP
Japan
Prior art keywords
weight
polishing composition
organic polymer
composition according
polymer particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002579953A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004532521A (ja
Filing date
Publication date
Priority claimed from US09/826,525 external-priority patent/US6568997B2/en
Priority claimed from US10/055,535 external-priority patent/US20020173243A1/en
Application filed filed Critical
Publication of JP2004532521A publication Critical patent/JP2004532521A/ja
Publication of JP2004532521A5 publication Critical patent/JP2004532521A5/ja
Pending legal-status Critical Current

Links

JP2002579953A 2001-04-05 2002-03-27 有機重合体粒子を有する研磨用組成物 Pending JP2004532521A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/826,525 US6568997B2 (en) 2001-04-05 2001-04-05 CMP polishing composition for semiconductor devices containing organic polymer particles
US10/055,535 US20020173243A1 (en) 2001-04-05 2002-01-23 Polishing composition having organic polymer particles
PCT/US2002/009805 WO2002081584A1 (en) 2001-04-05 2002-03-27 Polishing composition having organic polymer particles

Publications (2)

Publication Number Publication Date
JP2004532521A JP2004532521A (ja) 2004-10-21
JP2004532521A5 true JP2004532521A5 (https=) 2005-12-22

Family

ID=26734335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002579953A Pending JP2004532521A (ja) 2001-04-05 2002-03-27 有機重合体粒子を有する研磨用組成物

Country Status (5)

