JP2004523919A5 - - Google Patents
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- Publication number
- JP2004523919A5 JP2004523919A5 JP2002573498A JP2002573498A JP2004523919A5 JP 2004523919 A5 JP2004523919 A5 JP 2004523919A5 JP 2002573498 A JP2002573498 A JP 2002573498A JP 2002573498 A JP2002573498 A JP 2002573498A JP 2004523919 A5 JP2004523919 A5 JP 2004523919A5
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- chamber
- cooling fluid
- condenser
- evaporator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/811,815 US6418019B1 (en) | 2001-03-19 | 2001-03-19 | Electronic module including a cooling substrate with fluid dissociation electrodes and related methods |
| PCT/US2002/007312 WO2002076164A2 (en) | 2001-03-19 | 2002-03-12 | Electronic module with fluid dissociation electrodes and methods |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004523919A JP2004523919A (ja) | 2004-08-05 |
| JP2004523919A5 true JP2004523919A5 (https=) | 2005-06-02 |
| JP3899034B2 JP3899034B2 (ja) | 2007-03-28 |
Family
ID=25207668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002573498A Expired - Fee Related JP3899034B2 (ja) | 2001-03-19 | 2002-03-12 | 流体解離電極を備えた冷却基板を含む電子モジュール及び関連する方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6418019B1 (https=) |
| EP (1) | EP1378154B1 (https=) |
| JP (1) | JP3899034B2 (https=) |
| KR (1) | KR100553172B1 (https=) |
| CN (1) | CN1253063C (https=) |
| AU (1) | AU2002306686B2 (https=) |
| CA (1) | CA2441124C (https=) |
| NO (1) | NO20034070L (https=) |
| WO (1) | WO2002076164A2 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110076A (ja) * | 2001-10-01 | 2003-04-11 | Fujitsu Ltd | 熱拡散器および放熱器 |
| US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
| US6639798B1 (en) * | 2002-06-24 | 2003-10-28 | Delphi Technologies, Inc. | Automotive electronics heat exchanger |
| JP2004037039A (ja) | 2002-07-05 | 2004-02-05 | Sony Corp | 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法 |
| US7108056B1 (en) * | 2002-10-18 | 2006-09-19 | Atec Advanced Thermal And Environmental Concepts | Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator |
| JP3896961B2 (ja) * | 2002-12-12 | 2007-03-22 | ソニー株式会社 | 熱輸送装置および熱輸送装置の製造方法 |
| US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
| DE102006011333A1 (de) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente |
| TW200848683A (en) * | 2007-03-08 | 2008-12-16 | Convergence Technologies Ltd | Heat transfer device |
| KR100891520B1 (ko) * | 2007-05-15 | 2009-04-06 | 주식회사 하이닉스반도체 | 열 순환 매체를 구비한 인쇄회로기판 및 그의 제조방법 |
| CN102423653A (zh) * | 2007-09-14 | 2012-04-25 | 株式会社爱德万测试 | 高级热控接口 |
| US8195118B2 (en) | 2008-07-15 | 2012-06-05 | Linear Signal, Inc. | Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals |
| KR200451800Y1 (ko) * | 2008-09-25 | 2011-01-12 | 홍순열 | 전자석을 이용한 핫 런너 밸브 게이트 장치의 와류방지 장치 |
| US8872719B2 (en) | 2009-11-09 | 2014-10-28 | Linear Signal, Inc. | Apparatus, system, and method for integrated modular phased array tile configuration |
| JPWO2011145618A1 (ja) * | 2010-05-19 | 2013-07-22 | 日本電気株式会社 | 沸騰冷却器 |
| US9360514B2 (en) * | 2012-04-05 | 2016-06-07 | Board Of Regents, The University Of Texas System | Thermal reliability testing systems with thermal cycling and multidimensional heat transfer |
| WO2017143587A1 (zh) | 2016-02-26 | 2017-08-31 | 华为技术有限公司 | 光组件封装结构、光组件、光模块及相关装置和系统 |
| CN113712333A (zh) | 2016-04-18 | 2021-11-30 | 史赛克公司 | 包括带有透明面罩及该面罩上的控制按钮的头罩的个人防护系统 |
| US10622282B2 (en) * | 2017-07-28 | 2020-04-14 | Qualcomm Incorporated | Systems and methods for cooling an electronic device |
| EP3454370B1 (en) * | 2017-09-11 | 2020-09-09 | Nokia Technologies Oy | Package, and method of manufacturing a package comprising an enclosure and an integrated circuit |
| US20190191589A1 (en) * | 2017-12-15 | 2019-06-20 | Google Llc | Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling |
| DE102020103028A1 (de) * | 2019-03-06 | 2020-09-10 | GM Global Technology Operations LLC | Verbundanordnungen zur thermischen kühlung von elektronischen bauteilen |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU883643A2 (ru) * | 1979-03-19 | 1981-11-23 | Институт Прикладной Физики Ан Мсср | Теплова труба с электрогидродинамическим генератором |
| US4220195A (en) * | 1979-05-24 | 1980-09-02 | The United States Of America As Represented By The Secretary Of The Navy | Ion drag pumped heat pipe |
| US4519447A (en) | 1980-08-04 | 1985-05-28 | Fine Particle Technology Corporation | Substrate cooling |
| US4833567A (en) | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
| US5199165A (en) | 1991-12-13 | 1993-04-06 | Hewlett-Packard Company | Heat pipe-electrical interconnect integration method for chip modules |
| US5216580A (en) | 1992-01-14 | 1993-06-01 | Sun Microsystems, Inc. | Optimized integral heat pipe and electronic circuit module arrangement |
| US5308920A (en) * | 1992-07-31 | 1994-05-03 | Itoh Research & Development Laboratory Co., Ltd. | Heat radiating device |
| US6056044A (en) * | 1996-01-29 | 2000-05-02 | Sandia Corporation | Heat pipe with improved wick structures |
| EP0833116A4 (en) * | 1996-04-15 | 2001-09-12 | Mitsubishi Electric Corp | WATER EVAPORATION COOLER WITH ELECTROLYTIC REACTION |
| TW346566B (en) * | 1996-08-29 | 1998-12-01 | Showa Aluminiun Co Ltd | Radiator for portable electronic apparatus |
-
2001
- 2001-03-19 US US09/811,815 patent/US6418019B1/en not_active Expired - Lifetime
-
2002
- 2002-03-12 AU AU2002306686A patent/AU2002306686B2/en not_active Ceased
- 2002-03-12 WO PCT/US2002/007312 patent/WO2002076164A2/en not_active Ceased
- 2002-03-12 CA CA2441124A patent/CA2441124C/en not_active Expired - Lifetime
- 2002-03-12 JP JP2002573498A patent/JP3899034B2/ja not_active Expired - Fee Related
- 2002-03-12 KR KR1020037012176A patent/KR100553172B1/ko not_active Expired - Lifetime
- 2002-03-12 EP EP02753609A patent/EP1378154B1/en not_active Expired - Lifetime
- 2002-03-12 CN CNB028069595A patent/CN1253063C/zh not_active Expired - Fee Related
-
2003
- 2003-09-15 NO NO20034070A patent/NO20034070L/no not_active Application Discontinuation
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