五、新型說明： 【新型所屬之技術領域】 [0001] 本創作涉及一種散熱金屬基板’尤指一種具LED且能 有效降低LED高溫的金屬基板結構》 【先前技術】 [0002] 按，一般各發光二極體（Light Emitting Diode ’ LED)係建構在印刷電路上並且與印刷電路上的電路接 點電性連接，但由於印刷電路之導熱性較差，不利於發 光二極體之廢熱排玫，不但會因為所產生的高溫影響發· 光二極體模組之運作效能，更有可能因為發光二極體所 產生的高溫而造成相關元件耗損《對高功率LED而言，小 型化與多晶化是目前的趨勢，在散熱面積縮小與功率增 加的情況下’封裝面臨的熱傳導問題更加被受重視。 [0003] 而現今的高功率LED其封裝結構大部分採用，於LED 和金屬基板之間藉一LED封裝承載基板固定，由LED封裝 承載基板作為導熱媒介，然LED封裝承載基板之熱膨脹係 數遠大於LED晶片，LED晶片於工作時會因溫度升高而產 生内應力，導致LED晶片的損壞，因此如何解決上述習知 技術產生的問題，是目前業界極需解決的困難點》 【新型内容】 [0004] 本創作所要解決改良習用LED晶片易發生損壞的技術 問題，本創作提供一種「具LED的金屬基板結構改良」， 係將LED光源直接設置於金屬基板上，能快速排除LED所 產生之熱能，提升LED使用#命。 表單編號A0101 第3頁/共14頁 [0005]M423356 [0006] [0007] [0008] [0009} [0010] [0011] [0012] 為達前述本創作的目的，本創作採用的技術方案是 提供一種具LED的金屬基板結構改良，包括有一金屬基板 :一設置於該金屬基板之上表面的LED光源；至少一導線 架，該導線架設置於該金屬基板之上表面對應該LED光源 相對應位置，該導線架與該LED光源電性連接。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該LED光源係用打線（Wire Bonding)方式或覆 晶（Flip Chip)接合方式設置於該金屬基板上表面。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該LED光源設有與該導線架電性連接的引腳。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該導線架表面設有一絕緣層。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該絕緣層可為矽膠、陶磁或氧化銅。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該金屬基板為均熱板，該金屬基板具有一真空 腔體，該金屬基板進一步為高導熱之銅材質。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該真空腔體内部具有毛細結構及工作流體，其 中該毛細結構為金屬粉末所燒結而成之金屬粉末燒結柱 體及金屬粉末所喷塗於該均熱板内壁而形成之金屬粉末 薄膜；該工作流體為純水或超純水。 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該金屬基板之上表面塗佈一金屬層，該金屬層 表單编號A0101 第4頁/共14頁 為銀或錫。 [0013] 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該金屬基板之下表面上更設有一散熱器，該散 熱器具有複數散熱鰭片。 [0014] 進一步地，本創作所述的具LED的金屬基板結構改良 ，其中，該LED光源為集成式封裝製程。 [0015] 藉由上述技術方案，本創作相較於現有技術至少具 有下列優點： [0016] 1.本創作將LED封裝承載基板省略，而將LED光源直接 與設於金屬基板上，令LED所產生之熱能直接傳導至金屬 基板上，藉以達到迅速散逸熱能，亦可減少製作LED承載 基板之材料成本及程序。 [0017] 2.本創作在金屬基板之下表面更設有一散熱器，散熱 器具有複數散熱鰭片，可有效分散來自金屬基板所傳遞 之LED光源所產生的熱源。 【實施方式】 [0018] 藉由具體實施例配合所附的圖式詳加說明，當更容 易瞭解本創作之目的、技術内容、特點及其所達成之功 效。 [0019] 請參照第1及2圖所示，本創作之具LED的金屬基板姑 構改良，包括有 〆 [0020] 一金屬基板1，該金屬基板1為高導熱銅材質之均熱 板（Vapor Chamber)，均熱板具有一真空腔體（圖中未 表單編號A0101 第5頁/共14頁 M423356 示），而真空腔體内部具有毛細結構（圖中未示）及工作流 體（圖中未示），由於真空腔體内部具有以金屬粉末燒結 而成之粉末燒結柱體、及利用金屬粉末喷塗於均熱板内 壁而形成之金屬薄膜，真空腔體内部並注入工作流體， 即可藉由毛細結構來配合工作流體的受熱快速蒸發、冷 凝，達到儲熱及快速熱傳之功效，其中金屬粉末可為銅 粉，工作流體為純水或超純水；該金屬基板1周緣分佈有 複數個槽孔14。 [0021] 一設置於該金屬基板1之上表面11的LED光源2，該 LED光源2係採用集成式封裝製程LTCC(Low temperature co-fired ceramic) ， 為低溫共燒銀塊導熱陶究基 板的多晶陣列集成封裝，不僅可縮小LED光源2產品封裝 體積做到薄、輕，更能提高熱傳導，延長使用壽命；該 LED光源2係用打線（Wire Bonding)方式或覆晶（FI ip Chip)接合方式設置於上表面11，該LED光源2設有引腳 22 » [0022] 兩導線架3，該導線架3為疊層設置於金屬基板1之上 表面11對應該LED光源2相對應位置，該引腳22藉由打線 機（wire bonder)進行打線與該導線架3電性連接，使其 該些LED光源2通電作動，該導線架3除疊層面除外，其他 表面設有一絕緣層31，該絕緣層31可為具有高熱傳導性 的矽膠、陶磁或氧化銅，得以有效傳遞熱能至金屬基板1 ，能大幅的增加熱傳效率。 [0023] 請參照第1及2圖所示，故，本創作省略先前技術所 述之LED封裝承載基板，而係將LED光源2直接與金屬基板 表單编號A0101 第6頁/共14頁 [0024] [0024] [0025] [0026] [0027] 1之上表面11貼覆接觸，進而將LED光源2作動所產生之熱 能可直接傳導至金屬基板1，達到迅速散逸熱能之功效。 接續，請參照第3圖所示，為本創作一實施例之圖示 ，於該金屬基板1之上表面11可塗佈一為銀或錫材質之金 屬層13，以提高熱傳導效率。 請參照第4圖所示，本創作為了散逸金屬基板丨的熱 能’更在金屬基板1之下表面12上設有一散熱器4，散熱 器4具有複數散熱鰭片41，散熱器4上表面具有一嵌合金 屬基板1之凹部42，凹部42上分佈有對應複數個槽孔14之 固定孔421，散熱器4材質可選用銅、鐵、鋁等高導熱之 金屬所組成，藉由一如螺絲之鎖固元件5旋入複數個槽孔 14再穿過數固固定孔421，將金屬基板1與散熱器4加以鎖 固；而此些散熱鰭片41係發散由金屬基板i引導而來之該 LED光源2產生之熱源。 由於本創作有別於以往LED封裝結構大部分所採用金 屬承載基板、支架型、矽基板或陶瓷基板作為散熱媒介 的方式’而係省略承載基板直接將LED光源設置於均熱板 表面’能大幅的增加熱傳效率且可有效減少電路的損耗 〇 綜上所述’僅為本創作之較佳實施例而已，在不離 本創作精神之範圍’熟習此項技藝者憑之而作之各種變 化、修飾與應用，皆應涵蓋於本創作中，因此本創作的 保護範圍當視後附的申請專利範圍所界定者為準。 【圖式簡單說明】 表單坞號A0101 第7頁/共14頁 M423356 [0028] [0029] [0030] [0031] 第1圖：本創作之結構立體分解圖。 第2圖：本創作之結構立體組合圖。 第3圖：本創作一實施例之結構立體分解圖。 第4圖：本創作增設散熱器之結構立體分解圖。 【主要元件符號說明】 [0032] 1.金屬基板 11.上表面 [0033] 12.下表面 13.金屬層 [0034] 14.槽孔 2. L E D光源 [0035] 22.引腳 3.導線架 [0036] 31.絕緣層 4.散熱器 [0037] 41.散熱鰭片 42.凹部 [0038] 421.固定孔 5.