JP2005347579A5 - - Google Patents
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- Publication number
- JP2005347579A5 JP2005347579A5 JP2004166360A JP2004166360A JP2005347579A5 JP 2005347579 A5 JP2005347579 A5 JP 2005347579A5 JP 2004166360 A JP2004166360 A JP 2004166360A JP 2004166360 A JP2004166360 A JP 2004166360A JP 2005347579 A5 JP2005347579 A5 JP 2005347579A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- compound
- additive
- salt
- iminodiacetic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims 12
- 238000005498 polishing Methods 0.000 claims 10
- 239000003795 chemical substances by application Substances 0.000 claims 9
- 239000000654 additive Substances 0.000 claims 8
- 230000000996 additive effect Effects 0.000 claims 8
- 150000003839 salts Chemical group 0.000 claims 8
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 7
- 239000003082 abrasive agent Substances 0.000 claims 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229920003169 water-soluble polymer Polymers 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004166360A JP4641155B2 (ja) | 2004-06-03 | 2004-06-03 | 化学機械研磨用の研磨剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004166360A JP4641155B2 (ja) | 2004-06-03 | 2004-06-03 | 化学機械研磨用の研磨剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005347579A JP2005347579A (ja) | 2005-12-15 |
| JP2005347579A5 true JP2005347579A5 (https=) | 2007-06-28 |
| JP4641155B2 JP4641155B2 (ja) | 2011-03-02 |
Family
ID=35499655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004166360A Expired - Fee Related JP4641155B2 (ja) | 2004-06-03 | 2004-06-03 | 化学機械研磨用の研磨剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4641155B2 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006179845A (ja) * | 2004-11-26 | 2006-07-06 | Fuji Photo Film Co Ltd | 金属用研磨液及び研磨方法 |
| KR101406642B1 (ko) * | 2006-04-03 | 2014-06-11 | 제이에스알 가부시끼가이샤 | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법, 및화학 기계 연마용 수계 분산체를 제조하기 위한 키트 |
| WO2008117573A1 (ja) * | 2007-03-27 | 2008-10-02 | Jsr Corporation | 化学機械研磨用水系分散体、該水系分散体を調製するためのキット、化学機械研磨方法、および半導体装置の製造方法 |
| JP2010080864A (ja) * | 2008-09-29 | 2010-04-08 | Fujifilm Corp | 研磨液 |
| JP5397386B2 (ja) * | 2008-12-11 | 2014-01-22 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| JP5554121B2 (ja) * | 2010-03-31 | 2014-07-23 | 富士フイルム株式会社 | 研磨液及び研磨方法 |
| JP5648567B2 (ja) | 2010-05-07 | 2015-01-07 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| US8435896B2 (en) * | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
| US8440097B2 (en) * | 2011-03-03 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
| CN103917332A (zh) * | 2011-11-01 | 2014-07-09 | 旭硝子株式会社 | 玻璃基板的制造方法 |
| KR101480179B1 (ko) * | 2011-12-30 | 2015-01-09 | 제일모직주식회사 | Ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법 |
| JP6169938B2 (ja) * | 2013-10-04 | 2017-07-26 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP7619796B2 (ja) * | 2020-12-18 | 2025-01-22 | 山口精研工業株式会社 | フツリン酸ガラス用研磨剤組成物、及びフツリン酸ガラス用研磨剤組成物を用いた研磨方法 |
| CN113604154B (zh) * | 2021-07-09 | 2022-07-12 | 万华化学集团电子材料有限公司 | 一种钨插塞化学机械抛光液、制备方法及其应用 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017448A (ja) * | 2001-06-29 | 2003-01-17 | Sumitomo Chem Co Ltd | 金属研磨材、金属研磨組成物及び研磨方法 |
-
2004
- 2004-06-03 JP JP2004166360A patent/JP4641155B2/ja not_active Expired - Fee Related
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