Country Link
US (1) US20020173243A1 (https=)
JP (1) JP2004532521A (https=)
KR (1) KR100864617B1 (https=)
TW (1) TW583294B (https=)
WO (1) WO2002081584A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
JP3895949B2 (ja) * 2001-07-18 2007-03-22 株式会社東芝 Ｃｍｐ用スラリー、およびこれを用いた半導体装置の製造方法
JP3692109B2 (ja) * 2002-10-24 2005-09-07 株式会社東芝 半導体装置の製造方法
US6918820B2 (en) * 2003-04-11 2005-07-19 Eastman Kodak Company Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
KR100539983B1 (ko) * 2003-05-15 2006-01-10 학교법인 한양학원 Ｃｍｐ용 세리아 연마제 및 그 제조 방법
JP3892846B2 (ja) * 2003-11-27 2007-03-14 株式会社東芝 Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
CN1654617A (zh) * 2004-02-10 2005-08-17 捷时雅株式会社 清洗用组合物和半导体基板的清洗方法及半导体装置的制造方法
CN1667026B (zh) 2004-03-12 2011-11-30 K.C.科技股份有限公司 抛光浆料及其制备方法和基板的抛光方法
US20060165615A1 (en) * 2004-11-23 2006-07-27 Shende Rajesh V Non-oxidative tooth whiteners for dentifrice application
US20060118760A1 (en) * 2004-12-03 2006-06-08 Yang Andy C Slurry composition and methods for chemical mechanical polishing
WO2006112377A1 (ja) 2005-04-14 2006-10-26 Mitsui Chemicals, Inc. 研磨材スラリーおよびこれを用いた研磨材
KR100641348B1 (ko) 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
US8551202B2 (en) * 2006-03-23 2013-10-08 Cabot Microelectronics Corporation Iodate-containing chemical-mechanical polishing compositions and methods
JP4996874B2 (ja) * 2006-04-17 2012-08-08 株式会社Ａｄｅｋａ 金属ｃｍｐ用研磨組成物
JP4912791B2 (ja) * 2006-08-21 2012-04-11 Ｊｓｒ株式会社 洗浄用組成物、洗浄方法及び半導体装置の製造方法
WO2008109270A1 (en) * 2007-03-06 2008-09-12 Arkema France Abrasive formulation containing organic polymer particles
CN101680192B (zh) * 2007-06-18 2012-07-11 欧美诺华解决方案公司 纸涂布组合物、涂布纸和方法
KR100949250B1 (ko) * 2007-10-10 2010-03-25 제일모직주식회사 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
WO2010039574A1 (en) 2008-09-30 2010-04-08 The Procter & Gamble Company Liquid hard surface cleaning composition
EP2328998A1 (en) 2008-09-30 2011-06-08 The Procter & Gamble Company Liquid hard surface cleaning composition
ES2582573T3 (es) 2008-09-30 2016-09-13 The Procter & Gamble Company Composiciones limpiadoras líquidas de superficies duras
WO2011087748A1 (en) 2009-12-22 2011-07-21 The Procter & Gamble Company Liquid cleaning and/or cleansing composition
JP5559893B2 (ja) 2009-12-22 2014-07-23 ザ プロクター アンド ギャンブル カンパニー 液体クリーニング及び／又はクレンジング組成物
EP2561056A1 (en) 2010-04-21 2013-02-27 The Procter & Gamble Company Liquid cleaning and/or cleansing composition
JP5702469B2 (ja) 2010-09-21 2015-04-15 ザ プロクター アンド ギャンブルカンパニー 液体洗浄組成物
EP2431452B1 (en) 2010-09-21 2015-07-08 The Procter & Gamble Company Liquid cleaning composition
EP2431451A1 (en) 2010-09-21 2012-03-21 The Procter & Gamble Company Liquid detergent composition with abrasive particles
EP2537917A1 (en) 2011-06-20 2012-12-26 The Procter & Gamble Company Liquid detergent composition with abrasive particles
JP6006306B2 (ja) 2011-06-20 2016-10-12 ザ プロクター アンド ギャンブル カンパニー 液体クリーニング及び／又はクレンジング組成物
US8852643B2 (en) 2011-06-20 2014-10-07 The Procter & Gamble Company Liquid cleaning and/or cleansing composition
JP2014520198A (ja) 2011-06-20 2014-08-21 ザ プロクター アンド ギャンブル カンパニー 液体クリーニング及び／又はクレンジング組成物
EP2719752B1 (en) 2012-10-15 2016-03-16 The Procter and Gamble Company Liquid detergent composition with abrasive particles
JP2014216464A (ja) * 2013-04-25 2014-11-17 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物および基板研磨方法
US10068602B2 (en) 2013-06-29 2018-09-04 Hoya Corporation Method for manufacturing glass substrate, method for manufacturing magnetic disk, and polishing liquid composition for glass substrate
CN103725256A (zh) * 2013-12-31 2014-04-16 上海集成电路研发中心有限公司 用于cmp的研磨颗粒体系及抛光液
US20160120786A1 (en) * 2014-11-03 2016-05-05 L'oreal Use of specific acrylates copolymer as spf booster
US9957468B2 (en) 2015-11-06 2018-05-01 The Procter & Gamble Company Shaped particles
KR101943704B1 (ko) * 2016-06-27 2019-01-29 삼성에스디아이 주식회사 금속막용 cmp 슬러리 조성물 및 연마 방법
WO2021081102A1 (en) * 2019-10-24 2021-04-29 Versum Materials Us, Llc High oxide removal rates shallow trench isolation chemical mechanical planarization compositions
US11254839B2 (en) 2019-12-12 2022-02-22 Versum Materials Us, Llc Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing
KR102939957B1 (ko) * 2019-12-12 2026-03-16 버슘머트리얼즈 유에스, 엘엘씨 산화물 트렌치 디싱이 낮은 얕은 트렌치 절연 화학 기계적 평탄화 연마

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100571892B1 (ko) * 1997-04-30 2006-04-18 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 반도체 웨이퍼 상부 표면의 평탄화 방법
KR100447551B1 (ko) * 1999-01-18 2004-09-08 가부시끼가이샤 도시바 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법
JP4075247B2 (ja) * 1999-09-30 2008-04-16 Ｊｓｒ株式会社 化学機械研磨用水系分散体

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