鎖固元件 表單編號A0101 第8頁/共14頁V. New Description: [New Technology Field] [0001] The present invention relates to a heat-dissipating metal substrate, especially a metal substrate structure having an LED and capable of effectively reducing the high temperature of the LED. [Prior Art] [0002] The Light Emitting Diode (LED) is constructed on the printed circuit and electrically connected to the circuit contacts on the printed circuit. However, due to the poor thermal conductivity of the printed circuit, it is not suitable for the waste heat of the LED. Not only will the performance of the light-emitting diode module be affected by the high temperature generated, but it is also likely to cause loss of related components due to the high temperature generated by the light-emitting diode. For high-power LEDs, miniaturization and polycrystallization It is the current trend. In the case of shrinking heat dissipation area and increasing power, the heat conduction problem faced by the package is more valued. [0003] Most of today's high-power LEDs have a package structure that is fixed by an LED package carrier substrate between the LED and the metal substrate, and the LED package carrier substrate serves as a heat-conducting medium, and the thermal expansion coefficient of the LED package-bearing substrate is much larger than LED chips, LED chips will cause internal stress due to temperature rise during operation, resulting in damage to LED chips. Therefore, how to solve the problems caused by the above-mentioned conventional technologies is a difficult point that the industry needs to solve now. [New content] [ 0004] This creation is to solve the technical problem of improving the damage of the conventional LED chip. This creation provides a "improvement of the metal substrate structure with LED", which is to directly set the LED light source on the metal substrate, and can quickly eliminate the heat energy generated by the LED. , improve LED use #命. Form No. A0101 Page 3 of 14 [0005] M423356 [0007] [0008] [0010] [0012] [0012] For the purpose of the foregoing creation, the technical solution adopted by the present creation is Providing a metal substrate structure improvement with an LED, comprising: a metal substrate: an LED light source disposed on an upper surface of the metal substrate; at least one lead frame disposed on the upper surface of the metal substrate corresponding to the LED light source The lead frame is electrically connected to the LED light source. Further, the structure of the metal substrate with LEDs according to the present invention is improved, wherein the LED light source is disposed on the upper surface of the metal substrate by a wire bonding method or a flip chip bonding method. Further, the LED substrate having the LED structure is improved, wherein the LED light source is provided with a pin electrically connected to the lead frame. Further, the structure of the metal substrate with LED described in the present invention is improved, wherein the surface of the lead frame is provided with an insulating layer. Further, the structure of the metal substrate with LED described in the present invention is improved, wherein the insulating layer may be tantalum, ceramic or copper oxide. Further, the structure of the metal substrate with LEDs according to the present invention is improved, wherein the metal substrate is a heat equalizing plate, and the metal substrate has a vacuum cavity, and the metal substrate is further made of a material having high thermal conductivity. Further, the structure of the metal substrate with LED according to the present invention is improved, wherein the vacuum chamber has a capillary structure and a working fluid therein, wherein the capillary structure is a metal powder sintered cylinder and metal powder