JP2004523920A5 - - Google Patents

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Publication number
JP2004523920A5
JP2004523920A5 JP2002573499A JP2002573499A JP2004523920A5 JP 2004523920 A5 JP2004523920 A5 JP 2004523920A5 JP 2002573499 A JP2002573499 A JP 2002573499A JP 2002573499 A JP2002573499 A JP 2002573499A JP 2004523920 A5 JP2004523920 A5 JP 2004523920A5
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JP
Japan
Prior art keywords
heat transfer
electronic module
evaporator
transfer body
condenser
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Application number
JP2002573499A
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English (en)
Japanese (ja)
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JP4004963B2 (ja
JP2004523920A (ja
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Priority claimed from US09/811,827 external-priority patent/US6483705B2/en
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Publication of JP2004523920A publication Critical patent/JP2004523920A/ja
Publication of JP2004523920A5 publication Critical patent/JP2004523920A5/ja
Application granted granted Critical
Publication of JP4004963B2 publication Critical patent/JP4004963B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002573499A 2001-03-19 2002-03-12 冷却基板を有する電子装置及びその方法 Expired - Fee Related JP4004963B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,827 US6483705B2 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate and related methods
PCT/US2002/007417 WO2002076165A1 (en) 2001-03-19 2002-03-12 Electronic module including a cooling substrate and related methods

Publications (3)

Publication Number Publication Date
JP2004523920A JP2004523920A (ja) 2004-08-05
JP2004523920A5 true JP2004523920A5 (https=) 2005-06-02
JP4004963B2 JP4004963B2 (ja) 2007-11-07

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ID=25207701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002573499A Expired - Fee Related JP4004963B2 (ja) 2001-03-19 2002-03-12 冷却基板を有する電子装置及びその方法

Country Status (9)

Country Link
US (1) US6483705B2 (https=)
EP (1) EP1378153B1 (https=)
JP (1) JP4004963B2 (https=)
KR (1) KR100553171B1 (https=)
CN (1) CN1333627C (https=)
AU (1) AU2002254176B2 (https=)
CA (1) CA2440522C (https=)
NO (1) NO20034071L (https=)
WO (1) WO2002076165A1 (https=)

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