CN1253063C - 包括具有流体离解电极的冷却基底的电子组件及相关方法 - Google Patents

包括具有流体离解电极的冷却基底的电子组件及相关方法 Download PDF

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Publication number
CN1253063C
CN1253063C CNB028069595A CN02806959A CN1253063C CN 1253063 C CN1253063 C CN 1253063C CN B028069595 A CNB028069595 A CN B028069595A CN 02806959 A CN02806959 A CN 02806959A CN 1253063 C CN1253063 C CN 1253063C
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CN
China
Prior art keywords
cooling
cooling fluid
heat transfer
capillary
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028069595A
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English (en)
Chinese (zh)
Other versions
CN1498522A (zh
Inventor
史蒂文·斯奈德
查尔斯·牛顿
迈克尔·兰格
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Harrier Inc
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Harrier Inc
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Publication date
Application filed by Harrier Inc filed Critical Harrier Inc
Publication of CN1498522A publication Critical patent/CN1498522A/zh
Application granted granted Critical
Publication of CN1253063C publication Critical patent/CN1253063C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CNB028069595A 2001-03-19 2002-03-12 包括具有流体离解电极的冷却基底的电子组件及相关方法 Expired - Fee Related CN1253063C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,815 2001-03-19
US09/811,815 US6418019B1 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods

Publications (2)

Publication Number Publication Date
CN1498522A CN1498522A (zh) 2004-05-19
CN1253063C true CN1253063C (zh) 2006-04-19

Family

ID=25207668

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028069595A Expired - Fee Related CN1253063C (zh) 2001-03-19 2002-03-12 包括具有流体离解电极的冷却基底的电子组件及相关方法

Country Status (9)

Country Link
US (1) US6418019B1 (https=)
EP (1) EP1378154B1 (https=)
JP (1) JP3899034B2 (https=)
KR (1) KR100553172B1 (https=)
CN (1) CN1253063C (https=)
AU (1) AU2002306686B2 (https=)
CA (1) CA2441124C (https=)
NO (1) NO20034070L (https=)
WO (1) WO2002076164A2 (https=)

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* Cited by examiner, † Cited by third party
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JP2003110076A (ja) * 2001-10-01 2003-04-11 Fujitsu Ltd 熱拡散器および放熱器
US20040011509A1 (en) * 2002-05-15 2004-01-22 Wing Ming Siu Vapor augmented heatsink with multi-wick structure
US6639798B1 (en) * 2002-06-24 2003-10-28 Delphi Technologies, Inc. Automotive electronics heat exchanger
JP2004037039A (ja) * 2002-07-05 2004-02-05 Sony Corp 冷却装置、電子機器装置、表示装置及び冷却装置の製造方法
US7108056B1 (en) * 2002-10-18 2006-09-19 Atec Advanced Thermal And Environmental Concepts Slit-type restrictor for controlling flow delivery to electrohydrodynamic thin film evaporator
JP3896961B2 (ja) * 2002-12-12 2007-03-22 ソニー株式会社 熱輸送装置および熱輸送装置の製造方法
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
TW200848683A (en) * 2007-03-08 2008-12-16 Convergence Technologies Ltd Heat transfer device
KR100891520B1 (ko) 2007-05-15 2009-04-06 주식회사 하이닉스반도체 열 순환 매체를 구비한 인쇄회로기판 및 그의 제조방법
CN102423653A (zh) * 2007-09-14 2012-04-25 株式会社爱德万测试 高级热控接口
US8195118B2 (en) 2008-07-15 2012-06-05 Linear Signal, Inc. Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals
KR200451800Y1 (ko) * 2008-09-25 2011-01-12 홍순열 전자석을 이용한 핫 런너 밸브 게이트 장치의 와류방지 장치
US8872719B2 (en) 2009-11-09 2014-10-28 Linear Signal, Inc. Apparatus, system, and method for integrated modular phased array tile configuration
CN102869943A (zh) * 2010-05-19 2013-01-09 日本电气株式会社 沸腾冷却装置
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
EP3410165B1 (en) 2016-02-26 2021-01-06 Huawei Technologies Co., Ltd. Optical assembly packaging structure, optical assembly, optical module and related devices and systems
PL3445197T3 (pl) 2016-04-18 2020-06-15 Stryker Corporation System ochrony osobistej zawierający kaptur z przezroczystą osłoną twarzy
US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
EP3454370B1 (en) * 2017-09-11 2020-09-09 Nokia Technologies Oy Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
US20190191589A1 (en) * 2017-12-15 2019-06-20 Google Llc Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling
DE102020103028A1 (de) * 2019-03-06 2020-09-10 GM Global Technology Operations LLC Verbundanordnungen zur thermischen kühlung von elektronischen bauteilen

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU883643A2 (ru) * 1979-03-19 1981-11-23 Институт Прикладной Физики Ан Мсср Теплова труба с электрогидродинамическим генератором
US4220195A (en) * 1979-05-24 1980-09-02 The United States Of America As Represented By The Secretary Of The Navy Ion drag pumped heat pipe
US4519447A (en) 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4833567A (en) 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US5199165A (en) 1991-12-13 1993-04-06 Hewlett-Packard Company Heat pipe-electrical interconnect integration method for chip modules
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US6056044A (en) 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
WO1997039294A1 (en) * 1996-04-15 1997-10-23 Mitsubishi Denki Kabushiki Kaisha Water evaporation type cooling apparatus by means of electrolytic reaction
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus

Also Published As

Publication number Publication date
EP1378154A4 (en) 2009-05-06
JP2004523919A (ja) 2004-08-05
AU2002306686B2 (en) 2004-05-20
NO20034070D0 (no) 2003-09-15
EP1378154A2 (en) 2004-01-07
CA2441124C (en) 2011-10-04
NO20034070L (no) 2003-11-19
KR20030087646A (ko) 2003-11-14
WO2002076164A2 (en) 2002-09-26
KR100553172B1 (ko) 2006-02-21
JP3899034B2 (ja) 2007-03-28
WO2002076164A3 (en) 2002-11-14
EP1378154B1 (en) 2011-09-21
US6418019B1 (en) 2002-07-09
CN1498522A (zh) 2004-05-19
CA2441124A1 (en) 2002-09-26

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SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060419

Termination date: 20130312