sintered by metal powder. a metal powder film formed by spraying the inner wall of the heat equalizing plate; the working fluid is pure water or ultrapure water. Further, the structure of the metal substrate with LEDs according to the present invention is improved, wherein a surface of the metal substrate is coated with a metal layer, the metal layer form number A0101, page 4 of 14 is silver or tin. [0013] Further, the metal substrate structure with LEDs according to the present invention is improved, wherein a heat sink is further disposed on a lower surface of the metal substrate, and the heat sink has a plurality of heat dissipation fins. [0014] Further, the structure of the metal substrate with LEDs according to the present invention is improved, wherein the LED light source is an integrated packaging process. [0015] With the above technical solution, the present invention has at least the following advantages compared with the prior art: [0016] 1. This creation omits the LED package carrier substrate, and directly sets the LED light source on the metal substrate, so that the LED The generated heat energy is directly transmitted to the metal substrate, thereby achieving rapid dissipation of heat energy, and also reducing the material cost and procedure for fabricating the LED carrier substrate. [0017] 2. The present invention is further provided with a heat sink on the lower surface of the metal substrate, and the heat sink has a plurality of heat dissipation fins, which can effectively disperse the heat source generated by the LED light source transmitted from the metal substrate. [Embodiment] [0018] The purpose, technical content, features, and effects achieved by the present invention are more readily understood by the detailed description of the specific embodiments and the accompanying drawings. [0019] Please refer to FIGS. 1 and 2, the LED substrate of the present invention is improved, including a metal substrate 1 which is a heat conductive plate of high thermal conductivity copper material ( Vapor Chamber), the soaking plate has a vacuum chamber (not shown in the figure No. A0101, page 5 / 14 pages, M423356), and the inside of the vacuum chamber has a capillary structure (not shown) and working fluid (in the figure) (not shown), since the vacuum chamber has a powder sintered column formed by sintering metal powder and a metal film formed by spraying metal powder on the inner wall of the heat equalizing plate, and the working fluid is injected into the vacuum chamber. The capillary structure is combined with the rapid evaporation and condensation of the working fluid to achieve heat storage and rapid heat transfer. The metal powder can be copper powder, and the working fluid is pure water or ultrapure water; A plurality of slots 14. [0021] An LED light source 2 disposed on the upper surface 11 of the metal substrate 1, the LED light source 2 is an integrated package process LTCC (Low temperature co-fired ceramic), which is a low temperature co-fired silver block thermal conductive ceramic substrate The crystal array integrated package can not only reduce the LED light source 2 product packaging volume to be thin and light, but also improve heat conduction and extend the service life; the LED light source 2 is wired or bonded (FI ip Chip). The LED light source 2 is disposed on the upper surface 11 , and the LED light source 2 is provided with a lead 22 » [0022] two lead frames 3 , and the lead frame 3 is disposed on the upper surface 11 of the metal substrate 1 corresponding to the corresponding position of the LED light source 2 , The lead pin 22 is electrically connected to the lead frame 3 by wire bonding, and the LED light source 2 is electrically operated. The lead frame 3 is provided with an insulating layer 31 except for the lamination surface. The insulating layer 31 can be made of tantalum, ceramic or copper oxide having high thermal conductivity, and can effectively transfer thermal energy to the metal substrate 1, which can greatly increase heat transfer efficiency. [0023] Please refer to FIGS. 1 and 2, therefore, the present invention omits the LED package carrier substrate described in the prior art, and the LED light source 2 is directly connected to the metal substrate form number A0101 page 6 / 14 pages [ [0027] [0027] [0027] 1 The upper surface 11 is in contact with the contact surface, and the thermal energy generated by the operation of the LED light source 2 can be directly transmitted to the metal substrate 1 to achieve the effect of rapidly dissipating thermal energy. For the continuation, please refer to FIG. 3, which is an illustration of an embodiment of the present invention. A metal layer 13 made of silver or tin may be coated on the upper surface 11 of the metal substrate 1 to improve heat transfer efficiency. Referring to FIG. 4, in order to dissipate the thermal energy of the metal substrate, a heat sink 4 is disposed on the lower surface 12 of the metal substrate 1. The heat sink 4 has a plurality of heat dissipation fins 41, and the upper surface of the heat sink 4 has a concave portion 42 of the metal substrate 1 is disposed, and a fixing hole 421 corresponding to the plurality of slots 14 is disposed on the concave portion 42. The material of the heat sink 4 can be composed of a metal with high thermal conductivity such as copper, iron or aluminum, as a screw. The locking component 5 is screwed into the plurality of slots 14 and then passed through the plurality of fixing holes 421 to lock the metal substrate 1 and the heat sink 4; and the heat dissipating fins 41 are diverged and guided by the metal substrate i. The heat source generated by the LED light source 2. Since this creation is different from the conventional method of using a metal carrier substrate, a bracket type, a ruthenium substrate or a ceramic substrate as a heat dissipation medium for the LED package structure, the omitting the carrier substrate directly sets the LED light source on the surface of the heat equalization plate can be greatly Increasing the heat transfer efficiency and effectively reducing the loss of the circuit. In summary, the present invention is only a preferred embodiment of the present invention, and is not subject to the spirit of the present invention, and is familiar with the various changes made by the skilled person. Modifications and applications are to be covered in this creation, so the scope of protection of this creation is subject to the definition of the scope of the patent application. [Simple description of the drawing] Form dock number A0101 Page 7 of 14 M423356 [0028] [0030] [0031] FIG. 1 is an exploded perspective view of the structure of the present creation. Figure 2: The three-dimensional combination of the structure of the creation. Fig. 3 is a perspective exploded view showing the structure of an embodiment of the present invention. Figure 4: The stereoscopic exploded view of the structure of the radiator is added to this creation. [Description of main component symbols] [0032] 1. Metal substrate 11. Upper surface [0033] 12. Lower surface 13. Metal layer [0034] 14. Slot 2. LED light source [0035] 22. Pin 3. Lead frame [0036] 31. Insulation layer 4. Heat sink [0037] 41. Heat sink fins 42. Recesses [0038] 421. Fixing holes 5. Locking element form number A0101 Page 8 of 14